公开(公告)号：US11534824B2

公开(公告)日：2022-12-27

申请号：US16499572

申请日：2018-04-19

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Vladek Kasperchik ,  Mohammed S. Shaarawi ,  James McKinnell ,  Michael G. Monroe ,  Jason Hower

IPC: B22F1/10 ,  B33Y10/00 ,  B33Y40/10 ,  B33Y70/10 ,  B22F10/10 ,  C08F2/22 ,  C08F212/08 ,  C08F220/14 ,  C09D11/037 ,  C09D11/322 ,  C09D11/38 ,  B33Y70/00 ,  B29C64/165 ,  B22F10/14 ,  C08K3/11 ,  B22F1/05 ,  B22F1/102 ,  B22F1/16 ,  B22F10/73 ,  B82Y30/00

Abstract: An example of a composition includes a host metal present in an amount ranging from about 95.00 weight percent to about 99.99 weight percent, based on a total weight of the composition. A flow additive is present in an amount ranging from about 0.01 weight percent to about 5.00 weight percent, based on the total weight of the composition. The flow additive consists of a metal containing compound that is reducible to an elemental metal in a reducing environment at a reducing temperature less than or equal to a sintering temperature of the host metal. The elemental metal is capable of being incorporated into a bulk metal phase of the host metal in a final metal object. The composition is spreadable, having a Hausner Ratio less than 1.25.

公开(公告)号：US11465202B2

公开(公告)日：2022-10-11

申请号：US16609562

申请日：2019-04-01

Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION ,  Global Frontier Center for Multiscale Energy Systems

Inventor： Ki-Tae Nam ,  Hye-Eun Lee ,  Hyo-Yong Ahn ,  Nam-Heon Cho

IPC: B22F1/102 ,  B82B1/00 ,  B82B3/00 ,  C09K11/02 ,  C09K11/59 ,  B22F1/16 ,  B22F1/054 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00

Abstract: A three-dimensional chiral nanostructure according to an embodiment of the present invention comprises: metal nanoparticles having a chiral structure: and a coating layer enclosing the metal nanoparticles. The metal nanoparticle is formed in a polyhedral structure having an R region and an S region in which atoms are arranged clockwise and counterclockwise, respectively, in the order of (111), (100), and (110) crystal faces on the basis of the chiral center, wherein at least a portion of the edges form a curve tilting and extending from the R or S region so that the metal nanoparticle has a chiral structure.

公开(公告)号：US11453053B2

公开(公告)日：2022-09-27

申请号：US16096741

申请日：2017-04-25

Applicant: Dowa Electronics Materials Co., Ltd.

Inventor： Satoru Kurita ,  Tatsuro Hori ,  Keiichi Endoh ,  Hiromasa Miyoshi

IPC: B22F1/107 ,  B22F1/102 ,  H01B1/22 ,  H01L21/52 ,  H01L23/00 ,  B22F7/06 ,  B82Y30/00 ,  B82Y40/00 ,  H01B1/02

Abstract: There are provided a bonding material, which can prevent voids from being generated in a silver bonding layer by preventing the entrainment of bubbles during the formation of a coating film even if the coating film is thickened, and a bonding method using the same. The bonding material of a silver paste includes fine silver particles, a solvent and an addition agent, wherein the solvent contains a first solvent of a diol, such as octanediol, and a second solvent which is a polar solvent (preferably one or more selected from the group consisting of dibutyl diglycol, hexyl diglycol, decanol and dodecanol) having a lower surface tension than that of the first solvent and wherein the addition agent is a triol.

公开(公告)号：US11424059B2

公开(公告)日：2022-08-23

申请号：US16360269

申请日：2019-03-21

Applicant: TDK Corporation

Inventor： Kyohei Takahashi ,  Isao Kanada

IPC: H01F1/26 ,  H01F1/33 ,  H01F1/34 ,  H01F1/147 ,  B22F1/102 ,  B22F3/11 ,  C22C38/00

Abstract: The present invention provides a composite magnetic body comprising metal particles containing Fe or Fe and Co as a main component, a resin, and voids, wherein an average major axis diameter of the metal particles is 30 to 500 nm, an average aspect ratio of the metal particles is 1.5 to 10, and in a cross section of the composite magnetic body, a percent presence of the voids is 0.2 to 10 area % and an average equivalent circle diameter of the voids is 1 μm or less, and a saturation magnetization of the composite magnetic body is 300 to 600 emu/cm3.

公开(公告)号：US20220203438A1

公开(公告)日：2022-06-30

申请号：US17602409

申请日：2020-04-20

Applicant: Trustees of Dartmouth College

Inventor： John X.J. Zhang ,  Nanjing Hao ,  Yuan Nie

IPC: B22F1/054 ,  B01J19/00 ,  B22F1/065 ,  B22F1/102 ,  B22F1/16 ,  B22F1/17 ,  B22F9/24

Abstract: In an embodiment, the present disclosure pertains to a method of making magnetic nanoparticles through the utilization of a microfluidic reactor. In some embodiments, the microfluidic reactor includes a first inlet, a second inlet, and an outlet. In some embodiments, the method includes applying a magnetic nanoparticle precursor solution into the first inlet of the microfluidic reactor through a first flow rate and applying a reducing agent into the second inlet of the microfluidic reactor through a second flow rate. In some embodiments, the magnetic nanoparticles are produced in the microfluidic reactor and collected from the outlet of the microfluidic reactor. In an additional embodiment, the present disclosure pertains to a composition including a plurality of magnetic nanoparticles. In a further embodiment, the present disclosure pertains to a microfluidic reactor.

公开(公告)号：US11353305B2

公开(公告)日：2022-06-07

申请号：US16842889

申请日：2020-04-08

Applicant: Concurrent Technologies Corporation

Inventor： Todd Skowron ,  Juan Valencia ,  Shawn Rhodes

IPC: F42B5/045 ,  B21K21/04 ,  B21K21/14 ,  F42B33/00 ,  F42B5/285 ,  F42B5/28 ,  B29C45/00 ,  B22F3/16 ,  B22F1/102 ,  B22F3/22

Abstract: Disclosed is a cartridge case for various caliber ammunition that can consist essentially of a powdered metal and/or powdered metal alloy(s) that is formed into the cartridge case through an injection mold processing. Also disclosed is a method for forming a cartridge case, which may include use of Metal Injection Molding (“MIM”) processes to produce the cartridge case which retains a primer, propellant, and/or a bullet. Also disclosed are embodiments related to a case telescoped cartridge that may include a cap and a body. The body can consist essentially of or consists entirely of a powdered metal and/or powdered metal alloy(s) that has been formed through MIM. The cap can comprise plastic that has been formed through plastic molding or comprise powdered metal and/or powdered metal alloy(s) that has been formed through MIM.

公开(公告)号：US11311934B2

公开(公告)日：2022-04-26

申请号：US16973868

申请日：2019-06-26

Applicant: Nippon Chemical Industrial Co., Ltd.

Inventor： Tomonao Naruhashi ,  Hiroyuki Inaba

IPC: B22F1/18 ,  C08L25/14 ,  H01B5/16 ,  C09D125/08 ,  C08F212/08 ,  H01R11/01 ,  H01B5/00 ,  C08J3/12 ,  C08K3/08 ,  C08K5/3475 ,  B22F1/17 ,  B22F1/102

Abstract: The present invention provides covered particles wherein insulating layers cover the surfaces of electroconductive particles, and the covered particles are excellent in the adhesion between the surfaces of the electroconductive particles and the insulating layers. The covered particles includes: electroconductive particles in which metal films are formed on the surfaces of core materials, and a triazole-based compound is disposed on the outer surfaces on the sides opposite to the core materials in the metal films; and insulating layers covering the electroconductive particles, and the insulating layers comprise a compound having phosphonium groups.

公开(公告)号：US20220112090A1

公开(公告)日：2022-04-14

申请号：US17558111

申请日：2021-12-21

Applicant: M. TECHNIQUE CO., LTD.

Inventor： Masakazu ENOMURA ,  Daisuke HONDA

IPC: C01F17/235 ,  C01G49/06 ,  C01G9/02 ,  C09C1/24 ,  C01B33/02 ,  C01B33/32 ,  C01G53/00 ,  C09C3/06 ,  C01B13/14 ,  C01F17/206 ,  B22F1/054 ,  B22F1/102 ,  C01G49/02 ,  C09D7/62 ,  C09C1/04 ,  C09C3/12

Abstract: The present invention relates to silicon coated metal microparticles in which at least a part of a surface of a metal microparticle composed of at least one of metal elements or metalloid elements is coated with silicon, wherein the silicon coated metal microparticles are a product obtained by a reduction treatment of silicon compound coated precursor microparticles in which at least a part of a surface of a precursor microparticle containing a precursor of the metal microparticles is coated with a silicon compound, or silicon doped precursor microparticles containing a precursor of the metal microparticles. Because it is possible particularly to strictly control a particle diameter of the silicon compound coated metal microparticle by controlling conditions of the reduction treatment, design of a more appropriate composition can become facilitated, compared with a conventional composition, in terms of diversified usages and desired properties of silicon compound coated metal microparticles.

公开(公告)号：US20250033113A1

公开(公告)日：2025-01-30

申请号：US18386455

申请日：2023-11-02

Applicant: HYUNDAI MOTOR COMPANY ,  KIA CORPORATION

Inventor： Shin Gyu Kim ,  Jin Woo Kim ,  Joon Chul Yun ,  Hyun Gon Lyu

IPC: B22F1/065 ,  B22F1/102 ,  B22F3/03 ,  B22F9/10

Abstract: A hybrid-type soft magnetic mixed powder has improved compressibility and magnetic properties by mixing coarse alloy-based soft magnetic powder and fine pure iron-based soft magnetic powder. The hybrid-type soft magnetic mixed powder includes a mixture of 20 wt % to 50 wt % of a spherical alloy-based soft magnetic powder and 50 wt % to 80 wt % of an irregularly shaped pure iron-based soft magnetic powder. A method of forming the soft magnetic mixed powder includes mixing the alloy-based and iron-based powders and a soft magnetic material is formed using the soft magnetic mixed powder.

公开(公告)号：US20240336763A1

公开(公告)日：2024-10-10

申请号：US18700705

申请日：2022-10-04

Applicant: TANAKA KIKINZOKU KOGYO K.K.

Inventor： Hiroki SATO ,  Yuki FUJITA ,  Teruhisa IWAI ,  Yuusuke OHSHIMA ,  Shuntaro TAKAHASHI ,  Shigeyuki OOTAKE

IPC: C08K3/08 ,  B22F1/102 ,  B22F1/107 ,  B22F1/145 ,  C08L29/14

CPC classification number: C08K3/08 ,  B22F1/102 ,  B22F1/107 ,  B22F1/147 ,  C08L29/14 ,  B22F2301/255 ,  C08K2003/0806

Abstract: The present invention relates to a metal paste for forming a metal wiring containing a solid content of a silver particle and kneaded with a solvent. The solid content of the metal paste contains a silver particle having prescribed particle size distribution and average particle size, and using an amine compound as a protective agent. The solvent is a mixed solvent in which two organic solvents of a solvent A and a solvent B are mixed. The solvent A is dihydroterpineol or terpineol, and the solvent B is at least one organic solvent having a boiling point of 240° C. or more. The mixed solvent has a Hansen solubility parameter distance Ra from dihydroterpineol of 3.0 MPa1/2 or less. The metal paste further contains a high molecular weight ethyl cellulose as a first additive, and a polyvinyl acetal resin as a second additive.