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182 条记录 (耗时 0.033 秒)

    Formation of Conductive Templates Employing Indium Tin Oxide
    42.
    发明申请
    Formation of Conductive Templates Employing Indium Tin Oxide 审中-公开
    形成使用氧化铟锡的导电模板

    公开(公告)号：US20090214686A1

    公开(公告)日：2009-08-27

    申请号：US12434921

    申请日：2009-05-04

    申请人： Sidlgata V. Sreenivasan ,  Ian Matthew McMackin ,  Byung-Jin Choi ,  Ronald D. Voisin

    发明人： Sidlgata V. Sreenivasan ,  Ian Matthew McMackin ,  Byung-Jin Choi ,  Ronald D. Voisin

    IPC分类号： B28B17/00 ,  B29C35/08

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  C03C17/3417 ,  C03C2217/77 ,  C03C2218/31 ,  C03C2218/328

    摘要： The present invention is directed to a method forming conductive templates that includes providing a substrate; forming a mesa on the substrate; and forming a plurality of recessions and projections on the mesa with a nadir of the recessions comprising electrically conductive material and the projections comprising electrically insulative material. It is desired that the mesa be substantially transparent to a predetermined wavelength of radiation, for example ultraviolet radiation. As a result, it is desired to form the electrically conductive material from a material that allows ultraviolet radiation to propagate therethrough. In the present invention indium tin oxide is a suitable material from which to form the electrical conductive material.

    摘要翻译： 本发明涉及一种形成导电模板的方法，其包括提供衬底; 在基板上形成台面; 以及在所述台面上形成多个凹陷和突出部，其中所述凹陷的最低点包括导电材料，并且所述突起包括电绝缘材料。 希望台面对于预定波长的辐射例如紫外线辐射基本上是透明的。 结果，期望由允许紫外线辐射传播的材料形成导电材料。 在本发明中，氧化铟锡是形成导电材料的合适材料。

    Capillary imprinting technique
    43.
    发明授权
    Capillary imprinting technique 有权
    毛细管压印技术

    公开(公告)号：US07442336B2

    公开(公告)日：2008-10-28

    申请号：US10645306

    申请日：2003-08-21

    申请人： Byung-Jin Choi ,  Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    发明人： Byung-Jin Choi ,  Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    IPC分类号： B29C35/08 ,  B29C41/12 ,  B81C1/00

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  C23F1/08

    摘要： The present invention provides a method for patterning a substrate with a template having a mold that features positioning conformable material between the substrate and the mold and filling a volume defined between the mold and the substrate with the conformable material through capillary action between the conformable material and one of the mold and the substrate. Thereafter, the conformable material is solidified. Specifically, the distance between the mold and the substrate is controlled to a sufficient degree to attenuate, if not avoid, compressive forces between the mold and the substrate. As a result, upon initial contact of the mold with the conformable material, spontaneous capillary filling of the volume between the mold and the substrate occurs.

    摘要翻译： 本发明提供了一种用模板图案化模板的方法，该模板具有在基板和模具之间具有定位适形材料的模具，并且通过适形材料之间的毛细管作用在适形材料之间填充限定在模具和基板之间的体积， 模具和基材之一。 此后，使适形材料固化。 具体地说，模具和基板之间的距离被控制到足够的程度以减小模具和基板之间的压缩力（如果不是避免的话）。 结果，在模具与适形材料初次接触时，发生模具和基板之间的体积的自发毛细管填充。

    Methods for Exposure for the Purpose of Thermal Management for Imprint Lithography Processes
    44.
    发明申请
    Methods for Exposure for the Purpose of Thermal Management for Imprint Lithography Processes 有权
    用于印刷光刻工艺的热管理目的的曝光方法

    公开(公告)号：US20080153312A1

    公开(公告)日：2008-06-26

    申请号：US12047572

    申请日：2008-03-13

    申请人： Sidlgata V. Sreenivasan ,  Byung-Jin Choi

    发明人： Sidlgata V. Sreenivasan ,  Byung-Jin Choi

    IPC分类号： H01L21/469

    CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    摘要： The present invention is directed to a method that attenuates, if not avoids, heating of a substrate undergoing imprint lithography process and the deleterious effects associated therewith. To that end, the present invention includes a method of patterning a field of a substrate with a polymeric material that solidifies in response to actinic energy in which a sub-portion of the field is exposed sufficient to cure the polymeric material is said sub-portion followed by a blanket exposure of all of the polymeric material associated with the entire field to cure/solidify the same.

    摘要翻译： 本发明涉及一种衰减（如果不是避免）加热经历压印光刻工艺的衬底和与之有关的有害影响的方法。 为此，本发明包括使用聚合物材料对基材的场图案化的方法，该聚合物材料响应于其中暴露足够固化聚合物材料的场的部分暴露的光化能而固化，所述子部分 随后与整个场相关联的所有聚合物材料的全面曝光以固化/固化。

    Magnification correction employing out-of-plane distortion of a substrate
    45.
    发明授权
    Magnification correction employing out-of-plane distortion of a substrate 有权
    使用基板的平面外失真的放大率校正

    公开(公告)号：US07323130B2

    公开(公告)日：2008-01-29

    申请号：US10735110

    申请日：2003-12-12

    申请人： Pawan K. Nimmakayala ,  Sidlgata V. Sreenivasan ,  Byung-Jin Choi ,  Anshuman Cherala

    发明人： Pawan K. Nimmakayala ,  Sidlgata V. Sreenivasan ,  Byung-Jin Choi ,  Anshuman Cherala

    IPC分类号： B29C41/02 ,  B29C41/48 ,  B29C41/50 ,  B29C53/02

    CPC分类号： B82Y10/00 ,  B29C59/02 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00

    摘要： The present invention is directed to a method of controlling dimensional relations between an original pattern present in a mold and a recorded pattern formed in a layer of a substrate. In this manner, the size of the recorded pattern may appear to be magnified and/or reduced, when compared to the original pattern. To that end, the method comprises defining a region on the layer in which to produce the recorded pattern. The substrate is bent to produce a contoured surface in the region. Dimensional variations in the original pattern are produced by bending the mold, defining a varied pattern. The contoured surface and the mold are provided to have similar radii of curvatures. The varied pattern is then recorded in the layer. These and other embodiments of the present invention are discussed more fully below.

    摘要翻译： 本发明涉及一种控制存在于模具中的原始图案与形成在基底层中的记录图案之间的尺寸关系的方法。 以这种方式，与原始图案相比，记录图案的尺寸可能看起来被放大和/或缩小。 为此，该方法包括定义在其上产生记录图案的层上的区域。 该基底被弯曲以在该区域中产生轮廓表面。 通过弯曲模具产生原始图案的尺寸变化，限定了不同的图案。 轮廓表面和模具被提供以具有相似的曲率半径。 然后将不同的图案记录在图层中。 下面将更全面地讨论本发明的这些和其它实施例。