公开(公告)号：US11221447B1

公开(公告)日：2022-01-11

申请号：US16794759

申请日：2020-02-19

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr ,  Li Chen

IPC: G02B6/30

Abstract: Cantilevered waveguides suspended above an air cavity in an underlying substrate are described. The waveguide is formed by patterning a waveguide layer in some embodiments, and the air cavity is formed by etching the substrate beneath the waveguide. The topside of the air cavity may be sealed by filling the openings used to etch the cavity with a sealant, such as optical epoxy. In some embodiments, the waveguide is a facet coupler, positioned at a chip facet.

公开(公告)号：US10797462B1

公开(公告)日：2020-10-06

申请号：US15636605

申请日：2017-06-28

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen ,  Mohamadreza Banaee ,  Xingyu Zhang

IPC: H01S3/063 ,  H01S3/16 ,  H01S3/094

Abstract: Aspects of the present application are related to an Er-doped waveguide amplifier (EDWA) structure integrated in an uncooled silicon photonic transceiver and methods for fabricating the same. In some embodiments, the structure comprises three layers of waveguides: silicon, silicon nitride and Er-doped dielectric. The three layers of waveguides are integrated with an uncooled 980-nm pump laser. In some embodiments, the Er-doped dielectric waveguides are fully etched.

公开(公告)号：US10536219B1

公开(公告)日：2020-01-14

申请号：US16296799

申请日：2019-03-08

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen

IPC: H04B10/40 ,  G02B6/00

Abstract: Disclosed are structures and methods for a monolithic silicon (Si) coherent transceiver with integrated laser and gain elements wherein an InP chip is bonded to the Si chip in a recess formed in that Si chip.

公开(公告)号：US10284300B2

公开(公告)日：2019-05-07

申请号：US14298862

申请日：2014-06-06

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen

IPC: H04B10/40 ,  G02B6/00

Abstract: Disclosed are structures and methods for a monolithic silicon (Si) coherent transceiver with integrated laser and gain elements wherein an InP chip is bonded to the Si chip in a recess formed in that Si chip.

公开(公告)号：US10263385B1

公开(公告)日：2019-04-16

申请号：US15851474

申请日：2017-12-21

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr

IPC: H01S3/106 ,  H01S3/13 ,  H01S3/131 ,  H01S3/00 ,  H01S5/068

Abstract: An apparatus and method for calculating the frequency of the light.

公开(公告)号：US10241268B2

公开(公告)日：2019-03-26

申请号：US15482391

申请日：2017-04-07

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/136 ,  G02B6/30 ,  G02B6/138

Abstract: Aspects of the present application provide an optical device comprising a suspended optical component over a cavity, such as an undercut region in a substrate. The cavity is filled with a filler material. In some embodiments, the optical device and a method may be provided to fill the cavity with the filler material using a reservoir and a channel in the substrate connecting the reservoir to the cavity to be filled.

公开(公告)号：US10209539B1

公开(公告)日：2019-02-19

申请号：US15858051

申请日：2017-12-29

Applicant: ACACIA COMMUNICATIONS, INC.

Inventor： Christopher Doerr ,  Long Chen ,  John Heanue ,  Momchil T. Mihnev

IPC: G02F1/01

Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.

公开(公告)号：US09922887B2

公开(公告)日：2018-03-20

申请号：US14103659

申请日：2013-12-11

Applicant: ACACIA COMMUNICATIONS INC.

Inventor： Diedrik Vermeulen ,  Long Chen ,  Christopher Doerr

IPC: H01L21/66 ,  G02B6/13 ,  G01M11/00 ,  G02B6/30 ,  G02B6/122 ,  G02B6/34 ,  G02B6/12

CPC classification number: H01L22/10 ,  G01M11/30 ,  G01M11/37 ,  G02B6/1223 ,  G02B6/305 ,  G02B6/34 ,  G02B2006/12195 ,  H01L22/30

Abstract: Disclosed herein are methods, structures, and devices for wafer scale testing of photonic integrated circuits.

公开(公告)号：US09726840B2

公开(公告)日：2017-08-08

申请号：US14298846

申请日：2014-06-06

Applicant: Acacia Communications, Inc.

Inventor： Long Chen

IPC: H05K3/36 ,  G02B6/42

CPC classification number: G02B6/4274 ,  H01L2924/0002 ,  Y10T29/49126 ,  H01L2924/00

Abstract: Methods, structures, apparatus, devices, and materials to facilitate the integration of electronic integrated circuits (chips) including drivers, amplifiers, microcontrollers, etc., onto/into photonic integrated circuits (chips) using recessed windows exhibiting controlled depths onto/into the photonic chip. The electronic chips are positioned into the recessed windows and electrical connections between the electronic chips and the photonic chip are achieved by flip-chip techniques with predefined traces at a bottom of the recessed windows or direct wire bonding. Advantageously, this integration may be performed on a wafer level for large-volume productions.

公开(公告)号：US09671559B2

公开(公告)日：2017-06-06

申请号：US14103678

申请日：2013-12-11

Applicant: ACACIA COMMUNICATIONS INC.

Inventor： Long Chen ,  Christopher Doerr

IPC: G02B6/126 ,  H04B10/60 ,  G02B6/12

CPC classification number: G02B6/126 ,  G02B2006/12147 ,  G02B2006/1215 ,  H04B10/60

Abstract: Disclosed herein are methods, structures, apparatus and devices to integrate polarization filters and power tap couplers on planar photonic circuits that advantageously provide a lower insertion loss to an optical signal and improved optical bandwidth as compared with contemporary designs wherein these two functions are implemented separately.