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公开(公告)号：US20230327339A1
公开(公告)日：2023-10-12
申请号：US18335905
申请日：2023-06-15
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Mattia Pascolini
CPC classification number: H01Q9/0407 , H01Q5/40 , H01Q1/241 , H01Q3/2658 , H01Q3/267
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a probe-fed dielectric resonator antenna. The antenna may include a dielectric resonating element mounted to a flexible printed circuit. A feed probe may be formed from a patch of conductive traces on a sidewall of the resonating element. The feed probe may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the display cover layer. An additional feed probe may be mounted to an orthogonal sidewall of the resonating element for covering additional polarizations. Probe-fed dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the phased antenna array.
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公开(公告)号：US11728569B2
公开(公告)日：2023-08-15
申请号：US17111131
申请日：2020-12-03
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Hao Xu , Rodney A. Gomez Angulo , Matthew D. Hill , Mattia Pascolini
CPC classification number: H01Q9/0485 , H01Q1/243 , H01Q21/0075
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.
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公开(公告)号：US11700035B2
公开(公告)日：2023-07-11
申请号：US16920297
申请日：2020-07-02
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Bilgehan Avser , David Garrido Lopez , Forhad Hasnat , Mattia Pascolini , Mikal Askarian Amiri , Rodney A. Gomez Angulo , Thomas W. Yang , Jiechen Wu , Eric N. Nyland , Simone Paulotto , Jennifer M. Edwards , Matthew D. Hill , Ihtesham H. Chowdhury , David A. Hurrell , Siwen Yong , Jiangfeng Wu , Daniel C. Wagman , Soroush Akbarzadeh , Robert Scritzky , Subramanian Ramalingam
CPC classification number: H04B3/52 , G01R31/2822 , H01Q1/2283 , H01Q13/24 , H04B3/54
Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.
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公开(公告)号：US20220109464A1
公开(公告)日：2022-04-07
申请号：US17223888
申请日：2021-04-06
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Jennifer M. Edwards , Simone Paulotto , Siwen Yong
Abstract: An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.
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公开(公告)号：US20220006198A1
公开(公告)日：2022-01-06
申请号：US17098108
申请日：2020-11-13
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Bhaskara R. Rupakula , Harish Rajagopalan , Bilgehan Avser , Simone Paulotto , Mattia Pascolini
Abstract: An electronic device may be provided with a sidewall and an antenna module pressed against an interior surface of the sidewall. The module may include a phased antenna array. The sidewall may have apertures aligned with respective antenna in the array. The antennas may convey radio-frequency signals in first and second frequency bands greater than 10 GHz and with vertical and horizontal polarizations. Each aperture may include a corresponding cavity with non-linear cavity walls. The antennas may excite resonant cavity modes of the cavities that cause the cavities to radiate the radio-frequency signals as waveguide radiators. At the same time, the apertures may form a smooth impedance transition between the antennas and free space for the radio-frequency signals of both the horizontal and vertical polarizations.
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Patent Agency Ranking
公开(公告)号：US11139588B2
公开(公告)日：2021-10-05
申请号：US15950677
申请日：2018-04-11
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US20210265745A1
公开(公告)日：2021-08-26
申请号：US17314740
申请日：2021-05-07
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US20200021019A1
公开(公告)日：2020-01-16
申请号：US16036770
申请日：2018-07-16
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Jennifer M. Edwards , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Travis A. Barbieri , Georgios Atmatzakis , Matthew A. Mow
Abstract: An electronic device may be provided with antenna structures that convey radio-frequency signals greater than 10 GHz. The antenna structures may include overlapping first and second patches. The first patch may include a hole. A transmission line for the second patch may include a conductive via extending through the hole. The via may be coupled to a first end of a trace. A second end of the trace may be coupled to a feed terminal on the second patch over an additional via. The hole may be located within a central region of the first patch to allow the via to pass through the hole without electromagnetically coupling to the first patch. If desired, adjustable impedance matching circuits may be used to couple selected impedances to the antenna feeds that help ensure that the first and second patch antennas are sufficiently isolated from each other.
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公开(公告)号：US20190319367A1
公开(公告)日：2019-10-17
申请号：US15950677
申请日：2018-04-11
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US20190312347A1
公开(公告)日：2019-10-10
申请号：US15950072
申请日：2018-04-10
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer and a conductive layer on the dielectric cover layer. The conductive layer may define an opening. A dielectric spacer may be mounted to the cover layer within the opening. A substrate may be mounted to the spacer. Vertical conductive structures may extend from the conductive layer to the substrate and may laterally surround the spacer. A phased antenna array may be formed on the substrate and aligned with the opening. The cover layer may have a dielectric constant and thickness that are selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The spacer and the conductive structures may exhibit a cavity resonance at the wavelength. The array and the conductive structures may radiate radio-frequency signals at millimeter wave frequencies through the dielectric cover layer.
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