公开(公告)号：US10799982B2

公开(公告)日：2020-10-13

申请号：US15874555

申请日：2018-01-18

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/142 ,  B23K26/382 ,  B23K26/14

Abstract: To provide a nozzle for laser processing head capable of reliably drilling a small hole when drilling of the workpiece is performed by using a laser machine. A nozzle includes: a nozzle tip body that irradiates a workpiece with a laser beam; a charge port formed in the nozzle tip body; an exhaust port formed in the nozzle tip body so as to oppose to the charge port; and an elastic member that is provided in a tip end of the nozzle tip body and contacts with the workpiece while elastically extending and contracting in the axial center direction of the nozzle tip body. The nozzle supplies gas to the inside of the nozzle tip body along a gas flow path extending from the charge port to the exhaust port in a form of crossing across the laser beam in the nozzle tip body, to generate a negative pressure in the vicinity of an opening part of a tip end of the nozzle tip body. The elastic member contacts with the workpiece and improves the degree of enclosure of the nozzle tip body by the workpiece. Thereby, higher negative pressure than the negative pressure is generated.

公开(公告)号：US10792768B2

公开(公告)日：2020-10-06

申请号：US16270830

申请日：2019-02-08

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: B23K26/70 ,  B23K26/14 ,  B23K26/142 ,  B23K26/06

Abstract: A laser machining head includes a protection window disposed inclined with respect to an optical axis of a laser beam, an inflow port disposed downstream of the protection window and configured to allow a gas to flow in, and a flow dividing projection configured to divide the gas into a first laminar flow flowing along parallel to a surface of the protection window and a second laminar flow flowing toward a workpiece. The flow dividing projection is disposed in a position opposing to the inflow port with the optical axis of the laser beam as the center.

公开(公告)号：US10792758B2

公开(公告)日：2020-10-06

申请号：US16129239

申请日：2018-09-12

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/046 ,  B23K26/06 ,  B23K26/70

Abstract: A laser machining device includes a storage unit configured to store a reference value based on an energy amount of returning light when laser light is emitted, in a state where external optical system is not contaminated, toward a reflection plate with a predetermined output low enough not to melt or deform the reflection plate such that a focus position of the laser light aligns with a predetermined position, and a processing condition correction unit configured to correct, prior to laser machining, a processing condition in accordance with the contamination level of the external optical system, wherein the processing condition correction unit includes a laser power correction section configured to correct a laser power of the processing condition based on the measurement value measured by a returning light measurement unit and the reference value.

公开(公告)号：US20200061738A1

公开(公告)日：2020-02-27

申请号：US16539107

申请日：2019-08-13

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: B23K26/03 ,  B23K26/14 ,  B23K26/12

Abstract: A laser processing system that can effectively blow out a material of a workpiece that is melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system includes a nozzle having an emission opening that emits a jet of the assist gas along an optical axis of the laser beam, the nozzle forming a maximum point of velocity of the jet at a position away from the emission opening and is configured such that during processing of the workpiece by the laser beam, a nozzle is disposed with respect to a process portion of the workpiece W, at a target position determined based on a position of the maximum point.

公开(公告)号：US10562131B2

公开(公告)日：2020-02-18

申请号：US15874466

申请日：2018-01-18

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/362 ,  B23K26/382 ,  B23K26/38 ,  B23K26/16 ,  B23K26/14 ,  B23K26/21 ,  B23K26/142

Abstract: To provide a laser machine capable of reliably drilling a small hole when drilling of the workpiece is performed. A laser machine 1 includes: a laser oscillator; a light guide path; a processing head; and a nozzle. The nozzle includes: a nozzle tip body that irradiates the workpiece with the laser beam; a charge port formed in the nozzle tip body; and an exhaust port formed in the nozzle tip body so as to oppose to the charge port. The nozzle supplies gas to the inside of the nozzle tip body along a gas flow path extending from the charge port to the exhaust port in a form of crossing across the laser beam in the nozzle tip body, to generate a negative pressure in the vicinity of an opening part of a tip end of the nozzle tip body.

公开(公告)号：US10456869B2

公开(公告)日：2019-10-29

申请号：US15467403

申请日：2017-03-23

Applicant: FANUC CORPORATION

Inventor： Atsushi Mori ,  Takashi Izumi ,  Akinori Ohyama

IPC: B23K26/60 ,  B23K26/70 ,  B23K26/03

Abstract: A laser processing device has a preprocessing controller which issues a command to perform preprocessing of a workpiece under high output conditions, which are previously found by an experiment or calculation in accordance with at least some of processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is melted, changed in shape, or denatured; a command to irradiate the workpiece with a laser beam under low output conditions, which are previously found by an experiment or calculation in accordance with at least some of the processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is not melted, changed in shape, or denatured; and a command of whether to start the laser processing, based on a first light quantity of light reflected or emitted from a processing point irradiated with a laser beam under the low output conditions.

公开(公告)号：US10456864B2

公开(公告)日：2019-10-29

申请号：US15266259

申请日：2016-09-15

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/14 ,  B23K26/142 ,  B23K26/70 ,  B23K26/12

Abstract: A laser processing system herein includes a laser oscillator, a laser optical path that guides laser beam from a laser beam emission port of the laser oscillator to a workpiece, an impure gas absorbent for absorbing impure gases that influence the propagation of the laser beam, and a shutter that exposes the impure gas absorbent in the laser optical path.

公开(公告)号：US10363630B2

公开(公告)日：2019-07-30

申请号：US15478695

申请日：2017-04-04

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/062 ,  B23K26/03 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/70

Abstract: A laser processing method is performed in a laser processing apparatus which outputs a laser beam from a processing head to a workpiece, to perform laser processing while controlling reflected light of the output laser beam to a prescribed value or less. The laser processing method includes the step of, before performing laser processing for the workpiece, increasing laser power stepwise from laser power lower than laser power included in a processing condition of the laser processing, to emit a laser beam from a laser oscillator, and measuring reflected light by a reflected light sensor, and the step of deciding an output condition for decreasing reflected light based on a measured value of the reflected light and the prescribed value, and the step of decreasing reflected light before performing the laser processing by irradiating the workpiece with a laser beam for a predetermined period of time on the decided output condition.

公开(公告)号：US20190076958A1

公开(公告)日：2019-03-14

申请号：US16129239

申请日：2018-09-12

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/046 ,  B23K26/06

Abstract: A laser machining device includes a storage unit configured to store a reference value based on an energy amount of returning light when laser light is emitted, in a state where external optical system is not contaminated, toward a reflection plate with a predetermined output low enough not to melt or deform the reflection plate such that a focus position of the laser light aligns with a predetermined position, and a processing condition correction unit configured to correct, prior to laser machining, a processing condition in accordance with the contamination level of the external optical system, wherein the processing condition correction unit includes a laser power correction section configured to correct a laser power of the processing condition based on the measurement value measured by a returning light measurement unit and the reference value.

公开(公告)号：US20190061066A1

公开(公告)日：2019-02-28

申请号：US16105592

申请日：2018-08-20

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/70 ,  B23K26/064 ,  B23K26/08

CPC classification number: B23K26/707 ,  B23K26/046 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/066 ,  B23K26/08 ,  B23K26/703 ,  B23K26/705

Abstract: A laser machining device includes a contamination determining part that determines contamination of an external optical system before laser machining; the contamination determining part includes a lens contamination determining section that determines contamination of a lens in the external optical system on the basis of a comparison between a first measurement value, which is measured by an energy amount measuring part in a state where the external optical system is not heated, and a second measurement value, which is measured by the energy amount measuring part in a state where the external optical system is heated.