公开(公告)号：US20250105650A1

公开(公告)日：2025-03-27

申请号：US18970275

申请日：2024-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaedeok CHA

IPC: H02J7/00 ,  H02M1/00 ,  H02M3/158

Abstract: This electronic device may comprise: a charging circuit configured to supply power to a battery, wherein: the charging circuit comprises: a first buck circuit including a first switching element and a second switching element, a second buck circuit including a third switching element and a fourth switching element, and a boost circuit including a fifth switching element and a sixth switching element, each of the switching elements including a switch; an input voltage is applied to an input node of the first switching element and an input node of the third switching element; one end of a first inductor is connected to a first connection node between the first switching element and the second switching element of the first buck circuit; one end of a second inductor is connected to a second connection node between the third switching element and the fourth switching element of the second buck circuit; an other end of the first inductor and an other end of the second inductor are connected to a third connection node between the fifth switching element and the sixth switching element of the boost circuit; and the fifth switching element is connected in parallel to the battery and a capacitor.

公开(公告)号：US20250105493A1

公开(公告)日：2025-03-27

申请号：US18896063

申请日：2024-09-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunyoung ROH ,  Jeong PARK

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q9/16

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may include: a housing including a side wall, wherein the side wall includes a recess recessed from an outer surface of the side wall; a non-conductive cap disposed in the recess and including a protruding portion passing through the recess; an antenna module disposed opposite to the cap with respect to the recess and including at least one antenna element disposed to face the recess; and a bracket disposed inside the housing such that the antenna module is mounted thereon and including a coupling hole through which the protruding portion is inserted.

公开(公告)号：US20250105201A1

公开(公告)日：2025-03-27

申请号：US18741372

申请日：2024-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younghun KIM

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package includes a package substrate including a package substrate comprising a base layer and a connection pad disposed on an upper surface of the base layer; a semiconductor chip disposed on the package substrate and the semiconductor chip comprises a semiconductor substrate and a bonding pad disposed on an upper surface of the semiconductor substrate; a bonding wire in contact with the connection pad and the bonding pad; a first dam structure disposed on the package substrate and arranged between the connection pad and the bonding pad; a non-conductive filler disposed on the package substrate surrounding the first dam structure and the bonding wire; and a mold layer disposed on the package substrate covering a portion of an upper surface of the package substrate and surrounding the semiconductor chip and the non-conductive filler.

公开(公告)号：US20250105193A1

公开(公告)日：2025-03-27

申请号：US18890118

申请日：2024-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungmin Ko ,  Hyunhee Lee ,  Hojun Lee ,  Dongjoo Choi

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor package includes a first semiconductor chip including a first through-via and a first upper pad, a second semiconductor chip provided on the first semiconductor chip and including a second lower pad, and a bonding bump provided between the first semiconductor chip and the second semiconductor chip and connected to the first upper pad and the second lower pad. The bonding bump includes: a conductive pattern directly contacting the second lower pad and including nickel and a bonding structure directly contacting the conductive pattern and the first upper pad, wherein the bonding structure includes an intermetallic compound including copper and a solder material. A thickness of the bonding structure is from about 47% to about 54% of a sum of a thickness of the conductive pattern, a thickness of the bonding structure, and a thickness of the first upper pad.

公开(公告)号：US20250105178A1

公开(公告)日：2025-03-27

申请号：US18634322

申请日：2024-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： MinKi AHN ,  Kwangho LEE ,  Heeseok LEE ,  Jaegwon JANG ,  Heejung CHOI

IPC: H01L23/00

Abstract: A semiconductor chip according to an embodiment includes a semiconductor substrate, an interconnection pad on a first surface of the semiconductor substrate, an insulation layer being on the first surface of the semiconductor substrate and defining an opening that exposes at least a partial portion of the interconnection pad, a capping pad being on the insulation layer and being connected to the interconnection pad through the opening, and an insulation structure at a periphery of the capping pad on the insulation layer.

公开(公告)号：US20250105030A1

公开(公告)日：2025-03-27

申请号：US18782816

申请日：2024-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Jieun SEO ,  Donghoon KWON

IPC: H01L21/67 ,  H01L21/02

Abstract: A substrate cleaning device includes a cleaning module configured to spray a cleaning solution on an upper side of a substrate, a curtain module coupled with the cleaning module and configured to spray a curtain body to at least one of a first area including an upper side of an edge of the substrate, a second area between a cleaner guard at least partially surrounding the substrate and a first upper portion of the edge of the substrate, and a third area including a second upper portion of an outside of the edge of the substrate in parallel to an internal wall of the cleaner guard, and a driver coupled with the cleaning module and configured to horizontally move the cleaning module on a third upper portion of the substrate.

公开(公告)号：US20250104749A1

公开(公告)日：2025-03-27

申请号：US18604593

申请日：2024-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongho Shin ,  Kangyoon Lee ,  Seonkyoo Lee ,  Junha Lee

IPC: G11C7/22

Abstract: A method of calibrating impedance of a memory device including a data transmitter includes: outputting a comparison signal by comparing a power supply voltage and a reference voltage, the power supply voltage being supplied to the data transmitter when the data transmitter is driven; storing a voltage level of the reference voltage when the comparison signal changes logical state; adjusting the reference voltage based on the comparison signal such that the voltage level of the reference voltage increases or decreases; and calibrating an output impedance of the memory device based on a digital code corresponding to an average reference voltage level, the average reference voltage level being obtained by averaging a prescribed number of voltage levels of the reference voltage stored as a result of repeatedly outputting the comparison signal, storing the voltage level of the reference voltage, and adjusting the reference voltage.

公开(公告)号：US20250104685A1

公开(公告)日：2025-03-27

申请号：US18408357

申请日：2024-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Andri Bezzola ,  Adrian Celestinos Arroyo

IPC: G10K11/178 ,  H04R1/10 ,  H04R1/22 ,  H04R3/04 ,  H04R29/00

Abstract: One embodiment provides a method comprising obtaining, via a microphone of a hearable device, one or more measurements of a first individual transfer function from a transducer of the hearable device to a first sound pressure at the microphone. At least a portion of the hearable device is within proximity of an ear canal of an individual ear. The method further comprises determining, based on the one or more measurements of the first individual transfer function, a second individual transfer function from the first sound pressure to a second sound pressure at an eardrum within the ear canal. The method further comprises applying, based in part on the second individual transfer function, personalized equalization (PEQ) within the audio full range (low, mid and high frequencies) to an audio signal for reproduction via the hearable device.

公开(公告)号：US20250104617A1

公开(公告)日：2025-03-27

申请号：US18975664

申请日：2024-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeyong SON ,  Jungmin KU ,  Sunghwan JANG

IPC: G09G3/32

Abstract: A display device is disclosed. The display device includes: a plurality of light-emitting elements including light emitting circuitry comprising a plurality of subpixels of a display panel, a light emitting diode (LED) driving circuit configured to drive the plurality of light emitting elements, a substrate on which the plurality of light emitting elements and the LED driving circuit are disposed, memory storing an abnormal pixel area and LED arrangement information of the abnormal pixel area, and at least one processor, comprising processing circuitry, individually and/or collectively, configured to control the LED driving circuit such that a signal corresponding to gradation information corresponding to each of the plurality of light emitting elements is provided based on specified LED color positions, wherein at least one processor, individually and/or collectively, is configured to control the LED driving circuit such that a signal corresponding to the LED arrangement information of the abnormal pixel area is provided instead of the specified LED color positions, with respect to the plurality of light-emitting devices in the abnormal pixel area.

公开(公告)号：US20250104295A1

公开(公告)日：2025-03-27

申请号：US18972255

申请日：2024-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bonggil BAK

IPC: G06T11/00 ,  G06T5/20 ,  G06T5/77 ,  G06T7/11 ,  G06T7/194 ,  G06T7/90 ,  G06V10/56 ,  G06V10/60 ,  G06V20/20

Abstract: An electronic device comprising a memory; a camera; a communication unit; and at least one processor electrically connectable to the memory, the camera, and the communication unit. The at least one processor to: extract a frame from an image including a plurality of frames; identify an RGB vector of the frame; determine a light source vector by filtering the RGB vector of the frame through a first filter; identify an illuminance value of the frame; determine an illuminance value in relation to a composite image by filtering the illuminance value of the frame through a second filter; and generate synthetic light source information on the basis of the light source vector and the illuminance value in relation to the composite image.