摘要:
The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
摘要:
The present invention relates to a composite with thermo-formability, a method for making the same and a method for making a casing with a texture on the surface thereof. The composite includes a polyurethane medium layer, a thermo-formable resin layer, a base layer and a surface layer. The thermo-formable resin layer is disposed on the polyurethane medium layer, and includes polyol. The base layer is disposed on the thermo-formable resin layer. The surface layer is disposed on the base layer. As a result, the composite has good stability after thermoforming, and plastic can be injected into the composite, so a PC film is unnecessary. Moreover, the composite may be adhered to a substrate directly or after thermoforming.
摘要:
The present invention relates to a method of producing a polishing pad, comprising steps of: (a) providing a base material comprising a plurality of fibers; said base material having a surface for polishing a substrate, wherein the fibers comprise a core and a cladding surrounding the core, and the cladding comprises a hydrophobic polymer; (b) impregnating the surface of the base material with an elastomer solution; (c) coagulating the elastomer impregnated in the surface of the base material to mold the elastomer and to form a plurality of first continuous pores between the elastomer, and between the elastomer and the fibers; (d) planarizing the surface of the base material; (e) impregnating the surface of the base material and elastomer obtained in the step (d) with a condition polymer solution; and (e) curing the condition polymer impregnated in the surface of the base material and elastomer and partially filling the condition polymer into the first continuous pores to form a plurality of second continuous pores.
摘要:
The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.
摘要:
The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
摘要:
The present invention relates to a composite with thermo-formability, a method for making the same and a method for making a casing with a texture on the surface thereof. The composite includes a PU medium layer, a thermo-formable resin layer, a base layer and a surface layer. The thermo-formable resin layer is disposed on the PU medium layer, and includes polyol. The base layer is disposed on the thermo-formable resin layer. The surface layer is disposed on the base layer. As a result, the composite has good stability after thermoforming, and plastic can be injected into the composite, so a PC film is unnecessary. Moreover, the composite may be adhered to a substrate directly or after thermoforming.
摘要:
The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has high unity and flatness. The grinding layer has attenuated structures and a plurality of holes, thus increasing the storage ability of polishing particles distributed in a polishing liquid. In addition, the polishing pad has high compression ratio, so the polishing pad can compactly contact a polishing workpiece, and will not scratch the surface of the polishing workpiece scratched. Therefore, the polishing effect and quality will be improved.
摘要:
The present invention relates to a method for patterning a covering material by using a high-power exciting beam. The method includes the steps of (a) providing a base material having a plurality of thin layers, the neighboring thin layers having different colors; and (b) utilizing a high-power exciting beam to form at least one pattern on the base material, in which the pattern has at least one concave portion, so as to expose the thin layers with different colors. As a result, the covering material has a layered visual effect and many colors. Furthermore, the patterning method of the present invention is simple, and can form the pattern on the base material easily Therefore, the manufacturing time of the covering material with the pattern is reduced.
摘要:
The invention relates to a polishing pad having hollow fibers and a method for making the same. The polishing pad comprises a body and a plurality of hollow fibers. The body has a polishing surface. The hollow fibers are located within the body and have an opening on the polishing surface, wherein the hollow area of the section of each hollow fiber is larger than the sectional area of polishing particles in a polishing slurry. Therefore, the polishing slurry and polishing particles achieve a thorough circulation on the polishing pad via the hollow fibers.
摘要:
The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece.