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公开(公告)号：US20160121404A1
公开(公告)日：2016-05-05
申请号：US14891725
申请日：2014-05-20
发明人： Yuichi MAKITA , Yuusuke OHSHIMA , Hidekazu MATSUDA , Noriaki NAKAMURA , Junichi TANIUCHI , Hitoshi KUBO
CPC分类号： B22F9/30 , B22F1/0018 , B22F2301/255 , B22F2304/054 , B22F2304/056 , B22F2999/00
摘要： The present invention provides a method for producing silver particles, the method capable of adjusting the particle diameter to be within the range of several tens of nanometers to several hundreds of nanometers and also producing silver particles with a uniform particle diameter. The present invention relates to a method for producing silver particles by heating of a reaction system containing a thermally-decomposable silver-amine complex precursor, including a process of producing a silver-amine complex, a process of adding an organic compound having an amide (carboxylic amide) as a skeleton to a reaction system, and a process of heating the reaction system, in which a water content in the reaction system before the heating is 20 to 100 parts by weight relative to 100 parts by weight of the silver compound. The present invention can produce uniform silver particles while the particle diameter is controlled.
摘要翻译： 本发明提供一种银颗粒的制造方法，该方法能够将粒径调整在数十纳米至数百纳米的范围内，并且还可以制造具有均匀粒径的银粒子。 本发明涉及通过加热含有热分解性银 - 胺络合物前体的反应体系来制造银颗粒的方法，包括制备银 - 胺络合物的方法，加入具有酰胺的有机化合物的方法（ 羧酸酰胺）作为反应体系的骨架，以及加热反应体系的方法，其中相对于100重量份的银化合物，加热前的反应体系中的水含量为20〜100重量份。 本发明可以在控制粒径的同时产生均匀的银颗粒。
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公开(公告)号：US20240014335A1
公开(公告)日：2024-01-11
申请号：US18270464
申请日：2021-12-27
发明人： Hiroki SATO , Yuusuke OHSHIMA , Tatsuya NAKAZAWA , Hyung Jun KIM , Dong Hyun KIM
IPC分类号： H01L31/032 , H01L31/036 , H01L31/18 , C09K11/58 , C09K11/74
CPC分类号： H01L31/032 , H01L31/036 , H01L31/18 , C09K11/582 , C09K11/7407
摘要： The present invention relates to a photoelectric conversion element material provided with a base material and a light-receiving layer including a semiconductor film formed on the base material. The semiconductor film that forms this light-receiving layer includes Ag2−xBixSx+1 (x is an integer of 0 or 1) and has a crystallite diameter of 10 nm or more and 40 nm or less. The light-receiving layer can be produced by applying an ink containing the semiconductor nanoparticles dispersed in a dispersion medium to a base material and then firing the ink at 200° C. or higher and 350° C. or lower. The photoelectric conversion element material of the present invention has an absorption property with respect to light with wavelengths in the near infrared region and excellent photoresponsivity.
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3.发明公开公开(公告)号：US20230197311A1
公开(公告)日：2023-06-22
申请号：US18012647
申请日：2021-06-28
发明人： Hiroki SATO , Yuusuke OHSHIMA , Shigeyuki OOTAKE
CPC分类号： H01B1/22 , B22F3/10 , B22F1/107 , B22F1/056 , B22F5/12 , B22F2301/255 , B22F2003/1042 , B22F2304/056
摘要： The present invention relates to a metal wiring, to be formed on a flexible substrate, including a sintered body of silver particles. The sintered body constituting the metal wiring has a volume resistivity of 20 μΩ·cm or less, hardness of 0.38 GPa or less, and a Young's modulus of 7.0 GPa or less. A conductive sheet provided with the metal wiring can be produced by applying/calcinating, on a substrate, a metal paste containing, as a solid content, silver particles having prescribed particle size and particle size distribution, and further containing, as a conditioner, an ethyl cellulose having a number average molecular weight of 10,000 or more and 90,000 or less. The metal wiring of the present invention is excellent in bending resistance with change in electrical characteristics suppressed even through repetitive bending deformation.
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公开(公告)号：US20210324218A1
公开(公告)日：2021-10-21
申请号：US17272070
申请日：2019-08-15
发明人： Yuusuke OHSHIMA , Yuichi MAKITA , Hiroki SATO , Noriaki NAKAMURA , Kenjiro KOSHIJI , Masato KASUGA , Hitoshi KUBO
IPC分类号： C09D11/52 , C09D11/037
摘要： A silver ink including silver particles and a protective agent containing at least one amine compound dispersed in a dispersion medium containing, as a main solvent, a solvent having a vapor pressure at 20° C. of 40 mmHg or less and a vapor pressure at 70° C. of 0.09 mmHg or more, in an amount of 80% or more on a mass basis relative to the total dispersion medium. The amine compound has a mass average molecular weight of 115 or less, and the total amount of the amine compound is 1 part by weight or more and 14 parts by weight or less per 100 parts by weight of the silver particles. The silver ink has a moisture content of 500 ppm or more and 50,000 ppm or less and enables a practical metal film to be formed even through calcination at a low temperature of 70° C. or less.
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5.发明申请公开(公告)号：US20170108212A1
公开(公告)日：2017-04-20
申请号：US15127259
申请日：2015-03-23
申请人： TANAKA KIKINZOKU KOGYO K.K. , NATIONAL INSTITUTES FOR QUANTUM AND RADIOLOGICAL SCIENCE AND TECHNOLOGY
发明人： Yuusuke OHSHIMA , Hitoshi KUBO , Hirosi NOGUCHI , Junichi TANIUCHI , Yasunori IWAI , Katsumi SATO
CPC分类号： F23C13/08 , B01D53/86 , B01J23/44 , B01J27/13 , B01J29/0354 , B01J35/1019 , B01J35/1038 , B01J35/1042 , B01J35/1061 , B01J35/1066 , B01J37/0203 , B01J37/0207 , B01J37/0209 , B01J37/0236 , B01J37/08 , B01J37/18 , G21C9/06 , Y02E30/40
摘要： The hydrogen combustion catalyst includes a catalyst metal supported on a carrier made of an inorganic oxide, wherein: a functional group having at least one alkyl group with three or less carbon atoms is bonded to a terminal of a hydroxyl group on the carrier surface by substitution; platinum and palladium are supported as the catalyst metal; and a chlorine content is 300 ppm to 2,000 ppm per 1 mass % of the total supported amount of a supported amount of platinum and a supported amount of palladium. The total supported amount of platinum and palladium is preferably 0.1 to 5.0 mass % based on mass of a whole catalyst. In the hydrogen combustion catalyst according to the present invention, when treating a gas that contains iodine and hydrogen, catalyst poisoning by iodine is suppressed.
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公开(公告)号：US20240336763A1
公开(公告)日：2024-10-10
申请号：US18700705
申请日：2022-10-04
发明人： Hiroki SATO , Yuki FUJITA , Teruhisa IWAI , Yuusuke OHSHIMA , Shuntaro TAKAHASHI , Shigeyuki OOTAKE
CPC分类号： C08K3/08 , B22F1/102 , B22F1/107 , B22F1/147 , C08L29/14 , B22F2301/255 , C08K2003/0806
摘要： The present invention relates to a metal paste for forming a metal wiring containing a solid content of a silver particle and kneaded with a solvent. The solid content of the metal paste contains a silver particle having prescribed particle size distribution and average particle size, and using an amine compound as a protective agent. The solvent is a mixed solvent in which two organic solvents of a solvent A and a solvent B are mixed. The solvent A is dihydroterpineol or terpineol, and the solvent B is at least one organic solvent having a boiling point of 240° C. or more. The mixed solvent has a Hansen solubility parameter distance Ra from dihydroterpineol of 3.0 MPa1/2 or less. The metal paste further contains a high molecular weight ethyl cellulose as a first additive, and a polyvinyl acetal resin as a second additive.
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公开(公告)号：US20240150646A1
公开(公告)日：2024-05-09
申请号：US18278832
申请日：2022-02-22
申请人： NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM , TANAKA KIKINZOKU KOGYO K.K.
发明人： Tsukasa TORIMOTO , Tatsuya KAMEYAMA , Shuhei TSUNEIZUMI , Yumezo WATANABE , Mariko HASEGAWA , Hiroki SATO , Yuusuke OHSHIMA
CPC分类号： C09K11/582 , B82Y5/00 , B82Y20/00 , C09K11/025
摘要： The present invention is a semiconductor nanoparticle composed of a semiconductor crystal of a compound containing Ag, Au and S as essential constitutional elements. A AgAuS-based compound constituting the semiconductor nanoparticle has a total content of Ag, Au and S of 95 mass % or more. In addition, the compound is preferably a AgAuS ternary compound represented by the general formula Ag(nx)Au(ny)S(nz). In the formula, n is any positive integer. x, y and z represent proportions of the number of atoms of the respective atoms of Ag, Au and S in the compound and are real numbers satisfying 0
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公开(公告)号：US20220248538A1
公开(公告)日：2022-08-04
申请号：US17613569
申请日：2020-06-18
发明人： Kenjiro KOSHIJI , Yuichi MAKITA , Noriaki NAKAMURA , Masato KASUGA , Yuusuke OHSHIMA , Hiroki SATO , Shigeyuki OOTAKE , Hitoshi KUBO
摘要： The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.
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公开(公告)号：US20220015232A1
公开(公告)日：2022-01-13
申请号：US17294260
申请日：2019-11-13
发明人： Kenjiro KOSHIJI , Yuichi MAKITA , Noriaki NAKAMURA , Masato KASUGA , Yuusuke OHSHIMA , Hiroki SATO , Hitoshi KUBO
IPC分类号： H05K1/09 , C09D11/037 , H05K3/12 , H01B1/02
摘要： An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.
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10.发明申请METHOD FOR PRODUCING SILVER PARTICLES, AND SILVER PARTICLES PRODUCED BY SAID METHOD 审中-公开生产银颗粒的方法，以及通过方法生产的银颗粒公开(公告)号：US20160303659A1
公开(公告)日：2016-10-20
申请号：US15101859
申请日：2014-12-11
发明人： Yuichi MAKITA , Yuusuke OHSHIMA , Hidekazu MATSUDA , Junichi TANIUCHI , Noriaki NAKAMURA , Hitoshi KUBO
CPC分类号： B22F9/30 , B22F1/0003 , B22F1/0018 , B22F1/0062 , B22F2301/255 , B22F2304/054 , B22F2304/056 , B22F2998/10 , B82Y30/00 , B82Y40/00 , H01B1/02
摘要： The present invention provides a method for producing silver particles, including the steps of: mixing a thermally decomposable silver compound and an amine compound to prepare a silver-amine complex as a precursor; and heating the silver-amine complex at a heating temperature equal to or higher than the decomposition temperature of the silver-amine complex to precipitate silver particles, the silver compound being silver carbonate, the amine compound being terminated with a primary amino group on at least one end and containing a predetermined hydrocarbon group R with a carbon number of 4 to 10. In the method of the present invention, silver particles with the particle size controlled to fall within the range of 20 nm to 200 nm in terms of an average particle size can be produced.
摘要翻译： 本发明提供一种银粒子的制造方法，包括以下步骤：将可热分解的银化合物和胺化合物混合，制备作为前体的银 - 胺络合物; 并在银 - 胺络合物的分解温度以上的加热温度下加热银 - 胺络合物，沉淀银粒子，银化合物为碳酸银，至少在伯胺基上封端的胺化合物 一端并含有碳原子数为4〜10的规定的烃基R。在本发明的方法中，将粒径控制在20nm〜200nm范围内的银粒子平均粒子 尺寸可以生产。
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