公开(公告)号：US20130141389A1

公开(公告)日：2013-06-06

申请号：US13448411

申请日：2012-04-17

申请人： Chia-Te Chou ,  Shou-Te Wei ,  Chun-Wei Wang

发明人： Chia-Te Chou ,  Shou-Te Wei ,  Chun-Wei Wang

IPC分类号： G06F3/042

CPC分类号： G06F3/0418 ,  G06F3/0425

摘要： A portable optical touch system is disclosed in the present invention. The portable optical touch system includes two camera devices movably connected with each other and respectively disposed on two corners of a plane. Each camera device includes an imaging module for capturing an image of an object on the screen, an adjusting module connected to the imaging module for determining whether the two imaging modules are positioned on the same plane, and a measuring module connected to the imaging module for calculating a distance between the two imaging modules. The portable optical touch system further includes a controlling unit electrically connected to the camera device for calculating a coordinates of the object on the plane by analyzing the distance between the imaging modules and the images captured by the imaging modules.

摘要翻译： 在本发明中公开了便携式光学触摸系统。 便携式光学触摸系统包括彼此可移动地连接并分别设置在平面的两个角上的两个相机装置。 每个相机装置包括用于捕获屏幕上的对象的图像的成像模块，连接到成像模块的用于确定两个成像模块是否位于同一平面上的调整模块，以及连接到成像模块的测量模块， 计算两个成像模块之间的距离。 便携式光学触摸系统还包括电连接到相机装置的控制单元，用于通过分析成像模块与由成像模块捕获的图像之间的距离来计算平面上的对象的坐标。

公开(公告)号：US08022426B2

公开(公告)日：2011-09-20

申请号：US12429190

申请日：2009-04-24

申请人： Chung-Min Chang ,  Tung-An Chen ,  Chun-Wei Wang

发明人： Chung-Min Chang ,  Tung-An Chen ,  Chun-Wei Wang

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2933/0091 ,  H01L2924/00 ,  H01L2924/00014

摘要： An exemplary color mixing light emitting diode (LED) device includes a substrate, LED dies, an encapsulating body, and a light mixing structure. The substrate has a main surface. The LED dies are arranged adjacent the main surface of the substrate. The light mixing structure is arranged adjacent an outer portion of the main surface of the substrate, around the LED dies. The encapsulating body encapsulates the LED dies and the light mixing structure. The light mixing structure is made of light transmissive material, and the light mixing structure has light scattering particles doped therein.

摘要翻译： 示例性的混色发光二极管（LED）装置包括基板，LED管芯，封装体和光混合结构。 基板具有主表面。 LED管芯相邻于衬底的主表面布置。 光混合结构邻近于基板的主表面的外部部分设置在LED管芯周围。 封装体封装LED管芯和光混合结构。 光混合结构由透光材料制成，并且光混合结构中掺杂有光散射颗粒。

公开(公告)号：USD637980S1

公开(公告)日：2011-05-17

申请号：US29367252

申请日：2010-08-05

申请人： Bo-Yu Ko ,  Ya-Hsien Chang ,  Chun-Wei Wang

设计人： Bo-Yu Ko ,  Ya-Hsien Chang ,  Chun-Wei Wang

公开(公告)号：US07909476B2

公开(公告)日：2011-03-22

申请号：US12192382

申请日：2008-08-15

申请人： Chun-Wei Wang ,  Hung-Kuang Hsu

发明人： Chun-Wei Wang ,  Hung-Kuang Hsu

IPC分类号： F21V9/16

CPC分类号： F21K9/00 ,  F21V9/30 ,  F21Y2115/10 ,  H01L33/505 ,  H01L33/508 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light source module of light emitting diode includes a substrate having circuits, a light-converted component, and several of light emitting diodes. The light-converted component includes a transparent substrate and a fluorescence material layer positioned on the transparent substrate. The fluorescence material layer is divided into a central region and several of surrounding regions surrounding the central region. The central region has a greatest concentration of fluorescence material. The concentration of fluorescence material in the surrounding regions decreases from the center to the outer periphery of the fluorescence material layer. The light emitting diodes form an array and are positioned on the substrate between the substrate and the fluorescence material layer. Each of the light emitting diodes is electrically connected to the circuits.

摘要翻译： 发光二极管的光源模块包括具有电路，光转换元件和若干发光二极管的基板。 光转换组件包括透明基板和位于透明基板上的荧光材料层。 荧光材料层分为中心区域和围绕中心区域的几个周围区域。 中心区域荧光材料浓度最高。 周围区域的荧光材料的浓度从荧光材料层的中心向外周减小。 发光二极管形成阵列，并且位于衬底和荧光材料层之间的衬底上。 每个发光二极管电连接到电路。

公开(公告)号：USD634285S1

公开(公告)日：2011-03-15

申请号：US29367261

申请日：2010-08-05

申请人： Bo-Yu Ko ,  Ya-Hsien Chang ,  Chun-Wei Wang

设计人： Bo-Yu Ko ,  Ya-Hsien Chang ,  Chun-Wei Wang

公开(公告)号：USD634284S1

公开(公告)日：2011-03-15

申请号：US29367255

申请日：2010-08-05

申请人： Bo-Yu Ko ,  Ya-Hsien Chang ,  Chun-Wei Wang

设计人： Bo-Yu Ko ,  Ya-Hsien Chang ,  Chun-Wei Wang

公开(公告)号：US07789535B2

公开(公告)日：2010-09-07

申请号：US12488716

申请日：2009-06-22

申请人： Chun-Wei Wang ,  Hung-Kuang Hsu

发明人： Chun-Wei Wang ,  Hung-Kuang Hsu

IPC分类号： F21V29/00

CPC分类号： H01L33/60 ,  H01L33/54 ,  H01L33/642 ,  H01L33/647

摘要： A light source device includes a circuit board, a solid state lighting element, and a hollow cylindrical metal reflector. The circuit board has a circuit layer formed thereon. The solid state lighting element is placed on the circuit board and electrically connected to the circuit layer. The hollow cylindrical metal reflector is placed on the circuit board and insulated from the circuit layer. An inner surface of the reflector surrounds the solid state lighting element to reflect and direct light from the solid state lighting element towards an opposite side of the reflector to the solid state lighting element.

摘要翻译： 光源装置包括电路板，固态照明元件和中空圆柱形金属反射器。 电路板上形成有电路层。 固态照明元件放置在电路板上并电连接到电路层。 中空圆柱形金属反射器放置在电路板上并与电路层绝缘。 反射器的内表面围绕固态照明元件，以将来自固态照明元件的光反射并引导到反射器的相对侧到固态照明元件。

公开(公告)号：US07745840B2

公开(公告)日：2010-06-29

申请号：US12192336

申请日：2008-08-15

申请人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

发明人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

IPC分类号： H01L21/02

CPC分类号： H01L33/60 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A solid-state light source includes a substrate, a solid-state light-emitting chip, a plurality of micro-members and a light-permeable encapsulation. The substrate has a substantially flat surface. The solid-state light-emitting chip is arranged on the substantially flat surface of the substrate and electrically connected to the substrate. The micro-members are arranged on the surface of the substrate and parallel with the solid-state light emitting chip. The light-permeable encapsulation is arranged on the surface of the substrate and covers the solid-state light-emitting chip and the micro-members.

摘要翻译： 固态光源包括基板，固态发光芯片，多个微型部件和透光性封装。 基板具有基本平坦的表面。 固态发光芯片布置在基板的基本上平坦的表面上并电连接到基板。 微型部件布置在基板的表面上并与固态发光芯片平行。 透光性封装体配置在基板的表面，覆盖固态发光芯片和微型部件。

公开(公告)号：US07682048B2

公开(公告)日：2010-03-23

申请号：US12040828

申请日：2008-02-29

申请人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

发明人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

IPC分类号： F21V29/00

CPC分类号： H01L33/64 ,  F21K9/00 ,  F21V29/71 ,  F21V29/75 ,  F21V29/763 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A rate of change of a relatively luminous intensity relative to the temperature of the first LED array is lower than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. A heat dissipation efficiency of the second heat sink is higher than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much lower temperature.

摘要翻译： 发光二极管（LED）灯（100）包括第一LED阵列（60）和第二LED阵列（50）。 相对于第一LED阵列的温度的相对发光强度的变化率低于第二LED阵列的变化率。 第一散热器（10）热连接到第一LED阵列。 第二散热器（20）热附接到第二LED阵列。 第二散热器的散热效率高于第一散热器的散热效率。 第二个LED阵列的散热比第一个LED阵列的散热快得多。 因此，第二LED阵列可以在低得多的温度下保持工作。

公开(公告)号：US20090160344A1

公开(公告)日：2009-06-25

申请号：US12040830

申请日：2008-02-29

申请人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

发明人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

IPC分类号： H01J61/52 ,  H01J13/32

CPC分类号： F21V29/503 ,  F21K9/00 ,  F21V29/677 ,  F21V29/763 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A ratio of change of relatively luminous intensity relative to change of temperature of the first LED array is less than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. An active heat dissipating device (80) is in combination with the second heat sink for enhancing a heat dissipation efficiency of the second heat sink, and thus the heat dissipation efficiency of the second heat sink is greater than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much less temperature.

摘要翻译： 发光二极管（LED）灯（100）包括第一LED阵列（60）和第二LED阵列（50）。 相对于第一LED阵列的温度变化的相对发光强度的变化率小于第二LED阵列的变化率。 第一散热器（10）热连接到第一LED阵列。 第二散热器（20）热附接到第二LED阵列。 主动散热装置（80）与第二散热器组合，用于提高第二散热器的散热效率，因此第二散热器的散热效率大于第一散热器的散热效率。 第二个LED阵列的散热比第一个LED阵列的散热快得多。 因此，第二LED阵列可以在更低的温度下保持工作。