Abstract:
A method of manufacturing a thin film transistor includes sequentially forming a gate and at least one insulation layer on a substrate, forming a source electrode and a drain electrode on the at least one insulation layer, and forming a channel layer formed of a semiconductor on a part of the source electrode and the drain electrode, wherein the gate, the source electrode, and the drain electrode are formed by using a hybrid inkjet printing apparatus.
Abstract:
Provided are a gas distribution apparatus and a substrate treating apparatus including the same. The substrate treating apparatus includes a chamber comprising a reaction space, a substrate seat unit disposed in the reaction space of the chamber to radially seat a plurality of substrates with respect to a center thereof, and a gas distribution device comprising a first gas distribution part configured to eject at least two source materials onto a substrate through routes different from each other and a second gas distribution part configured to eject a source material having a decomposition temperature greater than an average of decomposition temperatures of the at least two source materials onto the substrate. The first gas distribution part is divided into at least two sections and disposed such that the second gas distribution part is positioned therebetween; and couplable and separable to/from one another.
Abstract:
A method to enlarge and change an image displayed by a photographing apparatus, and a photographing apparatus using the same. The enlargement method includes adding guide information regarding a zoom-in area and compensating the guide information based on the zoom-in command.
Abstract:
A display method and a photographing apparatus and display apparatus using the display method include displaying a photographed image and received images, and changing a mode of one of the images when a display area of one of the images is changed. Therefore, it is possible to view or record one or more images photographed by one or more external photographing apparatuses in real-time.
Abstract:
A flat lamp device includes lower and upper glass plates facing each other in parallel; spacers interposed between the plates to keep a distance therebetween; a cathode electrode singly formed over the entire upper surface of the lower glass plate; an insulation film formed on the cathode electrode; semiconductor films independently patterned on the insulation at intervals; a catalyst metal layer laminated on a buffer metal layer to improve adhesive force of the catalyst metal formed on the semiconductor films; carbon nano-tubes formed on the catalyst metal layer; a grid electrode installed above the carbon nano-tubes between the plates to guide electron emission from the carbon nano-tubes with a mesh shape having an opening for passage of the emitted electrons; an anode electrode formed below the upper glass plate to accelerate the emitted electrons; and a fluorescent layer formed on a lower surface of the anode electrode.
Abstract:
Disclosed is a flat lamp device, including lower and upper glass plates facing each other in parallel; spacers interposed between the plates to keep distance therebetween; a cathode electrode singly formed over the entire upper surface of the lower glass plate; an insulation film formed on the cathode electrode; semiconductor films independently patterned on the insulation film at intervals; a catalyst-metal layer laminated on the buffer metal to improve the adhesion of catalyst metal formed on the semiconductor films; carbon nano-tubes formed on the catalyst-metal layer; a grid electrode installed on the carbon nano-tubes between the plates to guide electron emission from the carbon nano-tubes with a mesh shape having an opening for passage of the emitted electrons; an anode electrode formed below the upper glass plate to accelerate the emitted electrons; and a fluorescent layer formed below the anode electrode to emit light by collision with the accelerated electrons.
Abstract:
Disclosed are efficient municipal wastewater treatment apparatus and process characterized in that the nitrogen is removed by nitrification and denitrification reaction in the cyclic aeration reactor wherein Anaerobic state, Anoxic state and Oxic state are change into time concept in a single reactor, and the untreated organic materials are further removed by the 24-hour-continuous reactor.
Abstract:
A semiconductor device isolation structure includes a semiconductor substrate including an active region and a field region, an insulation layer buried in the active region of the substrate, and an isolation layer formed in the field region of the substrate deeper than the buried insulation layer. A method for isolating a semiconductor device includes the steps of preparing a semiconductor substrate, defining an active region and a field region in the substrate, forming an insulation layer buried in the active region of the substrate, and forming an isolation layer in the field region of the substrate to be deeper than the buried insulation layer. The invention applies to an SOI (Silicon On Insulator) provided with a SIMOX (Separation by Implanted Oxygen) type, for effectively overcoming interfacial defects between a buried oxide film and a semiconductor substrate, and improves a reliability of the semiconductor device by planarizing the same.
Abstract:
The present invention relates to a method of isolating semiconductor devices enabling to prevent an active area from being reduced due to the increase of an isolation area by means of forming trenches, and includes the steps of forming a mask on a semiconductor substrate wherein the mask discloses field areas, forming a first and second trench in the field areas of the semiconductor substrate wherein the first trench has a larger size and a lower aspect ratio than those of the second trench and wherein the second trench has a smaller size and a higher aspect ratio than those of the first trench, depositing filling oxide on the mask and in the first and second trench by a method including characteristic of sputtering wherein the first and second trench are filled up with the filling oxide and a void is formed on a lower part of the second trench, and forming field oxide film by means of etching back the filling oxide to remain inside the first and second trench.
Abstract:
Arteminolides obtained from Artemisia sylvatica MAXIMOWICZ and having a core structure of formula (I) or an isomeric structure thereof are effective farnesyl-protein transferase inhibitors as well as angiogenesis suppressors, and, accordingly, they are useful for the treatment of various cancers and angiogenesis-related diseases. ##STR1##