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公开(公告)号：US09660608B2
公开(公告)日：2017-05-23
申请号：US14279845
申请日：2014-05-16
Applicant: K&L Microwave, Inc.
Inventor： Rafi Hershtig
CPC classification number: H03H7/46 , H01G4/00 , H01G4/02 , H01G7/00 , H03H7/0115 , H03H2001/0014 , H05K1/181 , Y10T29/417 , Y10T29/43
Abstract: A high power, low passive inter-modulation capacitor is presented, which is formed using metal clad substrates, which are broad-side coupled through a thin air gap. Each substrate may include metal layers affixed on both sides which are electrical coupled together to form a single capacitor plate, or each substrate may have only a single metal layer on the surface adjacent to the air gap. The capacitor has particular application in low cost RF and microwave filters, which may be used in communication equipment and communication test equipment such a diplexers, for low PIM applications.
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公开(公告)号：US20140247535A1
公开(公告)日：2014-09-04
申请号：US14279845
申请日：2014-05-16
Applicant: K&L Microwave, Inc.
Inventor： Rafi Hershtig
CPC classification number: H03H7/46 , H01G4/00 , H01G4/02 , H01G7/00 , H03H7/0115 , H03H2001/0014 , H05K1/181 , Y10T29/417 , Y10T29/43
Abstract: A high power, low passive inter-modulation capacitor is presented, which is formed using metal clad substrates, which are broad-side coupled through a thin air gap. Each substrate may include metal layers affixed on both sides which are electrical coupled together to form a single capacitor plate, or each substrate may have only a single metal layer on the surface adjacent to the air gap. The capacitor has particular application in low cost RF and microwave filters, which may be used in communication equipment and communication test equipment such a diplexers, for low PIM applications.
Abstract translation: 提出了一种高功率，低无源互调电容器，其使用金属覆层基板形成，其通过薄的气隙广泛耦合。 每个基板可以包括固定在两侧的金属层，其电耦合在一起以形成单个电容器板，或者每个基板可以在邻近气隙的表面上仅具有单个金属层。 该电容器在低成本RF和微波滤波器中具有特殊应用，可用于通信设备和通信测试设备（如双工器），用于低PIM应用。
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Patent Agency Ranking
33.发明申请DIELECTRIC CERAMIC, STACK CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THESE 有权电介质陶瓷，堆叠陶瓷电子元件及其制造方法公开(公告)号：US20130194717A1
公开(公告)日：2013-08-01
申请号：US13803925
申请日：2013-03-14
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Shoichiro Suzuki , Masanori Nakamura , Koichi Banno , Taisuke Kanzaki , Akihiro Shiota , Masahiro Otsuka
IPC: H01G4/30 , H01G4/00 , C04B35/468
CPC classification number: H01G4/30 , C01G25/006 , C01G29/006 , C04B35/468 , C04B35/4682 , C04B35/49 , C04B35/62685 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3248 , C04B2235/3281 , C04B2235/3298 , C04B2235/6562 , C04B2235/768 , C04B2235/79 , H01B3/12 , H01G4/00 , H01G4/1227
Abstract: A dielectric ceramic enabling low-temperature firing and exhibiting good dielectric characteristics, and a stack ceramic electronic component using the same are provided. The dielectric ceramic containing (Ba1-x-yCaxSry)m(Ti1-zZrz)O3 (1.005≦m≦1.2, 0≦x+y≦0.2, and 0≦z≦0.2) as a major component and an amount of Bi relative to 100 parts by mol of the major component which is 1.0 part by mol or more and 40 parts by mol or less.
Abstract translation: 提供能够进行低温烧制并且具有良好的介电特性的电介质陶瓷，以及使用其的叠层陶瓷电子元件。 含有（Ba1-x-yCaxSry）m（Ti1-zZrz）O3（1.005 @ m @ 1.2,0 @ x + y @ 0.2和0 @ z @ 0.2）作为主要成分的电介质陶瓷和Bi相对量 至100摩尔份的主成分为1.0摩尔％以上且40摩尔份以下。
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公开(公告)号：US20130152351A1
公开(公告)日：2013-06-20
申请号：US13767954
申请日：2013-02-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Makoto OGAWA , Seiichi MATSUMOTO , Akihiro MOTOKI , Toshiyuki IWANAGA , Tatsuo KUNISHI
IPC: H01G4/00
CPC classification number: H01G4/00 , C23C18/1632 , C23C18/1657 , C23C18/31 , C25D1/00 , C25D1/10 , H01G4/232 , H01G4/30 , H01G13/006 , Y10T29/43
Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.
Abstract translation: 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。
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公开(公告)号：US4327395A
公开(公告)日：1982-04-27
申请号：US187078
申请日：1980-09-15
Applicant: Takayuki Yagitani , Osamu Ebisu
Inventor： Takayuki Yagitani , Osamu Ebisu
Abstract: A container contains a metallized polypropylene capacitor that has electronegative gas occupying a majority of the space between its plates. The electronegative gas is not combined with a liquid. The remaining space in the container is occupied by coolant oil which can contain a gas.
Abstract translation: 容器包含金属化聚丙烯电容器，其具有占据其板之间的大部分空间的电负载气体。 电负性气体不与液体结合。 容器中的剩余空间被可容纳气体的冷却油所占据。
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公开(公告)号：US3221226A
公开(公告)日：1965-11-30
申请号：US7700160
申请日：1960-12-20
Applicant: EASTMAN KODAK CO
Inventor： KENNEDY WILLIAM D , JEFFERSON JAMES J , WATSON MARSHALL T
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公开(公告)号：US2576770A
公开(公告)日：1951-11-27
申请号：US10134749
申请日：1949-06-25
Applicant: EITEL MCCULLOUGH INC
Inventor： BALLOU BYRON O
IPC: H01G4/00
CPC classification number: H01G4/00
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