Abstract:
Disclosed is a tripod. The tripod comprises a base body, a plurality of tripod tubes and a plurality of connecting components. An end of each tripod tube is pivotally connected to the base body. The plurality of tripod tubes is pivotally operated in relation to the base body either at a folded state or at an expanding state. The other end of the plurality of tripod tubes get being close to each other so as to be folded in the folded state, and the other end of the plurality of tripod tubes get being far from each other so as to be expanding in the expanding state. Each of the plurality of connecting components is pivotally connected between the tripod tubes adjacent to each other. the two connecting elements are pulled by the tripod tubes connected to the two connecting elements in such a manner that the connecting elements are pulled by each other to be a straight line so as to provide a steady force to support the adjacent tripod tubes and thus to provide stable supporting force for a photographic equipment.
Abstract:
The present invention relates to a lighting structure used in photographing or video recording. The lighting structure of the present invention includes four holders, which are disposed around a periphery of the lighting structure and are configured in a symmetrical manner with each other. At least one engaging member is formed between each one of the holder in a predetermined clockwise/counterclockwise direction. The lighting structure of the present invention can be assembled with a light cover. The light cover includes two intersecting supporting rods, which are corresponding to the engaging members. The two intersecting supporting rods can be engaged with the engaging members.
Abstract:
A fin-shaped field-effect transistor process includes the following steps. A substrate is provided. A first fin-shaped field-effect transistor and a second fin-shaped field-effect transistor are formed on the substrate, wherein the first fin-shaped field-effect transistor includes a first metal layer and the second fin-shaped field-effect transistor includes a second metal layer. A treatment process is performed on the first fin-shaped field-effect transistor to adjust the threshold voltage of the first fin-shaped field-effect transistor. A fin-shaped field-effect transistor formed by said process is also provided.
Abstract:
A semiconductor process includes the following steps. A substrate having a first area and a second area is provided. A thick oxide layer and a dummy gate layer are formed on the substrate and in the first area and the second area. The dummy gate layer is removed to expose the thick oxide layer. The thick oxide layer in the first area is removed and then a thinner oxide layer is formed in the first area; or, the thick oxide layer in the first area is thinned down and a thinner oxide layer is therefore formed.
Abstract:
A semiconductor structure and a method of fabricating the same comprising the steps of providing a substrate, forming at least one fin structure on said substrate, forming a gate covering said fin structure, forming a plurality of epitaxial structures covering said fin structures, performing a gate pullback process to reduce the critical dimension (CD) of said gate and separate said gate and said epitaxial structures, forming lightly doped drains (LDD) in said fin structures, and forming a spacer on said gate and said fin structures.
Abstract:
A method of forming a Non-planar FET is provided. A substrate is provided. An active region and a peripheral region are defined on the substrate. A plurality of VSTI is formed in the active region of the substrate. A part of each VSTI is removed to expose a part of sidewall of the substrate. Then, a conductor layer is formed on the substrate which is then patterned to form a planar FET gate in the peripheral region and a Non-planar FET gate in the active region simultaneously. Last, a source/drain region is formed on two sides of the Non-planar FET gate.
Abstract:
A method for fabricating metal gate transistor and resistor is disclosed. The method includes the steps of: providing a substrate having a transistor region and a resistor region; forming a shallow trench isolation in the substrate of the resistor region; forming a tank in the shallow trench isolation of the resistor region; forming at least one gate in the transistor region and a resistor in the tank of the resistor region; and transforming the gate into a metal gate transistor.
Abstract:
A photographic reflector includes an engagement unit, a support frame, a fabric canopy, and a lamp holder. The engagement unit includes an engagement seat and an engagement member moveably mounted in the engagement seat. The support frame includes a plurality of ribs and a plurality of stretchers corresponding to each respective rib. One end of each rib is pivotally connected to the engagement seat. One end of each stretcher is pivotally connected to a preset location of the corresponding rib, and the other end of each stretcher is pivotally connected to the engagement member. The fabric canopy is mounted on the ribs of the support frame and has a reflective layer at an inside thereof and a mounting hole defined at a location close to the engagement unit. The lamp holder is mounted in the mounting hole of the fabric canopy. The photographic reflector can be folded as compactly as desired, easily stored, and convenient in transportation and use.
Abstract:
A method for fabricating metal gate transistor and resistor is disclosed. The method includes the steps of: providing a substrate having a transistor region and a resistor region; forming a shallow trench isolation in the substrate of the resistor region; forming a tank in the shallow trench isolation of the resistor region; forming at least one gate in the transistor region and a resistor in the tank of the resistor region; and transforming the gate into a metal gate transistor.