公开(公告)号：US20120156831A1

公开(公告)日：2012-06-21

申请号：US13404579

申请日：2012-02-24

Applicant: Takahiro SAKURAI ,  Yuichi ITO

Inventor： Takahiro SAKURAI ,  Yuichi ITO

IPC: H01L21/56

CPC classification number: G06K19/07749 ,  G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.

Abstract translation: 该IC卡设置有具有入口的模块，覆盖模块的粘合剂层，以及插入粘合剂层的第一基材和夹着模块的第二基材。 模块设置在第一基材的一个表面上，插入粘性层，该粘性层的厚度根据模块的每个区域处的厚度而变化，并且当从外部观察时，其两端比其它部分窄 第一基材的表面侧或第二基材的外表面侧。 根据该IC卡，可以提供具有平坦表面的IC卡，并且在嵌入式IC芯片中不产生应变。

公开(公告)号：US20080042266A1

公开(公告)日：2008-02-21

申请号：US11576162

申请日：2005-10-07

Applicant: Hitoshi Kagaya ,  Yoshiaki Ide ,  Takeshi Yamakami ,  Hiroki Ohno

Inventor： Hitoshi Kagaya ,  Yoshiaki Ide ,  Takeshi Yamakami ,  Hiroki Ohno

IPC: G06K19/06 ,  H01L21/00 ,  H01L23/34

CPC classification number: H04B5/02 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07771 ,  H01F17/0006 ,  H01F41/041 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/09701 ,  H04B5/0062 ,  H04B5/0081 ,  H01L2924/00

Abstract: A non-contact IC label comprising an electrically insulating first substrate; an electrically connected antenna coil and IC chip provided on one surface of said substrate; a magnetic layer provided on said one surface of said substrate so as to cover said antenna coil and said IC chip, a first adhesive layer provided on said magnetic layer, an electrically insulating second substrate provided on said first adhesive layer, a second adhesive layer provided on said second substrate, a release paper provided on said second adhesive layer, and an overlay material provided on a third adhesive layer on the other surface of said first substrate.

Abstract translation: 一种非接触IC标签，包括电绝缘的第一基板; 设置在所述基板的一个表面上的电连接的天线线圈和IC芯片; 设置在所述基板的所述一个表面上以覆盖所述天线线圈和所述IC芯片的磁性层，设置在所述磁性层上的第一粘合剂层，设置在所述第一粘合剂层上的电绝缘的第二基板， 在所述第二基板上，设置在所述第二粘合剂层上的剥离纸和设置在所述第一基板的另一表面上的第三粘合剂层上的覆盖材料。

公开(公告)号：US07232857B2

公开(公告)日：2007-06-19

申请号：US10491050

申请日：2003-03-26

Applicant: Akira Hirasawa

Inventor： Akira Hirasawa

IPC: C08K3/20

CPC classification number: C09J107/00 ,  C09J4/00 ,  C09J4/06 ,  C09J7/38 ,  C09J7/381 ,  C09J11/08 ,  C08F253/00

Abstract: An adhesive composition comprising natural rubber based particles uniformly dispersed in a radiation setting compound is cured by radiation to make a pressure-sensitive adhesive layer on a substrate, thereby: sufficient adhesiveness is obtained; different fillers sufficiently charged; drying time after application is short; both overall application and pattern application are readily performed; application can be performed on different substrates; and sufficient adhesive strength between the substrate and the pressure-sensitive adhesive layer can be realizes. This adhesive composition may be manufactured by: mixing aqueous emulsion 31 containing the natural rubber based particles 30 and the radiation setting compound 32; elevating a temperature of the mixture while stirring; removing vaporized water in the aqueous emulsion; and replacing the water as the medium wherein the natural rubber based particles are dispersed with the radiation setting compound.

Abstract translation: 通过辐射固化包含均匀分散在辐射固化剂中的天然橡胶基颗粒的粘合剂组合物，以在基材上形成压敏粘合剂层，从而获得足够的粘合性; 不同填料充分充电; 施用后的干燥时间短; 总体应用和图案应用都很容易实现; 可以在不同的基材上进行涂布; 并且可以实现基板和压敏粘合剂层之间的足够的粘合强度。 该粘合剂组合物可以通过以下方式制造：将含有天然橡胶基颗粒30的水性乳液31和辐射固化化合物32混合; 在搅拌下升高混合物的温度; 去除水乳液中的汽化水; 并且用作为其中天然橡胶基颗粒与辐射固化化合物分散的介质的水替代。