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    LINEAR INDUCTIVE TORQUE SENSOR
    41.
    发明申请
    LINEAR INDUCTIVE TORQUE SENSOR 有权

    公开(公告)号：US20230077015A1

    公开(公告)日：2023-03-09

    申请号：US17466202

    申请日：2021-09-03

    Applicant: Allegro MicroSystems, LLC

    Inventor： Alexander Latham ,  Hernán D. Romero

    IPC: G01L3/10

    Abstract: Methods and apparatus for linear inductive torque sensing that may include transmitting an AC magnetic field with a transmit coil toward a conductive target and receiving a field reflected by the conductive target with a receive coil, wherein the conductive target comprises first and second targets positioned with respect to each other and each shaped to linearly increase or decrease an amount of conductive area of the conductive target due to relative movement of the first and second targets which changes an amount of the field reflected by the conductive target. A signal from the receive coil can be processed to determine a relative position of the first and second targets corresponding to an amount of torque on an elongate member connected to the first and second targets. In other embodiments, a change in inductance of the transmit coil is measured to determine relative target position.

    Current sensor integrated circuits
    42.
    发明授权
    Current sensor integrated circuits 有权

    公开(公告)号：US11519939B2

    公开(公告)日：2022-12-06

    申请号：US17472769

    申请日：2021-09-13

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: H01L21/44 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

    Multipath wide bandwidth current sensor
    43.
    发明授权
    Multipath wide bandwidth current sensor 有权

    公开(公告)号：US11366141B1

    公开(公告)日：2022-06-21

    申请号：US17160573

    申请日：2021-01-28

    Applicant: Allegro MicroSystems, LLC

    Inventor： Steven Daubert ,  Sina Haji Alizad ,  Srujan Shivanakere ,  Maxwell McNally ,  Alexander Latham

    IPC: G01R19/14 ,  G01R19/25

    Abstract: A current sensor includes a lead frame having a plurality of leads, at least two of which form a current conductor configured to carry a current that generates a magnetic field and a substrate having first and second opposing surfaces, the first surface proximate to said current conductor and the second surface distal from the current conductor. A first magnetic field transducer is disposed on the substrate and a first coil is disposed on the substrate adjacent to the first magnetic field transducer, wherein the first magnetic field transducer and the first coil are positioned on a first side of the current conductor. A second magnetic field transducer is disposed on the substrate and a second coil is disposed on the substrate adjacent to the second magnetic field transducer, wherein the second magnetic field transducer and the second coil are positioned on a second side of the current conductor.

    CURRENT SENSOR INTEGRATED CIRCUITS
    44.
    发明申请
    CURRENT SENSOR INTEGRATED CIRCUITS 有权

    公开(公告)号：US20210405092A1

    公开(公告)日：2021-12-30

    申请号：US17472769

    申请日：2021-09-13

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: G01R15/08 ,  H01L43/04 ,  H01L43/06

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

    Current sensor integrated circuits
    45.
    发明授权
    Current sensor integrated circuits 有权

    公开(公告)号：US11150273B2

    公开(公告)日：2021-10-19

    申请号：US16884311

    申请日：2020-05-27

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

    IPC: H01L23/495 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

    Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

    Multi-Die Integrated Current Sensor
    47.
    发明申请
    Multi-Die Integrated Current Sensor 有权

    公开(公告)号：US20210033646A1

    公开(公告)日：2021-02-04

    申请号：US16527636

    申请日：2019-07-31

    Applicant: Allegro MicroSystems, LLC

    Inventor： Wade Bussing ,  Alexander Latham

    IPC: G01R15/20 ,  H01L43/02 ,  H01L43/06 ,  H01L43/08

    Abstract: A current sensor can include a lead frame. The lead frame can include a first lead and a second lead, wherein the first and second leads are coupled together at a first junction region of the lead frame, wherein the current sensor is operable to sense a magnetic field generated by a first current passing through the first junction region. The current sensor can further include a first die disposed proximate to the lead frame. The first die can include a first magnetic field sensing element disposed on a surface of the first die, a first circuit coupled to the first magnetic field sensing element for generating a first signal indicative of a first current, and a first node coupled to the first signal. The current sensor can further include a second die disposed proximate to the lead frame. The second die can include a second magnetic field sensing element disposed on a surface of the second die, a second circuit coupled to the second magnetic field sensing element for generating a second signal indicative of the first current passing through the first junction region or indicative of a second current passing through the lead frame and a second node coupled to the second signal.

    SYSTEMS AND METHODS FOR CLOSED LOOP CURRENT SENSING
    50.
    发明申请
    SYSTEMS AND METHODS FOR CLOSED LOOP CURRENT SENSING 审中-公开

    公开(公告)号：US20190025346A1

    公开(公告)日：2019-01-24

    申请号：US15653820

    申请日：2017-07-19

    Applicant: Allegro Microsystems, LLC

    Inventor： Alexander Latham

    IPC: G01R15/18 ,  G01R15/20 ,  G01B7/02 ,  G01R33/07 ,  G01R33/09 ,  G01R33/00 ,  G01R31/28 ,  F04B49/06

    Abstract: A current sensor for sensing a direct magnetic field generated by a current through a conductor includes at least one first magnetic field sensing element spaced from at least one second magnetic field sensing element, with the magnetic field sensing elements configured to sense the direct magnetic field at different magnitudes. The direct magnetic field has a first direct coupling factor with respect to the at least one first magnetic field sensing element and a second direct coupling factor with respect to the at least one second magnetic field sensing element. A feedback conductor configured to carry a feedback current generates a feedback magnetic field that has a first feedback coupling factor with respect to the at least one first magnetic field sensing element and a second feedback coupling factor with respect to the at least one second magnetic field sensing element. A circuit generates the feedback current based on the direct and feedback magnetic fields and a sense element senses the feedback current.

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