Abstract:
Disclosed is an input apparatus used in a SSTL interface, which comprises a differential buffer for comparing an external input signal with a reference potential inputted from an external, and a CMOS buffer for buffering the external input signal. In the input apparatus, the CMOS buffer operates when a command signal or an address signal is not inputted from an external, and when a predetermined operation such as a refresh operation is performed, thereby reducing the power consumption in a standby mode. Further, in order to prevent the input apparatus from abnormally operating when the reference potential is not maintained in the normal operation range, a reference potential level detecting circuit is further included in the input apparatus, so that the CMOS buffer operates when the reference potential deviates from a predetermined normal operation range. Furthermore, in order to enable an input buffer to operate as the CMOS when an input signal fully swings, a circuit for detecting a potential of an input signal inputted from an external is further included in the input apparatus.
Abstract:
A delay locked loop (DLL) power supply circuit for use in a semiconductor memory device, including: a DLL power supplier for supplying a DLL power supply voltage to a DLL in response to a reference voltage and a clock enable exit pulse signal; and a pulse signal generator for generating the clock enable exit pulse signal in response to a clock enable signal.
Abstract:
A voltage generator for a semiconductor memory device that improves the drivability of an output driver by controlling a gate of the output driver to vary between an internal power supply voltage and a ground voltage, is disclosed. The voltage generator includes an output voltage controller to generate a pull-up signal for controlling a pull-up operation and a pull-down signal for controlling a pull-down operation, the pull-up signal having a level substantially equivalent to an internal power supply voltage if a cell plate voltage is higher than a cell plate reference voltage, and having a level below the cell plate voltage if the cell plate voltage is lower than the cell plate reference voltage. The voltage generator further includes an output driver to generate a stable cell plate voltage in response to the pull-up signal and the pull-down signal.
Abstract:
An internal voltage generating circuit is utilized to perform a TDBI (Test During Burn-in) operation for a semiconductor device. The internal voltage generating circuit produces an internal voltage at a high voltage level, as an internal voltage, in not only a standby section but also in an active section in response to a test operation signal activated in a test operation. Accordingly, dropping of the internal voltage in the standby section of the test operation and failure due to open or short circuiting are prevented. As a result, reliability of the semiconductor chip, by preventing the generation of latch-up caused by breakdown of internal circuits, is assured.
Abstract:
Various embodiments of a semiconductor apparatus are disclosed. In one exemplary embodiment, a semiconductor apparatus may include a memory block chip and a signal input/output chip. The memory block chip is configured to control a data access size according to specifications. The signal input/output chip is configured to transmit input data from an external device to the memory block chip or transmit output data from the memory block chip to an external device and process the input data or the output data by selectively enabling a clock phase control unit and a signal processing unit according to the specifications.
Abstract:
Various embodiments of a semiconductor apparatus are disclosed. In one exemplary embodiment, a semiconductor apparatus may include a memory block chip and a signal input/output chip. The memory block chip is configured to control a data access size according to specifications. The signal input/output chip is configured to transmit input data from an external device to the memory block chip or transmit output data from the memory block chip to an external device and process the input data or the output data by selectively enabling a clock phase control unit and a signal processing unit according to the specifications.
Abstract:
A latch structure includes a first inverter that includes a first PMOS transistor and a first NMOS transistor, and a second inverter that includes a second PMOS transistor and a second NMOS transistor, receives an output signal of the first inverter, and outputs an input signal to the first inverter. The sources of the first and second transistors of the same type are connected to a common straight source line.
Abstract:
An internal voltage generating circuit is utilized to perform a TDBI (Test During Burn-in) operation for a semiconductor device. The internal voltage generating circuit produces an internal voltage at a high voltage level, as an internal voltage, in not only a standby section but also in an active section in response to a test operation signal activated in a test operation. Accordingly, dropping of the internal voltage in the standby section of the test operation and failure due to open or short circuiting are prevented. As a result, reliability of the semiconductor chip, by preventing the generation of latch-up caused by breakdown of internal circuits, is assured.
Abstract:
A semiconductor device includes a plurality of pads configured to receive a plurality of external signals, an internal circuit configured to perform a predetermined internal operation in response to one of the external signals that is inputted through one of the plurality of pads, and a signal transferring unit configured to receive the external signal, output the external signal to an internal circuit an output signal during a normal mode, and output a fixed signal regardless of changes in the external signal to the internal circuit in a test mode.
Abstract:
A negative voltage generator of a semiconductor memory device includes: a flag signal generation unit for receiving a temperature information code from an On Die Thermal Sensor (ODTS) to output a plurality of flag signals containing temperature information of the semiconductor memory device; and a negative voltage detection unit for detecting a negative voltage to output a detection signal for determining whether to pump a negative voltage, wherein a detection level of the negative voltage is changed according to the flag signals.