公开(公告)号：US20110037178A1

公开(公告)日：2011-02-17

申请号：US12850201

申请日：2010-08-04

Applicant: Xiaobing Sun ,  Yaqiong Zhang ,  Yugang Ma

Inventor： Xiaobing Sun ,  Yaqiong Zhang ,  Yugang Ma

IPC: H01L23/48 ,  H01B5/00

CPC classification number: H01L24/48 ,  H01L23/66 ,  H01L24/49 ,  H01L24/50 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/05553 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/49052 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19033 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An integrated circuit connection is disclosed. The integrated circuit connection comprises a substrate 221, a first and a second transmission line 205, 203, a die 219, and a conductive ribbon 207. The first transmission line 205 has a first termination 215 and is arranged on the substrate 221. The die 219 is spaced from the first termination 215, and has a first surface which is arranged on the substrate 221 and a second opposed surface on which the second transmission line 203 is arranged. The second transmission line 203 has a second termination 211, and the conductive ribbon 207 electrically couples the first and the second termination 215, 211. A conductive ribbon 215 for use in an integrated circuit 201 is also disclosed.

Abstract translation: 公开了一种集成电路连接。 集成电路连接包括基板221，第一和第二传输线205,203，管芯219和导电带207.第一传输线205具有第一端接215并布置在基板221上。 219与第一终端215间隔开，并且具有布置在基板221上的第一表面和布置有第二传输线203的第二相对表面。 第二传输线203具有第二终端211，并且导电带207电耦合第一和第二端接215,211。还公开了用于集成电路201的导电带215。