Abstract:
An image sensor having improved dynamic range includes a signal that is read out for a selection of pixels which act as a calibration to govern the choice of exposure levels to be applied to the rest of the array. In this way, the sensor is operable to adapt to variations in scene intensity. The pixels in the array are vertically and horizontally addressed so as to enable accounted for small areas of intensity variation across an imaged scene.
Abstract:
A method for transmitting data on a configurable bus of z physical links, including receiving input data on an input bus at at least one of a plurality of data rates, selecting a number of physical links n, amongst the z physical links, on which data is to be transmitted, selecting a clock frequency f at which the data is to be transmitted on the configurable bus, wherein the selections of n and f are based on information concerning the at least one of the plurality of data rates, the number of links used on the input bus.
Abstract:
The broadcasting of audio contents by two loudspeakers is controlled by delivering a first audio content to the two loudspeakers and a further processing in which an auxiliary audio content is received. A second audio content is formed by temporally delaying the auxiliary audio content with a delay dependent on the spacing between the loudspeakers and on a distance between a first loudspeaker and a spot located in front of this first loudspeaker. The second audio content is delivered to the first loudspeaker. A third audio content is formed by inverting the auxiliary audio content. The third audio content is then delivered to the second loudspeaker.
Abstract:
An optical package includes a substrate made of a first material having an upper surface and a lower surface. The substrate further includes at least one cavity opening onto an upper surface of the substrate. Electrical connection vias extend through the substrate. An electronic integrated circuit chip is mounted on the upper surface of the substrate in a position so as to cover the at least one cavity. The electronic integrated circuit chip includes an integrated optical sensor. Each cavity is filled with a second material having a thermal conductivity greater than the thermal conductivity of the first material. The electrical connection vias are arranged on either side of each cavity and between two cavities.
Abstract:
A near-field communication device operates to transmit data by near-field communications techniques to another device. The near-field communication device includes a memory that stores a message to be transmitted in an ASCII format. The message is retrieved from the memory and transmitted using the near-field communications techniques in an ASCII format.
Abstract:
In an embodiment, a system includes a contactless reader and an apparatus. The apparatus includes a contactless transponder including a contactless interface and a transponder wired interface and being configured to communicate with a contactless reader according to a contactless protocol through the contactless interface. The apparatus includes a bus coupled to the transponder wired interface, and at least one module coupled to the bus, the at least one module including a processing circuit, the contactless reader being configured to communicate instructions of a software program executable by the processing circuit to the at least one module through the contactless transponder.
Abstract:
An embodiment of the present disclosure relates to a method of detection of a touch contact by a sensor including a first step of comparison of a voltage with a first voltage threshold; and a second step of comparison of the voltage with a second voltage threshold, the second step being implemented if the first voltage threshold has been reached within a duration shorter than a first duration threshold, the second voltage threshold being higher than the first voltage threshold.
Abstract:
An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.
Abstract:
In an embodiment an apparatus includes a contactless transponder including a contactless interface and a wired interface, wherein the contactless transponder is configured to communicate with a contactless reader according to a contactless protocol through the contactless interface, a wired communication bus connected to the wired interface and at least one module connected to the bus, wherein the transponder is configured so that the reader is a master on the bus when the reader and the transponder communicate.
Abstract:
In an embodiment an envelope detection device includes an input terminal configured to receive an amplitude-modulated radio frequency signal, a first resistive element and a first MOS transistor connected in parallel between the input terminal and a first node configured to receive a reference potential, a first capacitive element connected between a gate of the first MOS transistor and the first node, an envelope detection circuit connected to the input terminal and configured to supply a voltage representative of an envelope of the amplitude-modulated signal and a circuit for controlling the first MOS transistor configured to supply a first current to the gate of the first MOS transistor only when the voltage is smaller than a first threshold and draw a second current from the gate of the first MOS transistor only when the voltage is higher than a second threshold, the second threshold being higher than the first threshold.