公开(公告)号：US20080308940A1

公开(公告)日：2008-12-18

申请号：US12198196

申请日：2008-08-26

申请人： Natalie Barbara Feilchenfeld ,  Zhong-Xiang He ,  Qizhi Liu ,  BethAnn Rainey ,  Ping-Chuan Wang ,  Kimball M. Watson

发明人： Natalie Barbara Feilchenfeld ,  Zhong-Xiang He ,  Qizhi Liu ,  BethAnn Rainey ,  Ping-Chuan Wang ,  Kimball M. Watson

IPC分类号： H01L23/522

CPC分类号： H01L21/76838 ,  H01L21/8249 ,  H01L23/53228 ,  H01L23/53257 ,  H01L23/53295 ,  H01L27/0623 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor structure. The semiconductor structure includes (a) a substrate; (b) a first semiconductor device on the substrate; (c) N ILD (Inter-Level Dielectric) layers on the first semiconductor device, wherein N is an integer greater than one; and (d) an electrically conductive line electrically coupled to the first semiconductor device. The electrically conductive line is adapted to carry a lateral electric current in a lateral direction parallel to an interfacing surface between two consecutive ILD layers of the N ILD layers. The electrically conductive line is present in at least two ILD layers of the N ILD layers. The electrically conductive line does not comprise an electrically conductive via that is adapted to carry a vertical electric current in a vertical direction perpendicular to the interfacing surface.

摘要翻译： 半导体结构。 半导体结构包括（a）基板; （b）基板上的第一半导体器件; （c）第一半导体器件上的N ILD（层间电介质）层，其中N是大于1的整数; 和（d）电耦合到第一半导体器件的导电线。 导电线适于在平行于N个ILD层的两个连续ILD层之间的界面表面的横向方向上承载横向电流。 导电线路存在于N ILD层的至少两个ILD层中。 导电线不包括适于在垂直于接口表面的垂直方向承载垂直电流的导电通孔。

公开(公告)号：US06965133B2

公开(公告)日：2005-11-15

申请号：US10708598

申请日：2004-03-13

申请人： Peter J. Geiss ,  Marwan H. Khater ,  Qizhi Liu ,  Randy W. Mann ,  Robert J. Purtell ,  BethAnn Rainey ,  Jae-Sung Rieh ,  Andreas D. Stricker

发明人： Peter J. Geiss ,  Marwan H. Khater ,  Qizhi Liu ,  Randy W. Mann ,  Robert J. Purtell ,  BethAnn Rainey ,  Jae-Sung Rieh ,  Andreas D. Stricker

IPC分类号： H01L21/28 ,  H01L21/331 ,  H01L21/8222 ,  H01L21/8248 ,  H01L21/8249 ,  H01L27/06 ,  H01L29/417 ,  H01L29/73 ,  H01L29/732 ,  H01L29/737 ,  H01L31/072 ,  H01L31/109

CPC分类号： H01L29/66242 ,  H01L21/28518 ,  H01L21/8249 ,  H01L27/0623 ,  H01L29/0804 ,  H01L29/456 ,  H01L29/7371

摘要： Methods for fabricating a heterojunction bipolar transistor having a raised extrinsic base is provided in which the base resistance is reduced by forming a silicide atop the raised extrinsic base that extends to the emitter region in a self-aligned manner. The silicide formation is incorporated into a BiCMOS process flow after the raised extrinsic base has been formed. The present invention also provides a heterojunction bipolar transistor having a raised extrinsic base and a silicide located atop the raised extrinsic base. The silicide atop the raised extrinsic base extends to the emitter in a self-aligned manner. The emitter is separated from the silicide by a spacer.

摘要翻译： 提供了制造具有凸起非本征基极的异质结双极晶体管的方法，其中通过在以自对准方式延伸到发射极区域的凸起的外部基极之上形成硅化物来降低基极电阻。 在形成凸起的外基之后，将硅化物形成结合到BiCMOS工艺流程中。 本发明还提供了一种异质结双极晶体管，其具有凸起的外部基极和位于凸起外部基极顶部的硅化物。 凸起的外基极上面的硅化物以自对准的方式延伸到发射极。 发射极通过间隔物与硅化物分离。

公开(公告)号：US06869852B1

公开(公告)日：2005-03-22

申请号：US10707756

申请日：2004-01-09

申请人： Alvin J. Joseph ,  Qizhi Liu ,  BethAnn Rainey ,  Kathryn T. Schonenberg

发明人： Alvin J. Joseph ,  Qizhi Liu ,  BethAnn Rainey ,  Kathryn T. Schonenberg

IPC分类号： H01L21/331 ,  H01L29/10 ,  H01L27/082 ,  H01L27/102 ,  H01L29/70 ,  H01L31/11

CPC分类号： H01L29/66287 ,  H01L29/1004 ,  H01L29/66242

摘要： A method of fabricating a bipolar transistor structure that provides unit current gain frequency (fT) and maximum oscillation frequency (fMAX) improvements of a raised extrinsic base using non-self-aligned techniques to establish a self-aligned structure. Accordingly, the invention eliminates the complexity and cost of current self-aligned raised extrinsic base processes. The invention forms a raised extrinsic base and an emitter opening over a landing pad, i.e., etch stop layer, then replaces the landing pad with a conductor that is converted, in part, to an insulator. An emitter is then formed in the emitter opening once the insulator is removed from the emitter opening. An unconverted portion of the conductor provides a conductive base link and a remaining portion of the insulator under a spacer isolates the extrinsic base from the emitter while maintaining self-alignment of the emitter to the extrinsic base. The invention also includes the resulting bipolar transistor structure.

摘要翻译： 一种制造双极晶体管结构的方法，其使用非自对准技术建立自对准结构来提供升高的外部基极的单位电流增益频率（fT）和最大振荡频率（fMAX）改善。 因此，本发明消除了当前自对准引起的外在基本过程的复杂性和成本。 本发明形成凸起的非本征基极和在着陆焊盘（即，蚀刻停止层）上开口的发射体，然后用部分转换为绝缘体的导体代替着陆焊盘。 一旦绝缘体从发射极开口移除，就在发射极开口中形成发射极。 导体的未转换部分提供导电基极连接，并且在间隔物下方的绝缘体的剩余部分将外部基极与发射极隔离，同时保持发射极到外部基极的自对准。 本发明还包括所得到的双极晶体管结构。

公开(公告)号：US20050009305A1

公开(公告)日：2005-01-13

申请号：US10604116

申请日：2003-06-26

申请人： Brent Anderson ,  Edward Nowak ,  BethAnn Rainey

发明人： Brent Anderson ,  Edward Nowak ,  BethAnn Rainey

IPC分类号： H01L20060101 ,  H01L21/20 ,  H01L21/324 ,  H01L21/336 ,  H01L21/8238 ,  H01L29/04 ,  H01L29/786 ,  H01L31/036

CPC分类号： H01L21/02595 ,  H01L21/02667 ,  H01L21/2022 ,  H01L29/66795 ,  H01L29/785

摘要： A method of providing a freestanding semiconductor layer on a conventional SOI or bulk-substrate silicon device includes forming an amorphous or polycrystalline mandrel on a monocrystalline base structure. A conformal polycrystalline semiconductor layer is then formed on the mandrel and on the base structure, wherein the polycrystalline layer contacts the base structure. The polycrystalline semiconductor layer is then recrystallized so that it has a crystallinity substantially similar to that of the base structure. Thus, a freestanding semiconductor layer is formed with a high degree of control of the thickness and height thereof and maintaining a uniformity of thickness.

摘要翻译： 在传统的SOI或体衬底硅器件上提供独立半导体层的方法包括在单晶基底结构上形成非晶或多晶心轴。 然后在心轴和基底结构上形成共形多晶半导体层，其中多晶层接触基底结构。 然后将多晶半导体层重结晶，使其具有与基础结构基本相似的结晶度。 因此，以高度控制其厚度和高度的方式形成独立的半导体层并保持厚度的均匀性。