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公开(公告)号:US20240253329A1
公开(公告)日:2024-08-01
申请号:US18564643
申请日:2022-05-13
发明人: Aaron T. Hedegaard , Mahfuza B. Ali , Ibrahim A. El Hedok , Jason D. Clapper , Eric J. Olson , Lindsey Hines , Ross E. Behling , Kevin D. Hagen
IPC分类号: B32B7/06 , B32B3/30 , B32B5/18 , B32B7/025 , B32B7/12 , B32B43/00 , C09J5/00 , C09J7/20 , C09J7/38 , C09J133/08
CPC分类号: B32B7/06 , B32B3/30 , B32B5/18 , B32B7/025 , B32B7/12 , B32B43/006 , C09J5/00 , C09J7/20 , C09J7/385 , C09J133/08 , B32B2250/03 , B32B2307/202 , B32B2307/748 , B32B2405/00 , C09J2301/1242 , C09J2301/302 , C09J2301/314 , C09J2301/502 , C09J2433/00
摘要: An article comprising a first component having a first electrically conductive surface and a second component having a second surface. An adhesive composition comprising a zwitterionic polymer is disposed between the first electrically conductive surface and second surface and joins the first component to the second component. The effort required to separate the first component from the second component, as measured by work of adhesion per surface area, is reduced by application of a DC electric potential across the adhesive composition.
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公开(公告)号:US20230365841A1
公开(公告)日:2023-11-16
申请号:US18247988
申请日:2021-10-11
CPC分类号: C09J7/385 , C09J7/35 , C09J2203/326 , C09J2301/302 , C09J2301/304 , C09J2301/416 , C09J2301/414 , C09J2451/00
摘要: A crosslinkable composition, a crosslinked composition formed upon exposure of the crosslinkable composition to ultraviolet radiation or ionizing radiation, articles containing these crosslinkable or crosslinked compositions, and methods of making the articles are described. The crosslinkable compositions contain two different (meth)acrylate polymers and can be applied to a substrate using an extrusion process. While being extruded, the crosslinkable compositions advantageously are resistant to crosslinking and/or significantly increasing in molecular weight. The crosslinked compositions can function as either a pressure-sensitive adhesive composition or a heat bondable adhesive composition and are particularly well suited for use in electronic devices.
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3.
公开(公告)号:US20220213358A1
公开(公告)日:2022-07-07
申请号:US17603604
申请日:2020-05-19
发明人: Vasav Sahni , Jason D. Clapper , John W. McAllister , Albert I. Everaerts , Jacob P. Johnson , Zhong Chen , Ying Zhang , Benjamin J. Bending
IPC分类号: C09J123/22 , C08K5/01 , C08F220/18 , C08F222/10 , C08K5/3412
摘要: An adhesive composition is described comprising a polyisobutylene polymer component; and up to 30 wt.-% of at least one aliphatic multifunctional component comprising at least two ethylenically unsaturated groups selected from (meth)acryl or vinyl ether. The monomer comprises a hydrocarbon moiety with greater than 12 contiguous carbon atoms. When the hydrocarbon moiety is branched, the hydrocarbon moiety comprises side chains with at least two carbon atoms. The aliphatic multifunctional component is sufficiently compatible such that crosslinked adhesive composition at a thickness of 20 microns has a haze of less than 3%. Also described are adhesive articles.
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4.
公开(公告)号:US20220195266A1
公开(公告)日:2022-06-23
申请号:US17604530
申请日:2020-05-19
发明人: Vasav Sahni , Richard B. Ross , Saswata Chakraborty , Wayne S. Mahoney , Jason D. Clapper , Jacob P. Johnson
IPC分类号: C09J153/02
摘要: Compositions are described comprising at least 20 wt. % of block copolymer comprising polyvinyl aromatic end blocks and a polyisoprene midblock and at least one ethylenically unsaturated monomer comprising one or more groups selected from (meth)acryl or vinyl ether. In one embodiment, the monomer has a Log P according to Moriguchi's method of at least 2.2. In another embodiment, the monomer is a multifunctional aromatic ethylenically unsaturated monomer. The composition is typically a (e.g. pressure sensitive) adhesive. Also described are methods of making an article, adhesive articles, and methods of bonding.
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公开(公告)号:US11332642B2
公开(公告)日:2022-05-17
申请号:US16935339
申请日:2020-07-22
发明人: Belma Erdogan-Haug , Albert I. Everaerts , David S. Hays , David J. Kinning , Maria A. Appeaning , Jong-Seob Won , Ross E. Behling , Jason D. Clapper , Marie Aloshyna ep Lesuffleur
IPC分类号: C09J7/10 , B32B7/12 , B32B27/40 , B32B27/36 , B32B25/14 , B32B27/30 , B32B3/04 , B32B27/32 , B32B27/08 , B32B25/20 , B32B27/28 , C09J7/38 , C08G77/455 , H01L51/00 , H01L51/52
摘要: The present invention is an assembly layer for a flexible device. Within a temperature range of between about −30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10−6 1/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress. The assembly layer includes at least one of a polyisoprene, a polybutadiene, an olefin block copolymer, a polyisobutylene, and high alkyl polyolefin.
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6.
公开(公告)号:US20210292458A1
公开(公告)日:2021-09-23
申请号:US17258231
申请日:2019-07-08
发明人: Vasav Sahni , Saswata Chakraborty , Wayne S. Mahoney , Jason D. Clapper , Jacob P. Johnson , Ying Zhang , Albert I. Everaerts , Bryan V. Hunt , Richard B. Ross
IPC分类号: C08F255/10 , C08L23/22 , C09J123/22 , C09J153/02
摘要: A composition is described comprising a styrene-isobutylene block copolymer; and at least one ethylenically unsaturated monomer. After curing the composition comprises polymerized units of the ethylenically unsaturated monomer. In some embodiments the ethylenically unsaturated groups are selected from (meth)acryl or vinyl ether. The composition is suitable for use as a (e.g. pressure sensitive) adhesive. Articles, methods of making an article, and methods of bonding are also described.
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公开(公告)号:US20210189192A1
公开(公告)日:2021-06-24
申请号:US16483546
申请日:2018-03-09
发明人: Vasav Sahni , Jason D. Clapper , Jacob P. Johnson , Ying Zhang
摘要: In one embodiment, an adhesive composition is described comprising a polyisobutylene polymer component, a styrene-isobutylene block copolymer, and optionally a tackifier. The polyisobutylene polymer component comprises one or more polyisobutylene polymers. The polyisobutylene polymer component has an average weight average molecular weight ranging from 100 g/mole to less than 15,000 g/mole. In some embodiments, the adhesive composition is a pressure sensitive adhesive.
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公开(公告)号:US10752810B2
公开(公告)日:2020-08-25
申请号:US15575680
申请日:2016-05-31
发明人: Belma Erdogan-Haug , Albert I. Everaerts , David S. Hays , David J. Kinning , Maria A. Appeaning , Jong-Seob Won , Ross E. Behling , Jason D. Clapper , Marie Aloshyna ep Lesuffleur
IPC分类号: C09J7/38 , B32B7/12 , B32B27/40 , B32B27/36 , C09J7/10 , B32B25/14 , B32B27/30 , B32B3/04 , B32B27/32 , B32B27/08 , B32B25/20 , B32B27/28 , C08G77/455 , H01L51/00 , H01L51/52
摘要: The present invention is an assembly layer for a flexible device. Within a temperature range of between about −30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10−6 l/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress.
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公开(公告)号:US20190316004A1
公开(公告)日:2019-10-17
申请号:US16464952
申请日:2017-11-20
IPC分类号: C09J4/00 , C08F220/18 , C08F220/20 , B32B7/12
摘要: The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt % C1-C9 alkyl(meth)acrylate, about 40 to about 99 wt % C10-C24 (meth)acrylate, about 0 to about 30 wt % hydroxyl(meth)acrylate, about 0 to about 10 wt % of a non-hydroxy functional polar monomer, and about 0 to about 5 wt % crosslinker.
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公开(公告)号:US10294394B2
公开(公告)日:2019-05-21
申请号:US15308935
申请日:2015-05-01
摘要: Multilayer adhesive tapes including at least one microstructured elastomeric layer and at least one layer of a pressure sensitive adhesive disposed on the microstructured elastomeric layer, and articles that include such multilayer adhesive tapes.
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