公开(公告)号：US20210098490A1

公开(公告)日：2021-04-01

申请号：US17099706

申请日：2020-11-16

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Jin-Woo Han ,  Eli Lusky

IPC: H01L27/11582 ,  H01L27/1157 ,  H01L27/11565 ,  G11C7/18 ,  H01L29/423

Abstract: A 3D memory device, the device including: a plurality of memory cells, where each of the plurality of memory cells includes at least one memory transistor, where each of the at least one memory transistor includes a source and a drain; a plurality of bit-line pillars, where each of the plurality of bit-line pillars is directly connected to a plurality of the source or the drain, where each of the plurality of bit-line pillars includes metal atoms such that the plurality of bit-line pillars have at least partial metallic properties; and a thermal path from the bit-line pillars to an external surface of the device to remove heat. Various 3D processing flows and methods are also disclosed.

公开(公告)号：US10950599B1

公开(公告)日：2021-03-16

申请号：US17064504

申请日：2020-10-06

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist

IPC: H01L27/06 ,  H01L23/00

Abstract: A 3D semiconductor device, the device comprising: a first level, wherein said first level comprises a first layer, said first layer comprising first transistors, and wherein said first level comprises a second layer comprising first interconnections; a second level overlaying said first level, wherein said second level comprises a third layer, said third layer comprising second transistors, and wherein said second level comprises a fourth layer comprising second interconnections; and a plurality of connection paths, wherein said plurality of connection paths provides connections from a plurality of said first transistors to a plurality of said second transistors, wherein said second level is bonded to said first level, wherein said bonded comprises oxide to oxide bond regions and metal to metal bond regions, wherein said second level comprises at least one memory array, wherein said third layer comprises crystalline silicon, and wherein said second level comprises at least one SerDes circuit.

公开(公告)号：US10943934B2

公开(公告)日：2021-03-09

申请号：US17027217

申请日：2020-09-21

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Paul Lim

IPC: H01L27/146 ,  H01L31/0232 ,  H01L25/04 ,  H01L31/0368 ,  H01L31/102 ,  H01L27/28 ,  H01L27/12

Abstract: A multi-level semiconductor device, the device including: a first level including integrated circuits; a second level including an optical waveguide, where the second level is disposed above the first level, where the first level includes crystalline silicon; and an oxide layer disposed between the first level and the second level, where the second level is bonded to the oxide layer, and where the bonded includes oxide to oxide bonds.

公开(公告)号：US10896931B1

公开(公告)日：2021-01-19

申请号：US17013823

申请日：2020-09-07

Applicant: Monolithic 3D Inc.

Inventor： Deepak C. Sekar ,  Zvi Or-Bach

IPC: H01L21/00 ,  H01L27/24 ,  H01L21/683 ,  H01L21/762 ,  H01L21/822 ,  H01L21/84 ,  H01L27/06 ,  H01L27/108 ,  H01L27/11 ,  H01L27/11529 ,  H01L27/11551 ,  H01L27/11578 ,  H01L27/12 ,  H01L29/78 ,  H01L29/423 ,  H01L27/22 ,  H01L21/268 ,  H01L27/105 ,  H01L27/11526 ,  H01L27/11573 ,  H01L45/00

Abstract: A 3D semiconductor device, the device including: a first level including a first single crystal layer and first transistors, where the first transistors each include a single crystal channel; first metal layers interconnecting at least the first transistors; and a second level including a second single crystal layer and second transistors, where the second level overlays the first level, where the second transistors are horizontally oriented and each include at least two side gates, where the second level is bonded to the first level, and where the bonded includes oxide to oxide bonds.

公开(公告)号：US10892169B2

公开(公告)日：2021-01-12

申请号：US16114211

申请日：2018-08-28

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist ,  Deepak Sekar

IPC: H01L27/098 ,  H01L23/498 ,  H01L21/48 ,  H01L27/02 ,  H01L21/8234 ,  H01L27/06 ,  H01L25/065 ,  H01L27/092 ,  H01L23/60 ,  H01L23/522 ,  H01L23/367 ,  H01L25/00 ,  H01L27/088 ,  H01L23/34 ,  H01L23/373 ,  H01L27/108

Abstract: A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors and a first metal layer, where the first metal layer includes interconnecting the first transistors forming, at least in part a plurality of logic gates; a plurality of second transistors overlaying, at least in part the first single crystal layer; a plurality of third transistors overlaying, at least in part the second transistors; a plurality of fourth transistors overlaying, at least in part the third transistors; a second metal layer overlaying, at least in part the fourth transistors; where the fourth transistors are aligned with less than 100 nm misalignment to the first transistors, where at least one of the plurality of vias has a radius of less than 200 nm, where a memory cell includes at least one of the third transistors.

公开(公告)号：US20210005762A1

公开(公告)日：2021-01-07

申请号：US17027217

申请日：2020-09-21

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Paul Lim

IPC: H01L31/0232 ,  H01L31/102 ,  H01L31/0368 ,  H01L25/04

Abstract: A multi-level semiconductor device, the device including: a first level including integrated circuits; a second level including an optical waveguide, where the second level is disposed above the first level, where the first level includes crystalline silicon; and an oxide layer disposed between the first level and the second level, where the second level is bonded to the oxide layer, and where the bonded includes oxide to oxide bonds.

公开(公告)号：US10777540B2

公开(公告)日：2020-09-15

申请号：US16450728

申请日：2019-06-24

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach

IPC: H01L21/00 ,  H01L23/02 ,  H01L25/07 ,  H01L23/544 ,  H01L25/065

Abstract: A 3D semiconductor device and structure, including: a first die including first transistors and first interconnect, overlaid by a second die including second transistors and second interconnect, where the first die has a first die area and the second die has a second die area, where the first die area is at least 10% larger than the second die area, where the second die is aligned to the first die with less than 400 nm alignment error, and where the second die has a thickness of less than four microns.

公开(公告)号：US20200243487A1

公开(公告)日：2020-07-30

申请号：US16846298

申请日：2020-04-11

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/552 ,  H01L25/00

Abstract: A 3D semiconductor device including: a first level, where the first level includes a first layer, the first layer including first transistors, and where the first level includes a second layer, the second layer including first interconnections; a second level overlaying the first level, where the second level includes a third layer, the third layer including second transistors, and where the second level includes a fourth layer, the fourth layer including second interconnections; a trap-rich layer disposed between the first level and the second level; and a plurality of connection paths, where the plurality of connection paths provides connections from a plurality of the first transistors to a plurality of the second transistors, where the plurality of connection paths includes vertical connections connecting from the first interconnections to the second interconnections, where the third layer includes crystalline silicon, and where the second level is bonded to the first level.

公开(公告)号：US10679977B2

公开(公告)日：2020-06-09

申请号：US15920499

申请日：2018-03-14

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak C. Sekar

IPC: H01L27/146 ,  H01L25/16 ,  H01L21/762 ,  H01L23/00 ,  H01L21/8238 ,  H01L21/84 ,  H01L33/38 ,  H01L25/075 ,  H01L27/12 ,  H01L27/28 ,  H01L33/32 ,  H01L33/06 ,  H01L33/00 ,  H01L33/30 ,  H01L27/15

Abstract: A 3D micro display, the micro display including: a first single crystal layer including at least one LED driving circuit; and a second single crystal layer including a plurality of light emitting diodes (LEDs), where the second single crystal layer overlays the first single crystal layer, where the second single crystal layer includes at least ten first LED pixels, and where the second single crystal layer and the first single crystal layer are separated by a vertical distance of less than ten microns.

公开(公告)号：US10600657B2

公开(公告)日：2020-03-24

申请号：US16113860

申请日：2018-08-27

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist ,  Deepak Sekar

IPC: H01L21/48 ,  H01L23/498 ,  H01L21/8234 ,  H01L23/34 ,  H01L27/098 ,  H01L27/092 ,  H01L27/02 ,  H01L27/06 ,  H01L25/065 ,  H01L23/60 ,  H01L23/522 ,  H01L25/00 ,  H01L23/373 ,  H01L23/367

Abstract: A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors and a first metal layer, where the first metal layer includes interconnecting the first transistors forming, at least in part a plurality of logic gates; a plurality of second transistors overlaying, at least in part the first single crystal layer; a plurality of third transistors overlaying, at least in part the second transistors; a second metal layer overlaying, at least in part the third transistors; Input/Output pads to provide connection to external devices, a local power grid to distribute power to the plurality of logic gates, where the third transistors are aligned to the first transistors with less than 40 nm misalignment, where the first single crystal layer includes an Serializer/Deserializer (“SerDes”) structure connected to at least one of the Input/Output pads, where a memory cell includes at least one of the third transistors.