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31.发明申请METHOD FOR PREPARING LOW-MELTING-POINT PLATING SOLUTION FOR ALUMINUM ELECTROPLATING, PLATING SOLUTION FOR ALUMINUM ELECTROPLATING, METHOD FOR PRODUCING ALUMINUM FOIL, AND METHOD FOR LOWERING MELTING POINT OF PLATING SOLUTION FOR ALUMINUM ELECTROPLATING 有权用于制备用于铝电镀的低熔点镀层溶液的方法，用于铝电镀的镀层溶液，用于生产铝箔的方法，以及用于降低铝电解镀层溶液的熔点的方法公开(公告)号：US20150068909A1
公开(公告)日：2015-03-12
申请号：US14381753
申请日：2013-02-27
申请人： HITACHI METALS, LTD.
发明人： Atsushi Okamoto , Junichi Matsuda
CPC分类号： C25D3/44 , C25D1/04 , C25D3/665 , H01G11/68 , H01G11/84 , H01M4/661 , H01M10/0525 , Y02E60/13 , Y02T10/7011 , Y02T10/7022
摘要： An object of the present invention is to provide a method for preparing a plating solution for aluminum electroplating useful for the production of a high-ductility, high-purity aluminum foil at a high film formation rate, etc., which is an easy-to-handle plating solution that does not solidify and allows for an electroplating treatment even at 25° C. The present invention as a means for achieving the object is characterized in that in a preparation of a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, the blending proportions of the dialkyl sulfone, the aluminum halide, and the nitrogen-containing compound are such that per 10 mol of the dialkyl sulfone, the aluminum halide is 3.5+n to 4.2+n mol, and the nitrogen-containing compound is n mol (wherein n is 0.001 to 2.0 mol). In addition, a plating solution for aluminum electroplating prepared by the method of the present invention allows for an electroplating treatment with high aluminum deposition efficiency relative to the current flow, and is thus advantageous in that electricity usage can be reduced, resulting in excellent economic efficiency.
摘要翻译： 本发明的目的是提供一种用于制备用于制备高成膜速率等的高延展性，高纯度铝箔的铝电镀用溶液的方法，该方法易于制备 即使在25℃下也不固化并允许进行电镀处理的手提电镀液。作为实现该目的的手段的本发明的特征在于，在制备含有至少（1）二烷基砜 ，（2）卤化铝和（3）含氮化合物，二烷基砜，卤化铝和含氮化合物的配合比例使得每10摩尔二烷基砜，卤化铝 为3.5 + n〜4.2 + n摩尔，含氮化合物为n摩尔（n为0.001〜2.0摩尔）。 此外，通过本发明的方法制备的用于电镀铝的电镀溶液允许相对于电流流动具有高的铝沉积效率的电镀处理，因此有利的是可以减少电力使用，从而获得优异的经济效率 。
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公开(公告)号：US08916039B2
公开(公告)日：2014-12-23
申请号：US13502442
申请日：2010-10-19
摘要： To provide a barrel electroplating method which is less prone to bare spots and adhesion failure such as blisters and peeling, and which makes it possible to obtain uniform plated coatings free from burnt deposits and poor brightness, irrespective of the amount of workpieces.The present invention provides a method for performing barrel electroplating by use of an aluminum or aluminum alloy plating bath, the method comprising rotating, swinging, or vibrating an anode (6) placed inside a barrel (4) receiving workpieces, and simultaneously rotating, swinging, or vibrating the barrel, with a voltage being applied between the anode and a cathode provided on an inner wall surface of the barrel.
摘要翻译： 提供一种不容易发生裸露斑点和粘附破坏（诸如水泡和剥离）的圆筒电镀方法，并且这使得可以获得均匀的镀覆涂层，不受烧焦沉积物和不良亮度的影响，而与工件数量无关。 本发明提供了一种通过使用铝或铝合金电镀液进行圆筒形电镀的方法，所述方法包括旋转，摆动或振动放置在容纳工件的筒体（4）内的阳极（6），同时旋转，摆动 或振动筒体，其中施加在阳极和设置在筒体的内壁表面上的阴极之间的电压。
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公开(公告)号：US20110259755A1
公开(公告)日：2011-10-27
申请号：US13128131
申请日：2009-11-04
申请人： Gerhard Reusmann , Werner Schauf , Martin Wiese
发明人： Gerhard Reusmann , Werner Schauf , Martin Wiese
摘要： The invention relates to an apparatus (1, 101, 201) for electrochemically coating a workpiece (22), including a coating reservoir (2, 102, 202) with a charge opening (5) and a supply reservoir (3, 103, 203), wherein the two reservoirs are in communication through a passage opening (4, 104, 204). The apparatus has at least one electrode (11) and one counter electrode (14). In order to prevent contamination of a coating liquid (20, 120, 220) during an electrochemical deposition process, the apparatus can be switched between a coating position and a rest position by rotating the supply and the coating reservoirs about at least one common axis (A, A′, A″) so that the center of gravity of the volume of the coating reservoir (2, 102, 202) in the coating position is lower in relation to the center of gravity of the volume of the supply reservoir (3, 103, 203) than in the rest position. The invention further relates to a method for coating workpieces.
摘要翻译： 本发明涉及一种用于电化学涂覆工件（22）的装置（1,101,201），其包括具有加料口（5）和供给储存器（3,103,203）的涂料储存器（2,102,202） ），其中两个储存器通过通道开口（4,104,204）连通。 该装置具有至少一个电极（11）和一个对电极（14）。 为了在电化学沉积过程中防止涂覆液体（20,120,220）的污染，可以通过围绕至少一个公共轴线旋转供给源和涂层储存器，从而在涂覆位置和静止位置之间切换设备（ A，A'，A“），使得涂层位置中的涂层储存器（2,102,202）的体积的重心相对于供应储存器（3）的体积的重心较低 ，103,203）比在休息位置。 本发明还涉及一种用于涂覆工件的方法。
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34.发明授权
公开(公告)号：US5091063A
公开(公告)日：1992-02-25
申请号：US533322
申请日：1990-06-05
IPC分类号： C25D3/44
CPC分类号： C25D3/44
摘要： The invention relates to organoaluminum electrotyles for the electrolytic deposition of aluminum which are characterized in that they consist of KF . 2 AlEt.sub.3 (A), KF . 2 AlMe.sub.3 (B) and MF . 2 Al(iBu).sub.3 (C), wherein M=sodium or potassium or a mixture of both, in a molar ratio of A:B:C of from 2:1:1 to 7:1:1. The organoaluminum electrolytes are dissolved in from 2 to 4.5 moles, based on the amount of MF employed, of an aromatic hydrocarbon which is liquid at 0.degree. C. The invention further relates to a process for the electrolytic deposition of aluminum on electrically conductive materials by using said electrolytes.
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公开(公告)号：US4950551A
公开(公告)日：1990-08-21
申请号：US250946
申请日：1988-09-29
申请人： Richard Doetzer , Georg Iwantscheff
发明人： Richard Doetzer , Georg Iwantscheff
CPC分类号： C25D5/56 , C25D3/44 , F16L58/08 , G21C3/07 , G21Y2002/10 , G21Y2002/201 , G21Y2002/206 , G21Y2004/10 , G21Y2004/40 , Y02E30/40 , Y10T428/12556 , Y10T428/12597 , Y10T428/12736
摘要： The invention provides a high-purity electroaluminum layer having a purity of greater than 99.99% and, preferably, a thickness of 10 to 20 .mu.m which serves as a gas barrier layer, particularly for hydrogen, oxygen, tritium and water vapor, for metallic materials and nonmetallic materials such as glass, quartz, ceramic and cermets with an electroconductive surface as well as for conductive plastics. By post-treatment, the electroaluminum layer can be compacted. The electroaluminum layer is precipitated by electroplating from aprotic oxygen-free and anhydrous electrolyte media of the general formula M.sup.I X.2AlR.sub.3.nLsm, wherein M.sup.I is an alkali metal ion or a quaternary onium ion, X is a halogen ion, preferably F.sup.- or Cl.sup.-, R is an alkyl radical, preferably CH.sub.3, C.sub.2 H.sub.5, C.sub.3 H.sub.7 or C.sub.4 H.sub.9, Lsm is an aromatic solvent molecule, preferably toluene, ethyl benzene, xylene or a mixture thereof, and n=0 to 12, at a bath temperature of 50.degree. to 110.degree. C. and a current density of 0.5 to 10 A/dm.sup.2 under intensive bath agitation. Electroplating may be conducted in the presence of an aromatic solvent.
摘要翻译： 本发明提供纯度大于99.99％，优选厚度为10至20μm的高纯度电致铝层，其用作气体阻隔层，特别是用于氢，氧，氚和水蒸气的金属 材料和非金属材料如玻璃，石英，陶瓷和具有导电表面的金属陶瓷以及导电塑料。 通过后处理，电铝层可以被压实。 通过电解从非质子无氧和无水的通式MIX.2AlR3.nLsm的电解质介质沉淀电解铝层，其中MI是碱金属离子或季鎓离子，X是卤素离子，优选F-或Cl - ，R为烷基，优选为CH3，C2H5，C3H7或C4H9，Lsm为芳族溶剂分子，优选甲苯，乙苯，二甲苯或其混合物，n = 0至12，浴温为50℃ 至110℃，电流密度为0.5-10A / dm 2。 电镀可以在芳族溶剂的存在下进行。
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公开(公告)号：US4778575A
公开(公告)日：1988-10-18
申请号：US146626
申请日：1988-01-21
申请人： Anton Mayer
发明人： Anton Mayer
摘要： Electrolytes and plating solutions for use in processes for electroplating and electroforming pure magnesium and alloys of aluminum and magnesium and also electrodeposition processes. An electrolyte of this invention is comprised of an alkali metal fluoride or a quaternary ammonium halide, dimethyl magnesium and/or diethyl magnesium, and triethyl aluminum and/or triisobutyl aluminum. An electrolyte may be dissolved in an aromatic hydrocarbon solvent to form a plating solution. The proportions of the component compounds in the electrolyte are varied to produce essentially pure magnesium or magnesium/aluminum alloys having varying selected compositions.
摘要翻译： 用于电镀和电铸纯镁和铝和镁合金以及电沉积工艺的电解液和电镀液。 本发明的电解质由碱金属氟化物或季铵卤化物，二甲基镁和/或二乙基镁以及三乙基铝和/或三异丁基铝组成。 电解质可以溶解在芳族烃溶剂中以形成电镀液。 改变电解质中组分化合物的比例，以产生具有不同选定组成的基本上纯的镁或镁/铝合金。
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37.发明授权
公开(公告)号：US4747916A
公开(公告)日：1988-05-31
申请号：US92517
申请日：1987-09-03
申请人： Yoshio Kato , Setsuko Takahashi
发明人： Yoshio Kato , Setsuko Takahashi
IPC分类号： C25D3/44
CPC分类号： C25D3/44
摘要： In a plating bath for electrodeposition of aluminum, comprising a nonaqueous electrolyte using a eutectic mixture fusible at room temperature, the plating bath comprises a mixture of about 40 to 80 mol % of an aluminum halide and about 20 to 60 mol % of butyl pyridinium halide, or further comprises an organic solvent mixed in said mixture. This plating bath may not cause any color change of a coating into gray or black to assure white and uniform appearance, even when current density is increased to 30 A/dm.sup.2 or varied in the range from 0.1 to 30 A/dm.sup.2.
摘要翻译： 在用于电沉积铝的电镀浴中，包括使用在室温下易熔的共晶混合物的非水电解质，电镀浴包含约40至80mol％的卤化铝和约20至60mol％的丁基吡啶鎓卤化物的混合物 ，或进一步包含混合在所述混合物中的有机溶剂。 即使当电流密度增加到30A / dm2或者在0.1A / dm 2的范围内变化时，该镀浴也可能不会使涂层变灰或变黑，以确保白色和均匀的外观。
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公开(公告)号：US4659440A
公开(公告)日：1987-04-21
申请号：US790937
申请日：1985-10-24
申请人： Rudolf Hradcovsky
发明人： Rudolf Hradcovsky
CPC分类号： C25D11/14 , C25D11/026 , C25D11/06
摘要： An electrolytic bath for coating articles of aluminum and its alloys consists essentially of an aqueous solution containing an alkali metal silicate, a peroxide, a water-soluble carboxylic group-containing organic acid and a water-soluble fluoride. A vanadium compound may also be included in the bath whenever the coated articles are intended to be used for decorative purposes. In the process, the aluminum article is immersed in the bath and a voltage shock is applied thereto by imposing a voltage potential between the aluminum metal serving as the anode and a cathode immersed in the bath. The voltage potential is quickly raised to about 300 volts within about 2 to about 10 seconds and thereafter, the voltage is increased gradually to about 450 volts within a few minutes until the desired coating thickness is formed.
摘要翻译： 用于涂覆铝及其合金的电解液基本上由含有碱金属硅酸盐，过氧化物，水溶性含羧基的有机酸和水溶性氟化物的水溶液组成。 每当涂覆的制品意图用于装饰目的时，也可以在浴中包括钒化合物。 在该过程中，将铝制品浸入浴中，并通过在用作阳极的铝金属和浸入浴中的阴极之间施加电压来施加电压冲击。 电压电位在约2至约10秒钟内迅速升高至约300伏特，此后，电压在几分钟内逐渐增加至约450伏，直到形成所需的涂层厚度。
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公开(公告)号：US4624754A
公开(公告)日：1986-11-25
申请号：US741340
申请日：1985-06-05
摘要： An ionic liquid composition for the electrode position of metals and more particularly to compositions using non-aqueous organic electrolytic solutions.
摘要翻译： 一种用于金属电极位置的离子液体组合物，更具体地说，涉及使用非水有机电解液的组合物。
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40.发明授权
公开(公告)号：US4152220A
公开(公告)日：1979-05-01
申请号：US867768
申请日：1978-01-09
申请人： Jack Y. Wong
发明人： Jack Y. Wong
摘要： Aluminum or an alloy thereof is electroplated upon electrically conductive substrates by immersing the substrate as a cathode in a novel stable electrolyte, made by (a) reacting aluminum with a hydrogen halide or a halogen and hydrogen halide, in the absence of water, but in one of several organic, non-Lewis base solvents or mixtures thereof to form an intermediate aluminum halide cation in solution, the concentration of the aluminum cation and the concentration of hydrogen ion in solution being, respectively, below about 5.0 M and 0.4 M and preferably containing an aluminum cation concentration extending between 2.7 M and 4.2 M and a [H.sup.+ ] ion concentration extending between about 0.01 M and about 0.3 M, the exact maximum amount of [H.sup.+ ] ion concentration depending upon the aluminum ion concentration (there is a direct, substantially linear, relationship between the [Al.sup.+3 ] ion concentration and [H.sup.+ ] ion concentration); and (b) then adding a restricted amount, preferably less than about 16 mole% relative to the initial quantity of aluminum added, of a metal halide, MX where M=Li, Na, or K and X=Cl, Br, or I, or where MX is a special halide such as beryllium bromide, magnesium bromide, or quaternary ammonium bromide to form a different, stable aluminum cationic plating species.
摘要翻译： 通过将基板作为阴极浸渍在新的稳定电解质中，通过（a）在不存在水的情况下使铝与卤化氢或卤素和卤化氢反应而制备的铝或其合金被电镀在导电基板上，但是 几种有机，非路易斯碱溶剂或其混合物之一，以在溶液中形成中间体卤化铝阳离子，铝阳离子的浓度和溶液中氢离子的浓度分别低于约5.0M和0.4M，优选 含有延伸在2.7M和4.2M之间的铝阳离子浓度和在约0.01M和约0.3M之间延伸的[H +]离子浓度，[H +]离子浓度的确切最大量取决于铝离子浓度（存在直接 ，[Al + 3]离子浓度和[H +]离子浓度之间的基本线性关系）; 和（b）然后相对于添加的铝的初始量添加限制量，优选小于约16摩尔％的金属卤化物MX，其中M = Li，Na或K，X = Cl，Br或I ，或其中MX是特殊的卤化物如溴化铍，溴化镁或溴化季铵，以形成不同的稳定的铝阳离子电镀物质。
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