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公开(公告)号:US20210253419A1
公开(公告)日:2021-08-19
申请号:US17175410
申请日:2021-02-12
Applicant: STMicroelectronics S.r.l.
Inventor: Enrico Rosario ALESSI , Fabio PASSANITI
Abstract: An analysis method of a device through a MEMS sensor is provided in which the MEMS sensor includes a control unit and a sensing assembly coupled to the device. The analysis method includes acquiring, through the sensing assembly, first data indicative of an operative state of the device. Testing is performed for the presence of a first abnormal operating condition of the device. If the first abnormal operating condition of the device is confirmed, a self-test of the sensing assembly is performed to generate a quantity indicative of an operative state of the sensing assembly. The self-test includes acquiring, through the sensing assembly, second data indicative of the operative state of the sensing assembly, generating a signature according to the second data, and processing the signature through deep learning techniques to generate said quantity.
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公开(公告)号:US11094807B2
公开(公告)日:2021-08-17
申请号:US16561670
申请日:2019-09-05
Applicant: STMicroelectronics S.r.l.
Inventor: Alberto Cattani , Alessandro Gasparini
IPC: H01L29/739 , H02M3/158 , H02M1/32 , H02M1/088
Abstract: A power MOS stage includes a first power MOS device and a second power MOS devices connected in parallel between a first node and a second node, the first power MOS device having a first voltage rating and the second power MOS device having a second voltage rating that is lower than the first voltage rating. A driver circuit is configured to drive control nodes of the first and second power MOS devices in a sequential manner when actuating the power MOS stage by actuating the first power MOS device before actuating the second power MOS device. The control nodes of the first and second power MOS devices are further driven in a sequential manner when deactuating the power MOS stage by deactuating the second power MOS device before deactuating the first power MOS device.
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393.
公开(公告)号:US11086122B2
公开(公告)日:2021-08-10
申请号:US16222027
申请日:2018-12-17
Applicant: STMicroelectronics S.r.l.
Inventor: Roberto Carminati , Massimiliano Merli , Nicolo′ Boni
Abstract: A microelectromechanical device includes a body of semiconductor material, which forms a cavity, a mobile structure, and an actuation structure. The actuation structure includes at least one first deformable element which faces the cavity and is mechanically coupled to the body and to the mobile structure, and a piezoelectric-actuation system which can be controlled so as to deform the first deformable element and cause a consequent rotation of the mobile structure. The mobile structure includes a supporting region and at least one first pillar region, the first pillar region being mechanically coupled to the first deformable element, the supporting region being set on the first pillar region and overlying at least part of the first deformable element.
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394.
公开(公告)号:US11085769B2
公开(公告)日:2021-08-10
申请号:US16243876
申请日:2019-01-09
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V.
Inventor: Carlo Valzasina , Huantong Zhang , Matteo Fabio Brunetto , Gert Ingvar Andersson , Erik Daniel Svensson , Nils Einar Hedenstierna
IPC: G01C19/5776 , G01C19/5719 , G01C19/574 , G01C19/5747
Abstract: A gyroscope includes a substrate, a first structure, a second structure and a third structure elastically coupled to the substrate and movable along a first axis. The first and second structure are arranged at opposite sides of the third structure with respect to the first axis A driving system is configured to oscillate the first and second structure along the first axis in phase with one another and in phase opposition with the third structure. The first, second and third structure are provided with respective sets of sensing electrodes, configured to be displaced along a second axis perpendicular to the first axis in response to rotations of the substrate about a third axis perpendicular to the first axis and to the second axis.
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公开(公告)号:US11079232B2
公开(公告)日:2021-08-03
申请号:US16511152
申请日:2019-07-15
Applicant: STMicroelectronics S.r.l.
IPC: G01C19/72
Abstract: A device includes an optical resonator having four ports including a first port, a second port, a third port, and a fourth port. A first electronic circuit is configured to calculate a first information representative of a power difference between optical signals supplied by two of the four ports. A method of operating a device is also disclosed.
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公开(公告)号:US11077755B2
公开(公告)日:2021-08-03
申请号:US16420875
申请日:2019-05-23
Applicant: STMicroelectronics S.r.l.
Inventor: Orazio Pennisi , Valerio Bendotti , Vanni Poletto
IPC: B60L3/00 , G01R31/385 , B60L50/64 , H02J7/00 , H03M3/00
Abstract: A circuit includes a differential stage configured to provide a differential output signal. An analog-to-digital converter is coupled to first and second output nodes of the differential stage. The analog-to-digital converter is configured to provide an output signal that is a function of the differential output signal from the differential stage. A multiplexer is configured to receive a differential input signal. The multiplexer includes a test switch switchable between a conductive state and a non-conductive state. In the conductive state, the test switch couples the first input node and the second input node of the differential stage. Test signal injection circuitry is activatable to force a differential current through the differential stage. The circuit is selectively switchable between an operational mode and a self-test mode.
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397.
公开(公告)号:US20210233884A1
公开(公告)日:2021-07-29
申请号:US17158781
申请日:2021-01-26
Applicant: STMicroelectronics S.r.l.
Inventor: Fulvio Vittorio FONTANA
IPC: H01L23/00 , H01L21/56 , H01L23/31 , H01L25/065 , G01N21/956
Abstract: A semiconductor product includes a layer of semiconductor die package molding material embedding a semiconductor die having a front surface and an array of electrically-conductive bodies such as spheres or balls around the semiconductor die. The electrically-conductive bodies have front end portions around the front surface of the semiconductor die and back end portions protruding from the layer of semiconductor die package molding material. Electrically-conductive formations are provided between the front surface of the semiconductor die and front end portions of the electrically-conductive bodies left uncovered by the package molding material. Light-permeable sealing material can be provided at electrically-conductive formations to facilitate inspecting the electrically-conductive formations via visual inspection through the light-permeable sealing material.
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公开(公告)号:US20210232174A1
公开(公告)日:2021-07-29
申请号:US17159511
申请日:2021-01-27
Inventor: Ignazio PISELLO , Yu Yong WANG , Dario ARENA , Qi Yu LIU
IPC: G06F1/06 , G01R31/317
Abstract: A combinational circuit block has input pins configured to receive input digital signals and output pins configured to provide output digital signals as a function of the input digital signals received. A test input pin receives a test input signal. A test output pin provides a test output signal as a function of the test input signal received. A set of scan registers are selectively coupled to either the combinational circuit block or to one another so as to form a scan chain of scan registers serially coupled between the test input pin and the test output pin. The scan registers in the set of scan registers are clocked by a clock signal. At least one input register is coupled between the test input pin and a first scan register of the scan chain. The at least one input register is clocked by an inverted replica of the clock signal.
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公开(公告)号:US20210226624A1
公开(公告)日:2021-07-22
申请号:US17150156
申请日:2021-01-15
Applicant: STMicroelectronics S.r.l.
Inventor: Giuseppe Maiocchi , Ezio Galbiati , Michele Boscolo Berto , Maurizio Ricci
IPC: H03K17/687
Abstract: An embodiment half-bridge control circuit comprises an input terminal, an output terminal for providing a pulsed signal to a half-bridge driver circuit configured to drive two electronic switches connected between two supply terminals, and a feedback terminal for receiving a feedback signal indicative of the instantaneous voltage value at a switching node between the two electronic switches. A selector circuit provides a digital feedback signal. A subtractor generates an error signal by subtracting the digital feedback signal from the reference signal. An integrator generates an integration signal by integrating the value of the error signal. A down-scale circuit generates a reduced resolution integration signal by discarding one or more least significant bits of the integration signal. A sampling circuit generates a sampled integration signal by sampling the reduced resolution integration signal. A pulse generator circuit generates the pulsed signal as a function of the sampled integration signal.
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400.
公开(公告)号:US20210226527A1
公开(公告)日:2021-07-22
申请号:US17151397
申请日:2021-01-18
Applicant: STMicroelectronics S.r.l.
Inventor: Alfio Pasqua , Salvatore Tumminaro , Marco Sammartano , Claudio Adragna
IPC: H02M1/42
Abstract: An embodiment PFC control circuit comprises a first terminal providing a drive signal to an electronic switch of a boost converter, a second terminal receiving a feedback signal indicative of an output voltage generated by the boost converter, and a third terminal connected to a compensation network. An error amplifier generates a current as a function of the voltage at the second terminal and a reference voltage, wherein an output of the error amplifier is coupled to the third terminal. A driver circuit generates the drive signal as a function of the voltage at the third terminal, and selectively activates or deactivates the generation of the drive signal as a function of a burst mode enable signal. A detection circuit generates the burst mode enable signal as a function of the voltage at the second terminal.
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