公开(公告)号：US07994518B2

公开(公告)日：2011-08-09

申请号：US12202555

申请日：2008-09-02

申请人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

发明人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

IPC分类号： H01L33/00

CPC分类号： H01L31/14 ,  H01L33/54 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED includes a substrate having a substantially flat substrate surface, a plurality of electrodes extending through the substrate, an LED chip configured for emitting light, a first and a second coplanar reflective layers formed on the surface, and a light pervious encapsulation member mounted on the substrate surface. The light pervious encapsulation member covers the LED chip and the first reflective layer and a portion of the second reflective layer. The LED chip is mounted on the substrate surface and electrically connected with the electrodes. The first reflective layer and the second reflective layer are configured for reflecting the light emitted from the LED chip.

摘要翻译： LED包括具有基本上平坦的基板表面的基板，延伸穿过基板的多个电极，被配置为发光的LED芯片，形成在表面上的第一和第二共面反射层以及安装在 基材表面。 透光封装构件覆盖LED芯片和第一反射层以及第二反射层的一部分。 LED芯片安装在基板表面上并与电极电连接。 第一反射层和第二反射层被配置为反射从LED芯片发射的光。

公开(公告)号：US07763896B2

公开(公告)日：2010-07-27

申请号：US12168783

申请日：2008-07-07

申请人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

发明人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

IPC分类号： H01L25/16

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

摘要： An exemplary LED includes a substrate, an LED chip, a light pervious encapsulation, and an auxiliary electric component. The substrate includes a first surface, an opposite second surface, and an accommodating space defined therein between the first surface and the second surface. The LED chip is mounted on the first surface of the substrate. The light pervious encapsulation is formed on the substrate and covers the LED chip. The auxiliary electric component is received in the accommodating space between the first and second surfaces of the substrate.

摘要翻译： 示例性的LED包括基板，LED芯片，透光性封装和辅助电气部件。 衬底包括第一表面，相对的第二表面和在第一表面和第二表面之间限定的容纳空间。 LED芯片安装在基板的第一表面上。 透光封装形成在基板上并覆盖LED芯片。 辅助电气部件容纳在基板的第一和第二表面之间的容纳空间中。

公开(公告)号：US08053796B2

公开(公告)日：2011-11-08

申请号：US11964845

申请日：2007-12-27

申请人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

发明人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid state light emitting device includes a laminated substrate structure (120), an LED chip (30), a transparent capsulation material (50) and an electric component (40). The laminated substrate structure includes a first substrate (10) and a second substrate (20) attached to each other by a sintering process. The first substrate has a mounting surface (100) and a receiving through hole (11) defined in the mounting surface thereof. The LED chip is mounted on the mounting surface of the first substrate. The transparent capsulation material envelops the LED chip therein. The electric component is received in the receiving hole and mounted on the second substrate. The electric component is located below the mounting surface of the first substrate.

摘要翻译： 固态发光器件包括层叠基板结构（120），LED芯片（30），透明封装材料（50）和电气部件（40）。 层压基板结构包括通过烧结工艺彼此连接的第一基板（10）和第二基板（20）。 第一基板具有在其安装表面中限定的安装表面（100）和接收通孔（11）。 LED芯片安装在第一基板的安装表面上。 透明封装材料包围其中的LED芯片。 电气部件容纳在接收孔中并安装在第二基板上。 电气部件位于第一基板的安装面的下方。

公开(公告)号：US07745840B2

公开(公告)日：2010-06-29

申请号：US12192336

申请日：2008-08-15

申请人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

发明人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

IPC分类号： H01L21/02

CPC分类号： H01L33/60 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A solid-state light source includes a substrate, a solid-state light-emitting chip, a plurality of micro-members and a light-permeable encapsulation. The substrate has a substantially flat surface. The solid-state light-emitting chip is arranged on the substantially flat surface of the substrate and electrically connected to the substrate. The micro-members are arranged on the surface of the substrate and parallel with the solid-state light emitting chip. The light-permeable encapsulation is arranged on the surface of the substrate and covers the solid-state light-emitting chip and the micro-members.

摘要翻译： 固态光源包括基板，固态发光芯片，多个微型部件和透光性封装。 基板具有基本平坦的表面。 固态发光芯片布置在基板的基本上平坦的表面上并电连接到基板。 微型部件布置在基板的表面上并与固态发光芯片平行。 透光性封装体配置在基板的表面，覆盖固态发光芯片和微型部件。

公开(公告)号：US07682048B2

公开(公告)日：2010-03-23

申请号：US12040828

申请日：2008-02-29

申请人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

发明人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

IPC分类号： F21V29/00

CPC分类号： H01L33/64 ,  F21K9/00 ,  F21V29/71 ,  F21V29/75 ,  F21V29/763 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A rate of change of a relatively luminous intensity relative to the temperature of the first LED array is lower than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. A heat dissipation efficiency of the second heat sink is higher than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much lower temperature.

摘要翻译： 发光二极管（LED）灯（100）包括第一LED阵列（60）和第二LED阵列（50）。 相对于第一LED阵列的温度的相对发光强度的变化率低于第二LED阵列的变化率。 第一散热器（10）热连接到第一LED阵列。 第二散热器（20）热附接到第二LED阵列。 第二散热器的散热效率高于第一散热器的散热效率。 第二个LED阵列的散热比第一个LED阵列的散热快得多。 因此，第二LED阵列可以在低得多的温度下保持工作。

公开(公告)号：US20090160344A1

公开(公告)日：2009-06-25

申请号：US12040830

申请日：2008-02-29

申请人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

发明人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

IPC分类号： H01J61/52 ,  H01J13/32

CPC分类号： F21V29/503 ,  F21K9/00 ,  F21V29/677 ,  F21V29/763 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A ratio of change of relatively luminous intensity relative to change of temperature of the first LED array is less than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. An active heat dissipating device (80) is in combination with the second heat sink for enhancing a heat dissipation efficiency of the second heat sink, and thus the heat dissipation efficiency of the second heat sink is greater than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much less temperature.

摘要翻译： 发光二极管（LED）灯（100）包括第一LED阵列（60）和第二LED阵列（50）。 相对于第一LED阵列的温度变化的相对发光强度的变化率小于第二LED阵列的变化率。 第一散热器（10）热连接到第一LED阵列。 第二散热器（20）热附接到第二LED阵列。 主动散热装置（80）与第二散热器组合，用于提高第二散热器的散热效率，因此第二散热器的散热效率大于第一散热器的散热效率。 第二个LED阵列的散热比第一个LED阵列的散热快得多。 因此，第二LED阵列可以在更低的温度下保持工作。

公开(公告)号：US07744264B2

公开(公告)日：2010-06-29

申请号：US12202557

申请日：2008-09-02

申请人： Chih-Chung Tsao ,  Chih-Peng Hsu ,  Wen-Jang Jiang ,  Chun-Wei Wang ,  Chih-Ming Lai ,  Hung-Kuang Hsu

发明人： Chih-Chung Tsao ,  Chih-Peng Hsu ,  Wen-Jang Jiang ,  Chun-Wei Wang ,  Chih-Ming Lai ,  Hung-Kuang Hsu

IPC分类号： F21V7/04

CPC分类号： F21S2/005 ,  F21V19/001 ,  F21V19/045 ,  F21V23/06 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  H05K1/14 ,  H05K2201/048 ,  H05K2201/09963 ,  H05K2201/10106

摘要： An exemplary semiconductor solid-state light-source module includes a printed circuit board, at least one semiconductor solid state light source mounted on the printed circuit board and a light guide plate optically coupled to the semiconductor solid state light source. The printed circuit board includes a protrusion and a recess. The protrusion is configured for engaging with a recess of the printed circuit board of another similar semiconductor solid-state light-source module.

摘要翻译： 示例性的半导体固态光源模块包括印刷电路板，安装在印刷电路板上的至少一个半导体固态光源和与半导体固态光源光学耦合的导光板。 印刷电路板包括突起和凹部。 该突出部构造成用于与另一个类似的半导体固态光源模块的印刷电路板的凹部接合。

公开(公告)号：US20090161354A1

公开(公告)日：2009-06-25

申请号：US12040828

申请日：2008-02-29

申请人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

发明人： Hung-Kuang Hsu ,  Chun-Wei Wang ,  Wen-Jang Jiang

IPC分类号： B60Q1/26

CPC分类号： H01L33/64 ,  F21K9/00 ,  F21V29/71 ,  F21V29/75 ,  F21V29/763 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lighting emitting diode (LED) lamp (100) includes a first LED array (60) and a second LED array (50). A rate of change of a relatively luminous intensity relative to the temperature of the first LED array is lower than that of the second LED array. A first heat sink (10) thermally attaches to the first LED array. A second heat sink (20) thermally attaches to the second LED array. A heat dissipation efficiency of the second heat sink is higher than that of the first heat sink. The heat dissipation of the second LED array is much quicker than that of the first LED array. The second LED array thus can be kept working at a much lower temperature.

摘要翻译： 发光二极管（LED）灯（100）包括第一LED阵列（60）和第二LED阵列（50）。 相对于第一LED阵列的温度的相对发光强度的变化率低于第二LED阵列的变化率。 第一散热器（10）热连接到第一LED阵列。 第二散热器（20）热附接到第二LED阵列。 第二散热器的散热效率高于第一散热器的散热效率。 第二个LED阵列的散热比第一个LED阵列的散热快得多。 因此，第二LED阵列可以在低得多的温度下保持工作。

公开(公告)号：US20090140277A1

公开(公告)日：2009-06-04

申请号：US12192336

申请日：2008-08-15

申请人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

发明人： Chun-Wei Wang ,  Hung-Kuang Hsu ,  Wen-Jang Jiang

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A solid-state light source includes a substrate, a solid-state light-emitting chip, a plurality of micro-members and a light-permeable encapsulation. The substrate has a substantially flat surface. The solid-state light-emitting chip is arranged on the substantially flat surface of the substrate and electrically connected to the substrate. The micro-members are arranged on the surface of the substrate and parallel with the solid-state light emitting chip. The light-permeable encapsulation is arranged on the surface of the substrate and covers the solid-state light-emitting chip and the micro-members.

摘要翻译： 固态光源包括基板，固态发光芯片，多个微型部件和透光性封装。 基板具有基本平坦的表面。 固态发光芯片布置在基板的基本上平坦的表面上并电连接到基板。 微型部件布置在基板的表面上并与固态发光芯片平行。 透光性封装体配置在基板的表面，覆盖固态发光芯片和微型部件。

公开(公告)号：US07784965B2

公开(公告)日：2010-08-31

申请号：US12168780

申请日：2008-07-07

申请人： Wen-Jang Jiang ,  Hung-Kuang Hsu

发明人： Wen-Jang Jiang ,  Hung-Kuang Hsu

IPC分类号： F21V33/00

CPC分类号： H05B33/0803 ,  H01F38/14

摘要： A solid state light illuminator includes a solid state lighting element, a primary coil, and a secondary coil. The secondary coil and the solid state lighting element cooperatively form a circuit. The secondary coil couples electromagnetically with the primary coil. The primary coil is adapted for electrically connecting to an AC power source to generate an alternating magnetic field. The alternating magnetic field generates an induced electromotive force in the secondary coil to apply an electrical current to the solid state lighting element.

摘要翻译： 固态光照明器包括固态照明元件，初级线圈和次级线圈。 辅助线圈和固态照明元件协同地形成电路。 次级线圈与初级线圈电磁耦合。 初级线圈适于电连接到AC电源以产生交变磁场。 交变磁场在次级线圈中产生感应电动势，以向固态照明元件施加电流。