公开(公告)号：US20190061245A1

公开(公告)日：2019-02-28

申请号：US15757283

申请日：2015-12-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Elmer Abbott, Jr. ,  David A. Champion ,  Chris Paul Schodin

IPC: B29C64/245 ,  B29C64/112 ,  B29C64/291 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B29C64/393

Abstract: In example implementations, an apparatus includes a housing, a movable base, a tab portion and a coupling mechanism. The housing is comprised of a microwave transparent material. The movable base is coupled to the housing to receive build material that is digitally printed. The tab portion is coupled to a bottom portion of at least one wall of the housing. The tab portion stops the movable base. The coupling mechanism is coupled to the housing to removably attach the apparatus to a three dimensional printer.

公开(公告)号：US20180243990A1

公开(公告)日：2018-08-30

申请号：US15757614

申请日：2015-12-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Elmer Abbott, Jr. ,  David A. Champion ,  Fernando Juan

IPC: B29C64/379 ,  B29C64/291 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/165 ,  B29C64/393 ,  B33Y50/02 ,  B33Y70/00

CPC classification number: B29C64/379 ,  B22F3/105 ,  B29C35/0805 ,  B29C64/165 ,  B29C64/291 ,  B29C64/393 ,  B29C71/02 ,  B29C2035/0855 ,  B32B18/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y70/00 ,  C04B35/053 ,  C04B35/111 ,  C04B35/14 ,  C04B35/185 ,  C04B35/46 ,  C04B35/486 ,  C04B35/495 ,  C04B35/505 ,  C04B35/553 ,  C04B35/583 ,  C04B35/584 ,  C04B35/653 ,  C04B2235/5436 ,  C04B2235/6025

Abstract: In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.

公开(公告)号：US09873274B2

公开(公告)日：2018-01-23

申请号：US15306855

申请日：2014-04-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Elmer Abbott, Jr.

IPC: B41J29/377 ,  F25B21/00 ,  B41J2/14

CPC classification number: B41J29/377 ,  B41J2/14016 ,  F25B21/00 ,  F25B2321/001 ,  Y02B30/66

Abstract: The present disclosure is drawn to electrocaloric heating and cooling devices and related methods. The electrocaloric heating and cooling devices can comprise an electronic feature of an integrated circuit, wherein the electronic feature is for heating and cooling cycles. The device can also include an electrocaloric film in thermal communication with the electronic feature which includes a blend or solid solution of two or more components selected from the group consisting of BNT, BKT, BZT, BMgT, and BNiT. Electrodes can be associated with the electrocaloric film, and an electrical source can be to add or reduce electrical field between the electrodes across the electrocaloric film to influence both heating and cooling of the electronic feature.

公开(公告)号：US20170305066A1

公开(公告)日：2017-10-26

申请号：US15513483

申请日：2014-09-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Krzysztof Nauka ,  Sivapackia Ganapathiappan ,  Lihua Zhao ,  Howard S. Tom ,  Yan Zhao ,  Hou T. Ng ,  James Elmer Abbott, Jr. ,  Alexander Govyadinov ,  Vladek Kasperchik

IPC: B29C64/264 ,  B33Y10/00 ,  B33Y50/02 ,  B29C64/393

CPC classification number: B29C64/264 ,  B29C64/165 ,  B29C64/393 ,  B33Y10/00 ,  B33Y50/02

Abstract: In one example, a non-transitory processor readable medium having instructions thereon that when executed cause an additive manufacturing machine to expose build material to a light source emitting monochromatic light within a band of wavelengths that includes a peak light absorption of a liquid coalescing agent to be dispensed on to the build material.

公开(公告)号：US09557288B2

公开(公告)日：2017-01-31

申请号：US13873199

申请日：2013-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Elmer Abbott, Jr. ,  Greg Scott Long ,  Michael A. Delos-Reyes

IPC: C23C14/00 ,  C23C14/32 ,  G01N27/403 ,  C23C14/34

CPC classification number: G01N27/403 ,  C23C14/34

Abstract: A well is formed in a body of dielectric material and has a chamfered edge about a top side of the well. A top electrode layer is on a top face of the body and on the chamfered edge of the well. A bottom electrode is on a floor of the well.

Abstract translation: 在电介质材料体中形成一个阱，并且具有围绕阱的顶侧的倒角边缘。 顶部电极层位于主体的顶面和井的倒角边缘上。 底部电极位于井的地板上。