中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

21386 records (took 0.04 seconds)

    Wireless power transfer
    33.
    发明授权
    Wireless power transfer 有权

    公开(公告)号：US12249847B2

    公开(公告)日：2025-03-11

    申请号：US17309781

    申请日：2019-12-13

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Zohaib Hameed ,  Jaewon Kim ,  Sithya S. Khieu

    IPC: H02J50/23 ,  H02J50/00 ,  H02J50/12

    Abstract: A device is described having one or more conductive loops to produce an electromagnetic field, such as for wireless power transfer to an electronic device. In some examples, an antenna is used with at least one resonating capacitor ring that is relatively co-planar with the antenna, and that is magnetically coupled to the antenna but is not electrically powered by an external source. In addition, a device is described having two or more thin-film coils, each coil comprising a pair of terminals and at least one loop defining a plane and an interior region. In some examples, the planes of the two or more coils are disposed substantially parallel to one another, the interior regions of the two or more coils at least partially overlap one another, and the pairs of terminals of the antennae are electrically connected in parallel.

    CROSSLINKABLE COMPOSITIONS INCLUDING A LATENT UV-ABSORBER
    36.
    发明申请
    CROSSLINKABLE COMPOSITIONS INCLUDING A LATENT UV-ABSORBER 有权

    公开(公告)号：US20250059350A1

    公开(公告)日：2025-02-20

    申请号：US18722212

    申请日：2022-12-21

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Hyunki Kim ,  Karl E. Benson ,  Jason D. Clapper

    IPC: C08K5/3475 ,  C08K5/101 ,  C09J7/38 ,  C09J133/08

    Abstract: Provided are crosslinkable compositions comprising a (meth)acrylate polymer, where the polymer has a glass transition temperature no greater than 30° C.; a crosslinking agent, the crosslinking agent comprising a photo-active Type II photoinitiator and a polymerizable group selected from the group consisting of (meth)acrylate, allyl, and combinations thereof; and a UV absorbing material represented by the structure (I) where each of X1, X2, X3, and X4 is independently a hydrogen atom, a hydrocarbyl group including 1 to 15 carbon atoms, preferably 12 carbon atoms, or a heterohydrocarbyl group including 1 to 15 carbon atoms, preferably 12 carbon atoms.

    SELF-FOLDING 3D FILM ASSEMBLIES
    37.
    发明申请
    SELF-FOLDING 3D FILM ASSEMBLIES 有权

    公开(公告)号：US20250059026A1

    公开(公告)日：2025-02-20

    申请号：US18941132

    申请日：2024-11-08

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jia Hu ,  Martin B. Wolk ,  Thomas R. Corrigan ,  Mitchell T. Nommensen ,  Michael Benton Free ,  Erik A. Aho

    IPC: B81C1/00 ,  B32B7/12 ,  B81B3/00 ,  B81B7/02 ,  C09J9/02

    Abstract: A substantially planar self-folding film assembly to generate a folded three-dimensional assembly. The assembly includes a flexible support substrate, adhesive elements, and folding members. The folding members include a base, a folding region, and a hinge adjacent each folding region attached at the base to the flexible support substrate by at least one of the adhesive elements. An array of polymer actuators is co-extensive, or shaped to be not co-extensive, with each of the flexible folding members. Upon activation by a patterned light to heat conversion layer, each polymer actuator is designed and configured to provide a displacement of the corresponding flexible folding member about each hinge.

    PAD CONDITIONING DISK WITH COMPRESSIBLE CIRCUMFERENTIAL LAYER
    38.
    发明申请
    PAD CONDITIONING DISK WITH COMPRESSIBLE CIRCUMFERENTIAL LAYER 有权

    公开(公告)号：US20250058429A1

    公开(公告)日：2025-02-20

    申请号：US18717610

    申请日：2022-12-19

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Matthew C. Fritz

    IPC: B24B53/017 ,  B24B53/12

    Abstract: Pad conditioning disks are described. In particular, pad conditioning disks includes discrete abrasive elements and a circumferential compressible layer are described. When uncompressed, the maximum height of the circumferential compressible layer is greater than the maximum height of the discrete abrasive elements, which may provide more even wafer removal rates for in-situ polishing processes.

Patent Agency Ranking