Method of and apparatus for depositing solder on a printed circuit board
    44.
    发明授权
    Method of and apparatus for depositing solder on a printed circuit board 失效
    在印刷电路板上沉积焊料的方法和装置

    公开(公告)号:US5395643A

    公开(公告)日:1995-03-07

    申请号:US190700

    申请日:1994-02-02

    摘要: Solder is deposited on a printed circuit board by melting the solder in a container. The container has a slot for passage of solder, therethrough and control means actuable to alternately allow and prevent passage of solder through the slot. The slot is placed in contact with a stencil and the control means is actuated to allow passage of solder through the slot. The stencil is moved relative to the container in a direction transverse of the slot to deposit solder on the printed circuit board via the stencil.

    摘要翻译: 焊料通过将焊料熔化在容器中而沉积在印刷电路板上。 容器具有用于通过焊料的插槽和可操作的控制装置,以交替地允许和防止焊料通过狭槽。 槽被放置成与模板接触,并且控制装置被致动以允许焊料通过槽。 模板在横向于槽的方向上相对于容器移动,以通过模板将焊料沉积在印刷电路板上。