Broad spectrum, endpoint detection window chemical mechanical polishing pad and polishing method
    31.
    发明申请
    Broad spectrum, endpoint detection window chemical mechanical polishing pad and polishing method 审中-公开
    广谱,端点检测窗口化学机械抛光垫和抛光方法

    公开(公告)号:US20140256226A1

    公开(公告)日:2014-09-11

    申请号:US13788539

    申请日:2013-03-07

    IPC分类号: B24B37/20 B24B37/013

    CPC分类号: B24B37/205 B24B37/013

    摘要: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises an olefin copolymer; wherein the olefin copolymer, comprises, as initial components: ethylene, a branched or straight chain C3-30 α-olefin; a silane; and, optionally, a polyolefin; wherein the broad spectrum, endpoint detection window block exhibits a uniform chemical composition across its thickness; wherein the broad spectrum, endpoint detection window block exhibits a spectrum loss ≦60%; and, wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.

    摘要翻译: 提供一种化学机械抛光垫,包括:具有抛光表面的抛光层; 以及广谱端点检测窗口块,其沿着垂直于所述抛光表面的平面的轴线具有厚度; 其中所述广谱终点检测窗口块包含烯烃共聚物; 其中所述烯烃共聚物包含作为初始组分:乙烯,支链或直链C 3-30α-烯烃; 硅烷; 和任选的聚烯烃; 其中所述广谱端点检测窗口块在其厚度上表现出均匀的化学组成; 其中所述广谱端点检测窗口块表现出频谱损耗≦̸ 60%; 并且其中所述抛光表面适于抛光选自磁性基板,光学基板和半导体基板的基板。

    METHOD OF MANUFACTURING POLISHING PAD HAVING DETECTION WINDOW AND POLISHING PAD HAVING DETECTION WINDOW
    32.
    发明申请
    METHOD OF MANUFACTURING POLISHING PAD HAVING DETECTION WINDOW AND POLISHING PAD HAVING DETECTION WINDOW 有权
    具有检测窗口的抛光垫的制造方法和具有检测窗口的抛光垫

    公开(公告)号:US20140057540A1

    公开(公告)日:2014-02-27

    申请号:US14070074

    申请日:2013-11-01

    IPC分类号: B24B37/20

    摘要: A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window.

    摘要翻译: 提供了具有检测窗的抛光垫和制造抛光垫的方法。 虚拟检测窗口预先设置在模具中。 将抛光层前体填充到模具中,然后进行固化处理以形成抛光层,其中抛光层和虚拟检测窗口完全可分离。 抛光层和虚拟检测窗口彼此分离,以便在抛光层中形成检测孔。 检测开口也可以形成在具有突起结构的模具中以代替虚拟检测窗口。 将检测窗前体填充到检测口中,然后进行凝固处理,形成检测窗。

    APPARATUS AND METHOD FOR IN-SITU ENDPOINT DETECTION FOR SEMICONDUCTOR PROCESSING OPERATIONS
    38.
    发明申请
    APPARATUS AND METHOD FOR IN-SITU ENDPOINT DETECTION FOR SEMICONDUCTOR PROCESSING OPERATIONS 有权
    用于半导体处理操作的现场端点检测的装置和方法

    公开(公告)号:US20130130413A1

    公开(公告)日:2013-05-23

    申请号:US13745691

    申请日:2013-01-18

    IPC分类号: H01L21/66

    摘要: An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.

    摘要翻译: 端点检测方法包括处理衬底的外表面,将入射光束通过不透明金属体中的窗口引导到被处理的表面上,在检测器处接收来自衬底的反射光束,并从检测器产生信号 并且基于在检测器处接收的反射光产生信号,并且检测处理端点。 该信号是时变循环信号,其随着层的厚度随时间而变化,并且检测处理端点包括检测循环信号的周期的一部分已经过去,该部分小于全周期 循环信号。

    Process for manufacturing polishing pad
    39.
    发明授权
    Process for manufacturing polishing pad 有权
    制造抛光垫的工艺

    公开(公告)号:US08409308B2

    公开(公告)日:2013-04-02

    申请号:US12601725

    申请日:2008-05-15

    IPC分类号: B24B1/00 B24D11/00

    摘要: A method for manufacturing a polishing pad that has a high level of optical detection accuracy and is prevented from causing slurry leak from between the polishing region and the light-transmitting region includes preparing a cell-dispersed urethane composition by a mechanical foaming method; placing a light-transmitting region at a predetermined position on a face material or a belt conveyor, continuously discharging the cell-dispersed urethane composition onto a part of the face material or the belt conveyor where the light-transmitting region is not placed; placing another face material or belt conveyor on the discharged cell-dispersed urethane composition; curing the cell-dispersed urethane composition to form a polishing region including a polyurethane foam, so that a polishing sheet is prepared; applying a coating composition containing an aliphatic and/or alicyclic polyisocyanate to one side of the polishing sheet and curing the coating composition to form a water-impermeable film; and cutting the polishing sheet.

    摘要翻译: 一种制造具有高水平的光学检测精度并且防止从抛光区域和透光区域之间的浆料泄漏的抛光垫的方法包括通过机械发泡法制备细胞分散的聚氨酯组合物; 在面材料或带式输送机上的预定位置放置透光区域,将细胞分散的聚氨酯组合物连续排出到未放置透光区域的面材或带式输送机的一部分上; 将另一种面材或带式输送机放置在排出的细胞分散的聚氨酯组合物上; 固化细胞分散的聚氨酯组合物以形成包括聚氨酯泡沫的抛光区域,从而制备抛光片; 将包含脂族和/或脂环族多异氰酸酯的涂料组合物施用到抛光片的一侧并固化涂料组合物以形成不透水膜; 并切割抛光片。