公开(公告)号：US11279130B2

公开(公告)日：2022-03-22

申请号：US16958578

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W Cumbie ,  David J Benson ,  Randy Hoffman ,  Amy Gault

IPC: B41J2/14 ,  B41J2/16

Abstract: Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.

公开(公告)号：US11225086B2

公开(公告)日：2022-01-18

申请号：US16466408

申请日：2017-03-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Reynaldo V Villavelez ,  Chien-Hua Chen

IPC: B41J2/335

Abstract: A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.

公开(公告)号：US11136703B2

公开(公告)日：2021-10-05

申请号：US16064188

申请日：2016-04-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W Cumbie ,  David Olsen ,  Diane R Hammerstad ,  Eric M Laplante

IPC: D06F39/02 ,  G05B19/042 ,  D06F33/00

Abstract: Example implementations relate to a mixing chamber for laundry supplies. For example, an appliance may include a mixing chamber to receive at least one laundry supply and a processor coupled to the mixing chamber. The processor is to identify a user-specified setting associated with a laundry load, determine a characteristic of the laundry load, calculate an amount of the at least one laundry supply to apply to the laundry load based on the user-specified setting and the characteristic, and provide the amount of the at least one laundry supply to the mixing chamber, where the mixing chamber is to mix the amount of the at least one laundry supply.

公开(公告)号：US20210291520A1

公开(公告)日：2021-09-23

申请号：US17303656

申请日：2021-06-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Galen Cook ,  Garrett E Clark ,  Michael W Cumbie ,  James R Przybyla ,  Richard Seaver ,  Frank D Derryberry ,  Si-lam J Choy

IPC: B41J2/145 ,  B41J2/14

Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.

公开(公告)号：US11046073B2

公开(公告)日：2021-06-29

申请号：US16483101

申请日：2017-04-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  James R Przybyla

IPC: B41J29/377 ,  B41J2/16 ,  B41J2/14 ,  B41J2/175

Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid recirculation pumps within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of heat exchangers thermally coupled to a fluid channel side of the fluid ejection die.

公开(公告)号：US20210129550A1

公开(公告)日：2021-05-06

申请号：US16605088

申请日：2017-10-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Anthony D Studer

IPC: B41J2/175

Abstract: In one example, a fluid property sensor includes an electrical circuit assembly (ECA), an elongated circuit (EC), and an external interface. The EC is attached to the ECA and includes multiple point sensors distributed along a length of the EC. The external interface is electrically coupled to a proximal end of the EC. The EC and the external interface are packaged together with an encasement on both sides of the ECA to form the fluid property sensor.

公开(公告)号：US20200331264A1

公开(公告)日：2020-10-22

申请号：US16916520

申请日：2020-06-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/16

Abstract: A fluid ejection die includes an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. The die includes a fluid input hole fluidly connected to the ejection chamber, a fluid output hole, and a fluid output channel fluidly connected to the ejection chamber and the fluid output hole. The die includes a fluid circulation rib positioned between the fluid input hole and the fluid output hole.

公开(公告)号：US20200247123A1

公开(公告)日：2020-08-06

申请号：US16485214

申请日：2017-04-24

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Tony Fuller

IPC: B41J2/14 ,  B41J2/16

Abstract: A fluid ejection device includes a molded body having a first molded surface and a second molded surface opposite the first molded surface, and a fluid ejection die molded into the molded body, with the fluid ejection die having a first surface substantially coplanar with the first molded surface of the molded body and a second surface substantially coplanar with the second molded surface of the molded body, with the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein.

公开(公告)号：US20200246799A1

公开(公告)日：2020-08-06

申请号：US16605675

申请日：2017-10-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Viktor Shkolnikov ,  Michael W Cumbie ,  Chien-Hua Chen

IPC: B01L3/00

Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.

公开(公告)号：US20200238699A1

公开(公告)日：2020-07-30

申请号：US16634926

申请日：2017-09-20

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-lam Choy ,  Chien-Hua Chen ,  Michael W Cumbie

IPC: B41J2/14

Abstract: A fluidic die includes a fluid channel layer including at least one fluid channel defined along a length of the fluid ejection device. The fluidic die also includes an interposer layer coupled to the fluid channel layer. The interposer layer includes a number of inlet ports defined in the interposer layer to fluidically couple the at least one channel layer to a fluid source, and a number of outlet ports defined in the interposer layer to fluidically couple the at least one channel layer to the fluid source.