摘要:
A feedthrough terminal assembly for an active implantable medical device utilizes to establish a reliable electrical connection between capacitor electrode plates, via inner surface metallization of a capacitor aperture, and an associated terminal pin 10, which passes at least partially therethrough. The inserts are preferably resiliently flexible, such as a spring, to establish this connection. The insert also serves to establish a mechanical connection between the capacitor and the terminal pin.
摘要:
An EMI filter capacitor assembly utilizes biocompatible and non-migratable materials to adapt electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials. Layers of glass may be disposed over surfaces of the assembly, including the capacitor.
摘要:
A terminal assembly for active implantable medical devices includes a structural pad, in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device.
摘要:
Coatings for implantable electrodes consisting of single- or multi-walled nanotubes, nanotube ropes, carbon whiskers, and a combination of these are described. The nanotubes can be carbon or other conductive nanotube-forming materials such as a carbon-doped boron nitride. The nanotube coatings are grown “in situ” on a catalytic substrate surface from thermal decomposition, or they are bonded to the substrate using a metal or conductive metal oxide thin film binder deposited by means of a metal compound precursor in liquid form. In the latter case, the precursor/nanotube coating is then converted to a pure metal or conductive metal oxide, resulting in the desired surface coating with imbedded nanotubes.