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公开(公告)号：US20140370754A1
公开(公告)日：2014-12-18
申请号：US14374712
申请日：2013-01-29
Applicant: KOA CORPORATION
Inventor： Kenji Kameko , Koichi Hirasawa , Yoshinori Aruga
Abstract: Provided is a connection structure for a detection terminal of shunt resistor that allows a lead wire, that is to be connected to an electrode of the shunt resistor and is for detecting electrical current, to be easily and compactly connected to the electrode within a narrow and small module. A terminal connection structure for a resistor, which connects a detection terminal to an electrode, comprises a shunt resistor (13) that has a pair of electrodes (12) at both ends of a resistor body (11); a connector base (14) formed of insulating material; and an electrically conductive section (15a) formed on the connector base (14); wherein the connector base (14) is fit onto the shunt resistor (13) such that the electrically conductive section (15a) is electrically connected to the electrodes (12). The connector base (14) is provided with a joint section (C) that can be fit onto the resistor body (11). The resistor body (11) and the electrode (12) is provided with a level difference and the connector base (14) is fit into between the electrodes (12,12).
Abstract translation: 提供了一种用于分流电阻器的检测端子的连接结构，其允许将连接到分流电阻器的电极并用于检测电流的引线容易且紧凑地连接到窄电极内的电极，并且 小模块 用于将检测端子连接到电极的电阻器的端子连接结构包括在电阻体（11）的两端具有一对电极（12）的分流电阻（13）。 由绝缘材料形成的连接器基座（14） 和形成在所述连接器基座（14）上的导电部（15a）。 其中所述连接器基座（14）装配到所述分流电阻器（13）上，使得所述导电部分（15a）电连接到所述电极（12）。 连接器基座（14）设置有能够配合在电阻体（11）上的接合部（C）。 电阻体（11）和电极（12）具有电平差，并且连接器基座（14）装配在电极（12,12）之间。
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公开(公告)号：US20040196139A1
公开(公告)日：2004-10-07
申请号：US10823666
申请日：2004-04-14
Applicant: KOA CORPORATION
Inventor： Keishi Nakamura , Mikio Tatuguchi
IPC: H01C007/10
CPC classification number: H01C1/144 , H01C17/242
Abstract: The low resistance value resistor 11 has two electrodes 12,13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.
Abstract translation: 低电阻值电阻器11具有两个具有高导电性的金属条的电极12,13。 通过轧制和/或热扩散粘合将金属条固定在电阻体上。 在由金属带构成的每个电极的表面上形成熔融焊料层。 因此，获得了电阻体中充分的接合强度和优异的电流分布。 此外，通过沿着电极之间的电流流动的方向除去主体材料的一部分来调整电阻体的一部分，以调整电阻值。 因此，可以获得精确的电阻值和电阻温度系数（TCR）的优异特性。
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公开(公告)号：US12241914B2
公开(公告)日：2025-03-04
申请号：US17910253
申请日：2020-12-28
Applicant: KOA CORPORATION
Inventor： Miyahito Kinoshita
Abstract: A current sensing device including: an insulating resin substrate; a current sensing element arranged in the resin substrate; a current wire provided via an insulating layer with respect to the current sensing element to flow a current through the current sensing element; a plurality of current vias connecting the current sensing element and the current wire through the insulating layer; and a voltage sensing via connected to the current sensing element to measure a voltage drop.
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44.发明授权公开(公告)号：US12087480B2
公开(公告)日：2024-09-10
申请号：US17754031
申请日：2020-08-06
Applicant: KOA Corporation
Inventor： Reina Kaneko , Yoshitaka Kumeda , Tadahiko Yoshioka
IPC: H01C7/13 , H01C17/02 , H01C17/065
CPC classification number: H01C7/13 , H01C17/02 , H01C17/06553
Abstract: The resistive material contains copper and manganese, an oxide film of manganese being formed on a surface of the resistive material.
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公开(公告)号：US20240258897A1
公开(公告)日：2024-08-01
申请号：US18429141
申请日：2024-01-31
Applicant: National University Corporation Tokai National Higher Education and Research System , KOA CORPORATION
Inventor： Yu YONEZAWA , Masayoshi YAMAMOTO , Atsushi HASENUMA , Koji SHIGESAWA , Keishi NAKAMURA , Susumu TOYODA
IPC: H02M1/00 , H02M7/5387 , H03F3/45
CPC classification number: H02M1/0009 , H02M7/53873 , H03F3/45475 , H03F2200/261 , H03F2200/462
Abstract: A current detection circuit, including: an output circuit to output a signal indicating a voltage drop between a pair of detection terminals; an amplifier circuit to amplify the signal from the output circuit; an AD conversion circuit to generate a digital signal by sampling, at a predetermined cycle, an amplified signal amplified by the amplifier circuit; a filter circuit configured to extract, from the amplified signal amplified by the amplifier circuit, a noise component having a frequency higher than a sampling frequency of the AD conversion circuit; a comparing unit to output a comparison signal indicating a noise detection timing at which an output signal of the filter circuit exceeds a predetermined reference value for detecting the noise component; and an arithmetic circuit to delay a timing at which the amplified signal is sampled by the AD conversion circuit for a predetermined time based on the comparison signal.
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Patent Agency Ranking
公开(公告)号：US12037507B2
公开(公告)日：2024-07-16
申请号：US17287772
申请日：2019-11-05
Inventor： Keiko Ohtsuka , Morio Yonekawa , Hajime Kimura , Ken Yoshioka , Nobuhiro Kanamaru , Masaki Suwa , Kazumi Machida
IPC: C08K3/22 , C08F212/34 , C08F234/00 , C09D7/61 , C09D125/18 , C09D145/00 , H01B3/30 , H01C7/00
CPC classification number: C09D125/18 , C08F212/34 , C08F234/00 , C08K3/22 , C09D7/61 , C09D145/00 , H01B3/303 , H01C7/005 , C08K2003/2227 , C08K3/22 , C08L65/00
Abstract: This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.
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公开(公告)号：US11965228B2
公开(公告)日：2024-04-23
申请号：US17600968
申请日：2020-03-03
Applicant: KOA CORPORATION
Inventor： Shuhei Matsubara , Keishi Nakamura
IPC: C22C29/12 , B22F1/12 , B22F3/14 , C04B35/117 , C04B35/64 , H01C1/14 , H01C7/00 , H01C17/065
CPC classification number: C22C29/12 , B22F1/12 , B22F3/14 , C04B35/117 , C04B35/64 , H01C1/14 , H01C7/003 , H01C17/06553 , B22F2302/25 , C04B2235/3217 , C04B2235/3232 , C04B2235/405 , C04B2235/5454 , C04B2235/9607
Abstract: The resistive material for sensing current contains: metal particles selected from a group consisting of nichrome, copper-manganese, and copper-nickel; insulating particles selected from a group consisting of alumina, aluminum nitride, silicon nitride, and zirconia; and titanium oxide.
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公开(公告)号：US20240049399A1
公开(公告)日：2024-02-08
申请号：US18266722
申请日：2021-12-02
Applicant: KOA CORPORATION
Inventor： Yasushi AKAHANE
CPC classification number: H05K3/3431 , H01C7/003 , H01C1/142 , H01C17/283 , H01C17/006
Abstract: A chip resistor according to the present invention includes an insulating substrate, a pair of back surface electrodes, a pair of top surface electrodes, a resistor, and a pair of end face electrodes. The back surface electrode includes the first electrode portion located inwardly and away from the end face of the insulating substrate, and the two second electrode portions arranged on two portions, respectively, in the short direction of the insulating substrate with the cutout portion, which is positioned between the end face of the insulating substrate and the first electrode portion, being interposed therebetween, and the maximum height of the first electrode portion is set to be more than the maximum height of the second electrode portions.
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公开(公告)号：US11874245B2
公开(公告)日：2024-01-16
申请号：US17604082
申请日：2020-02-12
Applicant: KOA CORPORATION
Inventor： Taro Kimura
Abstract: After a sulfidation detection conductor (2) is formed on a front surface of a large-sized substrate (10A), a pair of first protective films (3) made of an insoluble material is formed, respectively, on predetermined positions of the sulfidation detection conductor (2), and a second protective film (7) made of a soluble material is formed so as to cover the sulfidation detection conductor (2) positioned between the pair of first protective films (3), and thereafter, end face electrodes (5) are formed, respectively, on divided faces of each strip-shaped substrate (10B) obtained by primarily dividing the large-sized substrate (10A). Then, after external electrodes (6) are formed by performing electrolytic plating with respect to each chip substrate (10C) obtained by secondarily dividing each strip-shaped substrate (10B), a sulfidation detection portion (2a) is exposed to the outside by removing the second protective film (7), whereby a sulfidation detection sensor (10) can be obtained.
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公开(公告)号：US20240011811A1
公开(公告)日：2024-01-11
申请号：US18215961
申请日：2023-06-29
Applicant: KOA CORPORATION
Inventor： Yasuyuki KATASE , Miki YAZAWA
Abstract: A sensor device according to the present invention includes a substrate including a heat generation portion, a casing including an accommodation portion accommodating the substrate, and a sensor element including a temperature-sensitive resistor and being supported by the substrate, in which the accommodation portion is divided into a plurality of accommodation spaces on a side closer to the sensor element. The accommodation portion is divided into a first accommodation space and a second accommodation space via division plates, and the first accommodation space is formed on a side closer to the sensor element than the second accommodation space, and widely as compared with the second accommodation space.
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