公开(公告)号：US07982261B2

公开(公告)日：2011-07-19

申请号：US12563832

申请日：2009-09-21

申请人： Masaru Kidoh ,  Hiroyasu Tanaka ,  Ryota Katsumata ,  Masaru Kito ,  Yosuke Komori ,  Megumi Ishiduki ,  Hideaki Aochi ,  Yoshiaki Fukuzumi

发明人： Masaru Kidoh ,  Hiroyasu Tanaka ,  Ryota Katsumata ,  Masaru Kito ,  Yosuke Komori ,  Megumi Ishiduki ,  Hideaki Aochi ,  Yoshiaki Fukuzumi

IPC分类号： H01L29/792

CPC分类号： H01L27/11578 ,  H01L21/76816 ,  H01L27/0688 ,  H01L27/112 ,  H01L27/11582

摘要： A nonvolatile semiconductor memory device includes a first stacked body on a silicon substrate, and a second stacked body is provided thereon. The first stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films, and a first portion of a through-hole extending in a stacking direction is formed. The second stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films, and a second portion of the through-hole is formed. A memory film is formed on an inner face of the through-hole, and a silicon pillar is buried in an interior of the through-hole. A central axis of the second portion of the through-hole is shifted from a central axis of the first portion, and a lower end of the second portion is positioned lower than an upper portion of the first portion.

摘要翻译： 非易失性半导体存储器件包括在硅衬底上的第一层叠体，并且在其上设置第二层叠体。 第一堆叠体包括交替层叠有多个电极膜的多个绝缘膜，并且形成沿堆叠方向延伸的通孔的第一部分。 第二堆叠体包括交替层叠有多个电极膜的多个绝缘膜，并且形成通孔的第二部分。 在通孔的内表面上形成记忆膜，并且将硅柱埋在通孔的内部。 通孔的第二部分的中心轴线从第一部分的中心轴线偏移，并且第二部分的下端位于比第一部分的上部更低的位置。

公开(公告)号：US07936004B2

公开(公告)日：2011-05-03

申请号：US11654551

申请日：2007-01-18

申请人： Masaru Kito ,  Hideaki Aochi ,  Ryota Katsumata ,  Akihiro Nitayama ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Yasuyuki Matsuoka ,  Mitsuru Sato

发明人： Masaru Kito ,  Hideaki Aochi ,  Ryota Katsumata ,  Akihiro Nitayama ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Yasuyuki Matsuoka ,  Mitsuru Sato

IPC分类号： H01L27/115

CPC分类号： H01L27/11582 ,  G11C16/0483 ,  H01L21/8221 ,  H01L27/0688 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11556 ,  H01L27/11573 ,  H01L27/11578

摘要： A nonvolatile semiconductor memory device includes a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; a second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory string and the first to nth electrodes of at least two other memory strings which are adjacent to the memory string in two directions are shared as first to nth conductor layers spread in two dimensions.

摘要翻译： 非易失性半导体存储器件包括其中多个可电可编程存储器单元串联连接的多个存储器串。 存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极（n是大于1的自然数）。 存储器串的第一或第n电极以及在两个方向上与存储器串相邻的至少两个其它存储器串的第一至第n电极被共享为在二维上扩展的第一至第n导体层。

公开(公告)号：US20110018050A1

公开(公告)日：2011-01-27

申请号：US12727830

申请日：2010-03-19

申请人： Tomoko FUJIWARA ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yosuke Komori ,  Megumi Ishiduki ,  Junya Matsunami ,  Hideaki Aochi ,  Ryouhei Kirisawa ,  Yoshimasa Mikajiri ,  Shigeto Oota

发明人： Tomoko FUJIWARA ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yosuke Komori ,  Megumi Ishiduki ,  Junya Matsunami ,  Hideaki Aochi ,  Ryouhei Kirisawa ,  Yoshimasa Mikajiri ,  Shigeto Oota

IPC分类号： H01L29/51 ,  H01L21/4763

CPC分类号： H01L27/11551 ,  H01L27/11524 ,  H01L27/11526 ,  H01L27/11529 ,  H01L27/11556

摘要： A nonvolatile semiconductor memory device, includes: a stacked structural unit including electrode films alternately stacked with inter-electrode insulating films; first and second semiconductor pillars piercing the stacked structural unit; a connection portion semiconductor layer electrically connect the first and second semiconductor pillars; a connection portion conductive layer provided to oppose the connection portion semiconductor layer; a memory layer and an inner insulating film provided between the first and semiconductor pillars and each of the electrode films, and between the connection portion conductive layer and the connection portion semiconductor layer; an outer insulating film provided between the memory layer and each of the electrode films; and a connection portion outer insulating film provided between the memory layer and the connection portion conductive layer. The connection portion outer insulating film has a film thickness thicker than a film thickness of the outer insulating film.

摘要翻译： 一种非易失性半导体存储器件，包括：堆叠结构单元，其包括交替层叠有电极间绝缘膜的电极膜; 第一和第二半导体柱刺穿堆叠结构单元; 连接部分半导体层电连接第一和第二半导体柱; 连接部分导电层，设置成与连接部分半导体层相对; 设置在所述第一半导体柱和所述半导体柱之间以及所述电极膜之间并且位于所述连接部分导电层和所述连接部半导体层之间的存储层和内部绝缘膜; 设置在所述存储层和每个所述电极膜之间的外部绝缘膜; 以及设置在存储层和连接部分导电层之间的连接部分外绝缘膜。 连接部外绝缘膜的膜厚比外绝缘膜的膜厚厚。

公开(公告)号：US20100219465A1

公开(公告)日：2010-09-02

申请号：US12773038

申请日：2010-05-04

申请人： Hiroyasu TANAKA ,  Hideaki Aochi ,  Ryota Katsumata ,  Masaru Kidoh ,  Yoshiaki Fukuzumi ,  Masaru Kito ,  Yasuyuki Matsuoka

发明人： Hiroyasu TANAKA ,  Hideaki Aochi ,  Ryota Katsumata ,  Masaru Kidoh ,  Yoshiaki Fukuzumi ,  Masaru Kito ,  Yasuyuki Matsuoka

IPC分类号： H01L29/78

CPC分类号： H01L29/792 ,  H01L21/28282 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/0649 ,  H01L29/7923 ,  H01L29/7926

摘要： A semiconductor device has a substrate, a source region formed on the surface portion of the substrate, a first insulating layer formed on the substrate, a gate electrode formed on the first insulating layer, a second insulating layer formed on the gate electrode, a body section connected with the source region, penetrating through the first insulating layer, the gate electrode and the second insulating layer, and containing a void, a gate insulating film surrounding the body section, and formed between the body section and the gate electrode, and a drain region connected with the body section.

摘要翻译： 半导体器件具有衬底，形成在衬底的表面部分上的源极区域，形成在衬底上的第一绝缘层，形成在第一绝缘层上的栅电极，形成在栅电极上的第二绝缘层，主体 与源极区域连接，穿过第一绝缘层，栅电极和第二绝缘层，并且包含空隙，围绕主体部分的栅极绝缘膜，并且形成在主体部分和栅电极之间，并且 漏极区域与主体部分连接。

公开(公告)号：US20100207190A1

公开(公告)日：2010-08-19

申请号：US12705231

申请日：2010-02-12

申请人： Ryota KATSUMATA ,  Masaru Kito ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Yoshiaki Fukuzumi ,  Hideaki Aochi

发明人： Ryota KATSUMATA ,  Masaru Kito ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Yoshiaki Fukuzumi ,  Hideaki Aochi

IPC分类号： H01L29/788 ,  H01L21/336

CPC分类号： H01L27/11578 ,  G11C16/0483 ,  H01L27/0688 ,  H01L27/11582 ,  H01L29/42344 ,  H01L29/66833 ,  H01L29/792 ,  H01L29/7926

摘要： A nonvolatile semiconductor memory device, includes: a stacked body including a plurality of insulating films alternately stacked with a plurality of electrode films, the electrode films being divided to form a plurality of control gate electrodes aligned in a first direction; a plurality of semiconductor pillars aligned in a stacking direction of the stacked body, the semiconductor pillars being arranged in a matrix configuration along the first direction and a second direction intersecting the first direction to pierce the control gate electrodes; and a connection member connecting a lower end portion of one of the semiconductor pillars to a lower end portion of one other of the semiconductor pillars, an upper end portion of the one of the semiconductor pillars being connected to a source line, an upper end portion of the one other of the semiconductor pillars being connected to a bit line. At least some of the control gate electrodes are pierced by two of the semiconductor pillars adjacent to each other in the second direction. Two of the semiconductor pillars being connected to each other by the connection member pierce mutually different control gate electrodes.

摘要翻译： 一种非易失性半导体存储器件，包括：堆叠体，包括交替层叠有多个电极膜的多个绝缘膜，所述电极膜被分割以形成沿第一方向排列的多个控制栅电极; 多个半导体柱沿层叠体的堆叠方向排列，半导体柱沿着第一方向排列成矩阵构造，第二方向与第一方向相交以刺穿控制栅电极; 以及将所述半导体柱之一的下端部连接到所述半导体柱的另一个的下端部的连接部件，所述一个半导体柱的上端部与源极线连接，上端部 另一个半导体柱被连接到位线。 至少一些控制栅极电极在第二方向上被彼此相邻的两个半导体柱刺穿。 通过连接构件彼此连接的两个半导体柱穿透相互不同的控制栅电极。

公开(公告)号：US20100044776A1

公开(公告)日：2010-02-25

申请号：US12535847

申请日：2009-08-05

申请人： Megumi Ishiduki ,  Ryota Katsumata ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yosuke Komori ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Hideaki Aochi

发明人： Megumi Ishiduki ,  Ryota Katsumata ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yosuke Komori ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Hideaki Aochi

IPC分类号： H01L29/792 ,  H01L21/336

CPC分类号： H01L27/11578 ,  H01L27/11565 ,  H01L27/11582 ,  H01L29/792 ,  H01L29/7926

摘要： A multilayer body is formed by alternately stacking electrode films serving as control gates and dielectric films in a direction orthogonal to an upper surface of a silicon substrate. Trenches extending in the word line direction are formed in the multilayer body and a memory film is formed on an inner surface of the trench. Subsequently, a silicon body is buried inside the trench, and a charge storage film and the silicon body are divided in the word line direction to form silicon pillars. This simplifies the configuration of memory cells in the bit line direction, and hence can shorten the arrangement pitch of the silicon pillars, decreasing the area per memory cell.

摘要翻译： 通过在与硅衬底的上表面正交的方向上交替堆叠用作控制栅极和电介质膜的电极膜来形成多层体。 在多层体中形成在字线方向上延伸的沟槽，并且在沟槽的内表面上形成记忆膜。 随后，将硅体埋在沟槽内，并且电荷存储膜和硅体在字线方向上分开以形成硅柱。 这简化了位线方向上的存储单元的配置，因此可以缩短硅柱的排列间距，减小每个存储单元的面积。

公开(公告)号：US20090294844A1

公开(公告)日：2009-12-03

申请号：US12132181

申请日：2008-06-03

申请人： Hiroyasu TANAKA ,  Hideaki Aochi ,  Ryota Katsumata ,  Masaru Kidoh ,  Yoshiaki Fukuzumi ,  Masaru Kito ,  Yasuyuki Matsuoka

发明人： Hiroyasu TANAKA ,  Hideaki Aochi ,  Ryota Katsumata ,  Masaru Kidoh ,  Yoshiaki Fukuzumi ,  Masaru Kito ,  Yasuyuki Matsuoka

IPC分类号： H01L29/739

CPC分类号： H01L29/792 ,  H01L21/28282 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/0649 ,  H01L29/7923 ,  H01L29/7926

摘要： A semiconductor device has a substrate, a source region formed on the surface portion of the substrate, a first insulating layer formed on the substrate, a gate electrode formed on the first insulating layer, a second insulating layer formed on the gate electrode, a body section connected with the source region, penetrating through the first insulating layer, the gate electrode and the second insulating layer, and containing a void, a gate insulating film surrounding the body section, and formed between the body section and the gate electrode, and a drain region connected with the body section.

摘要翻译： 半导体器件具有衬底，形成在衬底的表面部分上的源极区域，形成在衬底上的第一绝缘层，形成在第一绝缘层上的栅电极，形成在栅电极上的第二绝缘层，主体 与源极区域连接，穿过第一绝缘层，栅电极和第二绝缘层，并且包含空隙，围绕主体部分的栅极绝缘膜，并且形成在主体部分和栅电极之间，并且 漏极区域与主体部分连接。

公开(公告)号：US20090267135A1

公开(公告)日：2009-10-29

申请号：US12408249

申请日：2009-03-20

申请人： Hiroyasu Tanaka ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Yosuke Komori ,  Hideaki Aochi ,  Megumi Ishiduki ,  Yasuyuki Matsuoka

发明人： Hiroyasu Tanaka ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Yosuke Komori ,  Hideaki Aochi ,  Megumi Ishiduki ,  Yasuyuki Matsuoka

IPC分类号： H01L29/78 ,  H01L21/28

CPC分类号： H01L27/11578 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11573 ,  H01L27/11582

摘要： A non-volatile semiconductor storage device includes a first layer and a second layer. The first layer includes: a plurality of first conductive layers extending in parallel to a substrate and laminated in a direction perpendicular to the substrate; a first insulation layer formed on an upper layer of the plurality of first conductive layers; a first semiconductor layer formed to penetrate the plurality of first conductive layers; and a charge accumulation layer formed between the first conductive layers and the first semiconductor layer. Respective ends of the first conductive layers are formed in a stepwise manner in relation to each other in a first direction. The second layer includes: a plurality of second conductive layers extending in parallel to the substrate and laminated in a direction perpendicular to the substrate, the second conductive layers being formed in the same layer as the plurality of first conductive layers; and a second insulation layer formed on an upper layer of the plurality of second conductive layers. Respective ends of the second conductive layers are formed to align along a straight line extending in a direction substantially perpendicular to the substrate at a predetermined area.

摘要翻译： 非易失性半导体存储装置包括第一层和第二层。 第一层包括：多个第一导电层，其平行于衬底延伸并且在垂直于衬底的方向上层压; 形成在所述多个第一导电层的上层上的第一绝缘层; 形成为穿透所述多个第一导电层的第一半导体层; 以及形成在第一导电层和第一半导体层之间的电荷累积层。 第一导电层的相应端部在第一方向上相对于彼此以逐步的方式形成。 第二层包括：多个第二导电层，其平行于衬底延伸并且在垂直于衬底的方向上层叠，第二导电层形成在与多个第一导电层相同的层中; 以及形成在所述多个第二导电层的上层上的第二绝缘层。 形成第二导电层的相应端，沿着在预定区域上基本上垂直于衬底的方向延伸的直线对齐。

公开(公告)号：US20090230462A1

公开(公告)日：2009-09-17

申请号：US12393509

申请日：2009-02-26

申请人： Hiroyasu Tanaka ,  Masaru Kidoh ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Hideaki Aochi ,  Yasuyuki Matsuoka

发明人： Hiroyasu Tanaka ,  Masaru Kidoh ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Hideaki Aochi ,  Yasuyuki Matsuoka

IPC分类号： H01L29/792 ,  H01L21/28

CPC分类号： H01L27/11578 ,  H01L27/11582

摘要： Each of the memory strings includes: a first columnar semiconductor layer extending in a vertical direction to a substrate; a plurality of first conductive layers formed to sandwich an insulation layer with a charge trap layer and expand in a two-dimensional manner; a second columnar semiconductor layer formed in contact with the top surface of the first columnar semiconductor layer and extending in a vertical direction to the substrate; and a plurality of second conductive layers formed to sandwich an insulation layer with the second columnar semiconductor layer and formed in a stripe pattern extending in a first direction orthogonal to the vertical direction. Respective ends of the plurality of first conductive layers in the first direction are formed in a stepwise manner in relation to each other, entirety of the plurality of the second conductive layers are formed in an area immediately above the top layer of the first conductive layers, and the plurality of first conductive layers and the plurality of second conductive layers are covered with a protection insulation layer that is formed continuously with the plurality of first conductive layers and the second conductive layers.

摘要翻译： 每个存储器串包括：在垂直方向上延伸到衬底的第一柱状半导体层; 多个第一导电层，其形成为夹着具有电荷陷阱层的绝缘层并以二维方式扩展; 第二柱状半导体层，其与所述第一柱状半导体层的顶表面接触并且在垂直方向上延伸到所述衬底; 以及多个第二导电层，其形成为与第二柱状半导体层夹着绝缘层，并且形成为沿与垂直方向正交的第一方向延伸的条纹图案。 多个第一导电层的第一方向的端部相对于彼此分步地形成，多个第二导电层的整体形成在第一导电层的顶层的正上方的区域中， 并且多个第一导电层和多个第二导电层被与多个第一导电层和第二导电层连续形成的保护绝缘层覆盖。

公开(公告)号：US20090224309A1

公开(公告)日：2009-09-10

申请号：US12389977

申请日：2009-02-20

申请人： Masaru Kidoh ,  Masaru Kito ,  Ryota Katsumata ,  Yoshiaki Fukuzumi ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Hideaki Aochi ,  Yasuyuki Matsuoka

发明人： Masaru Kidoh ,  Masaru Kito ,  Ryota Katsumata ,  Yoshiaki Fukuzumi ,  Hiroyasu Tanaka ,  Megumi Ishiduki ,  Yosuke Komori ,  Hideaki Aochi ,  Yasuyuki Matsuoka

IPC分类号： H01L29/792 ,  H01L21/20 ,  H01L21/336

CPC分类号： H01L27/11578 ,  H01L21/8221 ,  H01L27/11573 ,  H01L27/11575 ,  H01L27/11582

摘要： A method for manufacturing a nonvolatile semiconductor storage device, including: forming a first conductive layer so that it is sandwiched in an up-down direction by first insulating layers; forming a first hole so that it penetrates the first insulating layers and the first conductive layer; forming a first side wall insulating layer on a side wall facing the first hole; forming a sacrificing layer so that the sacrificing layer infills the first hole; forming a second conductive layer on an upper layer of the sacrificing layer so that the second conductive layer is sandwiched by the second insulating layer in an up-down direction; forming a second hole on a position which matches with the first hole so that the second hole penetrates the second insulating layer and the second conductive layer; forming a second side wall insulating layer on a side wall facing the second hole; removing the sacrificing layer after the formation of the second side wall insulating layer; and forming a semiconductor layer so that the semiconductor layer infills the first hole and the second hole after the removal of the sacrificing layer

摘要翻译： 一种制造非易失性半导体存储装置的方法，包括：形成第一导电层，使其通过第一绝缘层沿上下方向夹持; 形成第一孔，使其穿透第一绝缘层和第一导电层; 在面向所述第一孔的侧壁上形成第一侧壁绝缘层; 形成牺牲层，使牺牲层填充第一孔; 在牺牲层的上层上形成第二导电层，使得第二导电层在上下方向上被第二绝缘层夹持; 在与所述第一孔匹配的位置上形成第二孔，使得所述第二孔穿过所述第二绝缘层和所述第二导电层; 在面向所述第二孔的侧壁上形成第二侧壁绝缘层; 在形成第二侧壁绝缘层之后去除牺牲层; 以及形成半导体层，使得半导体层在去除牺牲层之后填充第一孔和第二孔