Abstract:
A circuit generates a boosted voltage in a semiconductor memory device, where the semiconductor memory device includes a memory cell array having a plurality of non-edge sub-arrays and at least one edge sub-array. The circuit includes a plurality of boosted voltage generators configured to generate a boosted voltage having different current driving capabilities to activate the non-edge sub-arrays and the edge sub-arrays and to supply the boosted voltage to the memory cell array.
Abstract:
The present invention relates to a neuronal differentiation method of adult stem cells using small molecules, more particularly to a method for inducing differentiation of adult stem cells into nerve cells using small molecules, which enables effective differentiation into nerve cells and, thus, is useful in treating intractable CNS disorders such as Parkinson's disease, dementia, Alzheimer's disease and spinal cord injury.
Abstract:
A semiconductor device having a decoupling capacitor and a method of fabricating the same are provided. The semiconductor device includes a semiconductor substrate having a cell region, a first peripheral circuit region, and a second peripheral circuit region. At least one channel trench is disposed in the cell region of the semiconductor substrate. At least one first capacitor trench is disposed in the first peripheral circuit region of the semiconductor substrate, and at least one second capacitor trench is disposed in the second peripheral circuit region of the semiconductor substrate. A gate electrode is disposed in the cell region of the semiconductor substrate and fills the channel trench. A first upper electrode is disposed in the first peripheral circuit region of the semiconductor substrate and fills at least the first capacitor trench. A second upper electrode is disposed in the second peripheral circuit region of the semiconductor substrate and fills at least the second capacitor trench. A gate dielectric layer is interposed between the channel trench and the gate electrode. A first dielectric layer is interposed between the semiconductor substrate of the first peripheral circuit region having the first capacitor trench and the first upper electrode and has the same thickness as the gate dielectric layer. A second dielectric layer is interposed between the semiconductor substrate of the second peripheral circuit region having the second capacitor trench and the second upper electrode and has a different thickness from the first dielectric layer.
Abstract:
A high voltage generating circuit is disclosed. In the high voltage generating circuit a boost node is precharged and boosted by a plurality of pump circuits and then discharged to an output terminal. Where a voltage apparent at the boost node is smaller than a power supply voltage, the voltage apparent at the boost node is elevated to the power supply voltage. Where the voltage apparent at the boost node is larger than the power supply voltage, a current path is prevented from forming between the boost node and the power supply voltage so as to maintain the voltage apparent at the boost node.
Abstract:
Provided is a semiconductor memory device having peripheral circuit capacitors. In the semiconductor memory device, a first node is electrically connected to a plurality of lower electrodes of a plurality of capacitors in a peripheral circuit region to connect at least a portion of the capacitors in parallel. A second node is electrically connected to a plurality of upper electrodes of the capacitors in the peripheral circuit region to connect at least a portion of the capacitors in parallel. The first node is formed at substantially the same level as a bit line in a cell array region and is formed of the same material used to form the bit line.
Abstract:
A semiconductor device having a decoupling capacitor and a method of fabricating the same are provided. The semiconductor device includes a semiconductor substrate having a cell region, a first peripheral circuit region, and a second peripheral circuit region. At least one channel trench is disposed in the cell region of the semiconductor substrate. At least one first capacitor trench is disposed in the first peripheral circuit region of the semiconductor substrate, and at least one second capacitor trench is disposed in the second peripheral circuit region of the semiconductor substrate. A gate electrode is disposed in the cell region of the semiconductor substrate and fills the channel trench. A first upper electrode is disposed in the first peripheral circuit region of the semiconductor substrate and fills at least the first capacitor trench. A second upper electrode is disposed in the second peripheral circuit region of the semiconductor substrate and fills at least the second capacitor trench. A gate dielectric layer is interposed between the channel trench and the gate electrode. A first dielectric layer is interposed between the semiconductor substrate of the first peripheral circuit region having the first capacitor trench and the first upper electrode and has the same thickness as the gate dielectric layer. A second dielectric layer is interposed between the semiconductor substrate of the second peripheral circuit region having the second capacitor trench and the second upper electrode and has a different thickness from the first dielectric layer.
Abstract:
A semiconductor memory device is disclosed having a layout including, alternating pluralities of memory cell arrays and word line driving blocks arranged next to alternating pluralities of sense amplifier blocks and conjunction blocks, such that each sense amplifier block is located lateral to a corresponding memory cell array, and each conjunction block is located lateral to a corresponding word line driving block. Each sense amplifier block alternately includes one of a supply voltage driver and a ground voltage driver.
Abstract:
A high voltage generating circuit is disclosed. In the high voltage generating circuit a boost node is precharged and boosted by a plurality of pump circuits and then discharged to an output terminal. Where a voltage apparent at the boost node is smaller than a power supply voltage, the voltage apparent at the boost node is elevated to the power supply voltage. Where the voltage apparent at the boost node is larger than the power supply voltage, a current path is prevented from forming between the boost node and the power supply voltage so as to maintain the voltage apparent at the boost node.
Abstract:
A high voltage generating circuit is disclosed. In the high voltage generating circuit a boost node is precharged and boosted by a plurality of pump circuits and then discharged to an output terminal. Where a voltage apparent at the boost node is smaller than a power supply voltage, the voltage apparent at the boost node is elevated to the power supply voltage. Where the voltage apparent at the boost node is larger than the power supply voltage, a current path is prevented from forming between the boost node and the power supply voltage so as to maintain the voltage apparent at the boost node.
Abstract:
A method and apparatus to perform a spitting service on a wide array print head includes detecting dot counts of print heads after a predetermined page is printed, determining spitting service levels corresponding to the detected dot counts, and executing spitting services for the print heads according to the spitting service levels. Accordingly, spitting services of a plurality of print heads of the wide array print head can be classified into several levels for execution, so that the print heads can maintain an optimum condition and provide a best printing quality, and unnecessary ink consumption can be reduced.