摘要:
An electron gun for a cathode-ray tube has a structure in which the longitudinal middle portion of a focusing electrode is enlarged in diameter and an accelerating electrode is disposed in the enlarged-diameter portion of the focusing electrode. The opposite end portions of the focusing electrode are reduced in diameter, and the reduced-diameter portions of the focusing electrode and the accelerating electrode are secured to each other by means of electrode supporting rods.
摘要:
A control system for controlling input power to hydraulic pumps of a hydraulic system including a prime mover and a plurality of variable displacement hydraulic pumps driven by said prime mover. The control system comprises: a first computing unit for computing, for each of the hydraulic pumps, an input torque control value concerning a distribution of input torques of said hydraulic pumps from a representative pressure obtained on the basis of a discharge pressure of at least one other hydraulic pumps; a second computing unit for determining an input torque for each of the hydraulic pumps on the basis of a corresponding one of the input torque control values determined by the first computing unit; and a third computing unit for determining an object discharge rate of each of the hydraulic pumps from the input torque obtained by the second computing unit and an own discharge pressure of each of the hydraulic pumps.
摘要:
Engine driving characteristics are achieved for driving a hydraulic system during non-traveling and traveling in an electrically driven dump truck.When a shift lever 16 is located at a neutral position, the target revolution speed Nr1 corresponding to the operation amount (p) of an accelerator pedal 1 is calculated on the basis of first target revolution speed characteristics (Nr1(p)) which are suitable for driving of a hydraulic pump for working so that an electronic governor 4a is controlled on the basis of this target revolution speed. When the shift lever 16 is located at a forward position, the target revolution speed Nr2 corresponding to the operation amount of the accelerator pedal 1 is calculated on the basis of second target revolution speed characteristics (Nr2(p)) which are suitable for driving of electric motors 12R, 12L so that the electronic governor 4a is controlled on the basis of this target revolution speed.
摘要:
Conductive ink is printed onto a wafer held on a vertically movable stage by using a squeegee to force the conductive ink through a stencil. The stencil is supported from below by a supporting member adjacent to the periphery of the stage. After the conductive ink has been printed through the stencil, pneumatic pressure is applied to the stencil from above, and the stage is lowered to separate the wafer from the stencil. The supporting member holds the stencil taut while the stage is being lowered, so that the stencil does not warp downward and the printed conductive ink leaves the stencil at substantially the same time at all points on the wafer surface, preventing the premature escape of air and loss of pneumatic pressure.
摘要:
A grinding machine for grinding a workpiece, including a chucking table having a chucking area and a grinder head. The grinder head includes a spinning disk rotating about a rotation axis and a plurality of grindstones, which are circularly arranged on a surface of the spinning disk, whereby a slit is created between the adjacent grindstones, wherein both of the adjacent grindstones is arranged to make contact with an edge of the workpiece while grinding the workpiece.
摘要:
A junction structure, and a semiconductor device including the same, for a junction of a terminal pad and solder, including an underlying base on which said terminal pad is formed; a nickel layer disposed on the terminal pad; a palladium layer or a gold layer disposed on the nickel layer; the solder; and a zinc system material layer provided between the palladium layer or the gold layer and the solder. The terminal pad and the solder may be provided in a semiconductor device in which the terminal pad lies inside the semiconductor device, and the zinc system material layer is formed between the terminal pad and the solder. The terminal pad may be provided over a substrate, the solder may be provided in the semiconductor device, and the zinc system material layer is then formed between the terminal pad of the substrate and the solder of the semiconductor device.