公开(公告)号：US10580984B2

公开(公告)日：2020-03-03

申请号：US16202579

申请日：2018-11-28

Applicant: Universal Display Corporation

Inventor： William E. Quinn ,  Siddharth Harikrishna Mohan ,  Gregory McGraw ,  Xin Xu

IPC: H01L21/00 ,  H01L51/00 ,  C23C14/24 ,  C23C14/12 ,  C23C14/04 ,  C23C14/54 ,  B41J2/14 ,  B41M3/00 ,  H01L51/56 ,  H01L51/50

Abstract: Methods and devices for controlling pressures in microenvironments between a deposition apparatus and a substrate are provided. Each microenvironment is associated with an aperture of the deposition apparatus which can allow for control of the microenvironment.

公开(公告)号：US20190221771A1

公开(公告)日：2019-07-18

申请号：US16361317

申请日：2019-03-22

Applicant: Universal Display Corporation

Inventor： Siddharth Harikrishna Mohan ,  William E. Quinn ,  James Robert Kantor

IPC: H01L51/52

CPC classification number: H01L51/5253 ,  H01L2251/303

Abstract: A buffer layer is provided that can be fabricated over an OLED without the use of any oxygen-containing gas. The buffer layer reduces the possibility of damage to the underlying OLED due to use of oxygen-containing materials during deposition of subsequent barrier layers, and thereby allows for deposition of barrier layers without reducing the flexibility of the device.

公开(公告)号：US10170701B2

公开(公告)日：2019-01-01

申请号：US15449946

申请日：2017-03-04

Applicant: Universal Display Corporation

Inventor： William E. Quinn ,  Siddharth Harikrishna Mohan ,  Gregory McGraw ,  Xin Xu

IPC: H01L21/31 ,  H01L51/00 ,  C23C14/24 ,  C23C14/12 ,  C23C14/04

Abstract: Methods and devices for controlling pressures in microenvironments between a deposition apparatus and a substrate are provided. Each microenvironment is associated with an aperture of the deposition apparatus which can allow for control of the microenvironment.

公开(公告)号：US20180029050A1

公开(公告)日：2018-02-01

申请号：US15723343

申请日：2017-10-03

Applicant: Universal Display Corporation

Inventor： Siddharth Harikrishna Mohan ,  Paul E. Burrows

IPC: B05B1/34 ,  B05D1/00 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/0008 ,  B05B1/3402 ,  H01L51/56

Abstract: Nozzle designs which have been found to be effective in governing overspray in OVJP are provided. Aspects of the invention have been found to be effective in reducing or avoiding sudden pressure drops at the end of the nozzle close to the substrate, and may be advantageously employed in obtaining, for example, greater consistency between the nozzle outlet diameter and the deposited pattern width.

公开(公告)号：US09647221B2

公开(公告)日：2017-05-09

申请号：US14695833

申请日：2015-04-24

Applicant: Universal Display Corporation

Inventor： Raymond Kwong ,  Chuanjun Xia ,  Siddharth Harikrishna Mohan ,  Kwang-Ohk Cheon ,  Jason Brooks

IPC: H01L51/00 ,  C07F7/02 ,  C07F7/28 ,  C07F9/00 ,  C07F11/00 ,  H01L51/50 ,  H01L51/56

CPC classification number: H01L51/0094 ,  C07F7/025 ,  C07F7/28 ,  C07F9/005 ,  C07F11/005 ,  H01L51/0003 ,  H01L51/0032 ,  H01L51/0051 ,  H01L51/0059 ,  H01L51/006 ,  H01L51/0061 ,  H01L51/0084 ,  H01L51/5012 ,  H01L51/5016 ,  H01L51/5056 ,  H01L51/5072 ,  H01L51/5088 ,  H01L51/5092 ,  H01L51/56 ,  H01L2251/303 ,  H01L2251/558 ,  Y10T428/31678

Abstract: Organic electronic devices comprising a covalently bonded organic/inorganic composite layer. The composite layer may be formed by the reaction of a metal alkoxide with a charge transport compound having one or more hydroxyl groups. Examples of metal alkoxides that can be used include vanadium alkoxides, molybdenum alkoxides, titanium alkoxides, or silicon alkoxides. This composite layer can be used for any of the various charge conducting layers in an organic electronic device, including the hole injection layer.

公开(公告)号：US09583707B2

公开(公告)日：2017-02-28

申请号：US14858840

申请日：2015-09-18

Applicant: Universal Display Corporation

Inventor： William E. Quinn ,  Gregory McGraw ,  Siddharth Harikrishna Mohan ,  Matthew King ,  Elliot H. Hartford, Jr.

IPC: H01L51/00 ,  B41J2/16 ,  C23C14/22 ,  C23C14/12 ,  C23C14/24 ,  B41J2/14 ,  H01L51/50

CPC classification number: H01L51/56 ,  B05B15/555 ,  B41J2/1433 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2002/14475 ,  C23C14/12 ,  C23C14/22 ,  C23C14/228 ,  C23C14/24 ,  H01L51/0004 ,  H01L51/0005 ,  H01L51/50

Abstract: Embodiments of the disclosed subject matter provide a nozzle assembly and method of making the same, the nozzle assembly including a first aperture formed on a first aperture plate to eject a carrier gas flow having organic vapor onto a substrate in a deposition chamber, second apertures formed on a second aperture plate disposed adjacent to the first aperture to form a vacuum aperture, where the first aperture plate and the second aperture plate are separated by a first separator plate, third apertures formed on a third aperture plate to eject purge gas that are disposed adjacent to the second aperture plate, where the second aperture plate and the third aperture plate are separated by second separator plate, and a third separator plate is disposed adjacent to the one or more third aperture plates to form a gas channel in the one or more third aperture plates.

Abstract translation: 所公开的主题的实施例提供了一种喷嘴组件及其制造方法，喷嘴组件包括形成在第一孔板上的第一孔，以将具有有机蒸汽的载气流喷射到沉积室中的基底上，形成第二孔 在与所述第一孔相邻设置的第二孔板上形成真空孔，其中所述第一孔板和所述第二孔板由第一隔板隔开，所述第三孔形成在第三孔板上以排出所设置的吹扫气体 邻近所述第二孔板，其中所述第二孔板和所述第三孔板由第二隔板隔开，并且第三隔离板邻近所述一个或多个第三孔板设置，以在所述一个或多个孔板中形成气体通道 第三孔板。

公开(公告)号：US11976360B2

公开(公告)日：2024-05-07

申请号：US18099339

申请日：2023-01-20

Applicant: Universal Display Corporation

Inventor： Gregory McGraw ,  William E. Quinn ,  Gregg Kottas ,  Siddharth Harikrishna Mohan ,  Matthew King

IPC: C23C16/455 ,  B41J2/00 ,  C23C14/12 ,  C23C14/24 ,  H10K71/13

CPC classification number: C23C16/45563 ,  B41J2/00 ,  C23C14/12 ,  C23C14/24 ,  C23C14/243 ,  C23C16/45519 ,  H10K71/135

Abstract: Systems and techniques for depositing organic material on a substrate are provided, in which one or more shield gas flows prevents contamination of the substrate by the chamber ambient. Thus, multiple layers of the same or different materials may be deposited in a single deposition chamber, without the need for movement between different deposition chambers, and with reduced chance of cross-contamination between layers.

公开(公告)号：US11761076B2

公开(公告)日：2023-09-19

申请号：US17306665

申请日：2021-05-03

Applicant: The Regents of the University of Michigan ,  Universal Display Corporation

Inventor： Stephen Forrest ,  Gregory McGraw ,  Siddharth Harikrishna Mohan ,  Diane L. Peters

IPC: C23C14/12 ,  C23C14/22 ,  C23C14/24

CPC classification number: C23C14/12 ,  C23C14/228 ,  C23C14/243 ,  Y10T137/85938

Abstract: A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.

公开(公告)号：US11751468B2

公开(公告)日：2023-09-05

申请号：US17380169

申请日：2021-07-20

Applicant: Universal Display Corporation

Inventor： William E. Quinn ,  Siddharth Harikrishna Mohan ,  Gregory McGraw ,  Xin Xu

IPC: H10K71/12 ,  C23C14/24 ,  C23C14/12 ,  C23C14/04 ,  C23C14/54 ,  H10K71/00 ,  H10K71/18 ,  B41J2/14 ,  B41M3/00 ,  H10K50/11 ,  H10K101/30 ,  H10K101/40

CPC classification number: H10K71/12 ,  B41J2/14 ,  B41M3/006 ,  C23C14/042 ,  C23C14/12 ,  C23C14/24 ,  C23C14/54 ,  H10K71/00 ,  H10K71/18 ,  H10K50/11 ,  H10K2101/30 ,  H10K2101/40

Abstract: Methods and devices for controlling pressures in microenvironments between a deposition apparatus and a substrate are provided. Each microenvironment is associated with an aperture of the deposition apparatus which can allow for control of the microenvironment.

公开(公告)号：US11751426B2

公开(公告)日：2023-09-05

申请号：US15787117

申请日：2017-10-18

Applicant: Universal Display Corporation

Inventor： Siddharth Harikrishna Mohan ,  William E. Quinn ,  Arpit Patel ,  James Robert Kantor

IPC: H10K50/844 ,  H10K71/00 ,  H10K77/10 ,  H10K102/00

CPC classification number: H10K50/8445 ,  H10K71/00 ,  H10K77/111 ,  H10K2102/311 ,  H10K2102/351 ,  Y02E10/549

Abstract: A hybrid permeation barrier having two complementary layers is disclosed. The barrier includes a first layer with a relatively high stress-thickness in the range of −1000 MPa-μm to −200 MPa-μm and a second layer with a relatively low stress-thickness in the range −150 MPa-μm to 300 MPa-μm. The second layer compensates for the stress caused by the first, thereby allowing for a barrier that provides good permeation without causing failure of the device due to delamination.