公开(公告)号：US08937274B2

公开(公告)日：2015-01-20

申请号：US13713304

申请日：2012-12-13

Applicant: Risako Ueno ,  Hiroto Honda ,  Mitsuyoshi Kobayashi ,  Kazuhiro Suzuki ,  Honam Kwon ,  Hideyuki Funaki

Inventor： Risako Ueno ,  Hiroto Honda ,  Mitsuyoshi Kobayashi ,  Kazuhiro Suzuki ,  Honam Kwon ,  Hideyuki Funaki

IPC: H01L27/00 ,  H01L27/146

CPC classification number: H01L27/146 ,  H01L27/14605 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14645

Abstract: A solid-state imaging device according to an embodiment includes: an imaging element including a semiconductor substrate and a plurality of pixel blocks, each of the pixel blocks including at least two of R pixels, G pixels, B pixels, and W pixels; a first optical system configured to form an image of an object on an imaging plane; and a second optical system including a microlens array having a plurality of microlenses provided for the respective pixels blocks, the second optical system being located between the imaging element and the first optical system, the second optical system being configured to reduce and re-image the image formed on the imaging plane onto each of the pixel blocks. A proportion of the W pixels to be provided increases in a direction from a center of each pixel block toward an outer periphery thereof.

Abstract translation: 根据实施例的固态成像装置包括：成像元件，包括半导体衬底和多个像素块，每个像素块包括R像素，G像素，B像素和W像素中的至少两个; 第一光学系统，被配置为在成像平面上形成物体的图像; 以及第二光学系统，其包括具有为各个像素块设置的多个微透镜的微透镜阵列，所述第二光学系统位于所述成像元件和所述第一光学系统之间，所述第二光学系统被配置为减小并重新成像 在成像平面上形成的每个像素块上的图像。 要提供的W像素的比例在从每个像素块的中心朝向其外周的方向上增加。

公开(公告)号：US08711267B2

公开(公告)日：2014-04-29

申请号：US13039502

申请日：2011-03-03

Applicant: Risako Ueno ,  Yoshinori Iida ,  Hideyuki Funaki

Inventor： Risako Ueno ,  Yoshinori Iida ,  Hideyuki Funaki

IPC: H04N5/225 ,  G02B13/16

CPC classification number: H04N9/045

Abstract: According to an embodiment, a solid-state imaging device includes: an imaging element formed on a semiconductor substrate; a first optical system configured to focus an image of a subject on an imaging plane; a second optical system including a microlens array including a plurality of microlenses corresponding to the pixel blocks, and re-focusing the image of the imaging plane onto the pixel blocks corresponding to the respective microlenses; a first filter placed on the second optical system, and including a plurality of first color filters corresponding to the microlenses; and a second filter placed on the imaging element, and including a plurality of second color filters corresponding to the first color filters of the first filter. The first and second filters are designed so that the first and second color filters deviate to a periphery of the imaging area, the deviation becoming larger toward the periphery of the imaging area.

Abstract translation: 根据实施例，固态成像装置包括：形成在半导体衬底上的成像元件; 配置成将被摄体的图像聚焦在成像平面上的第一光学系统; 包括微透镜阵列的第二光学系统，所述微透镜阵列包括对应于所述像素块的多个微透镜，以及将所述成像平面的图像重新聚焦到与所述各个微透镜相对应的像素块上; 放置在第二光学系统上的第一滤光器，并且包括对应于微透镜的多个第一滤色器; 以及放置在成像元件上的第二滤光器，并且包括与第一滤光器的第一滤色器相对应的多个第二滤色器。 第一滤波器和第二滤波器被设计成使得第一和第二滤色器偏离成像区域的周边，偏离朝向成像区域的周围变大。

公开(公告)号：US08643762B2

公开(公告)日：2014-02-04

申请号：US13221195

申请日：2011-08-30

Applicant: Kazuhiro Suzuki ,  Risako Ueno ,  Hideyuki Funaki

Inventor： Kazuhiro Suzuki ,  Risako Ueno ,  Hideyuki Funaki

IPC: H04N5/225 ,  G02B17/00

CPC classification number: G02B13/0015 ,  G02B26/08 ,  G02B27/22 ,  G03B25/02 ,  G03B35/24 ,  H04N13/356

Abstract: An optical element according to an embodiment includes: a lens array including a plurality of convex shaped lenses provided on a first surface thereof and taking a flat shape at a second surface which is opposite from the first surface; a lens holder comprising concave portions formed to correspond to respective lenses in the lens array, at a surface opposed to the lens array, each of the concave portions having a size which makes it possible for one of the convex shaped lenses corresponding to the concave portion to fit therein; and a drive unit configured to drive at least one of the lens array and the lens holder to bring the convex shaped lenses in the lens array and the concave portions in the lens holder into an isolation state or a contact state.

Abstract translation: 根据实施例的光学元件包括：透镜阵列，包括设置在其第一表面上的多个凸形透镜，并且在与第一表面相对的第二表面处呈平坦形状; 透镜架，其包括形成为与透镜阵列中的各个透镜相对应的凹部，在与透镜阵列相对的表面处，每个凹部具有使得可以使一个凸形透镜对应于凹部 适合其中 以及驱动单元，被配置为驱动所述透镜阵列和所述透镜保持器中的至少一个，以将所述凸形透镜置于所述透镜阵列中，并且所述透镜保持器中的所述凹部处于隔离状态或接触状态。

公开(公告)号：US08604581B2

公开(公告)日：2013-12-10

申请号：US12211427

申请日：2008-09-16

Applicant: Risako Ueno ,  Hideyuki Funaki ,  Yoshinori Iida ,  Hiroto Honda

Inventor： Risako Ueno ,  Hideyuki Funaki ,  Yoshinori Iida ,  Hiroto Honda

IPC: H01L27/146

CPC classification number: H01L27/1462 ,  H01L27/14605 ,  H01L27/1464

Abstract: A solid-state image pickup device has a photoelectric conversion element that converts light incident from a first surface of a substrate into a signal charge and accumulates the signal charge, a transistor that is formed on a second surface side opposite to the first surface of the substrate and reads out the signal charge accumulated by the photoelectric conversion element, a supporting substrate stuck to the second surface of the substrate, and an antireflection coating formed on the first surface of the substrate, wherein the first surface of the substrate includes a curved surface or an inclined surface forming a prescribed angle to the second surface.

Abstract translation: 固体摄像装置具有将从基板的第一面入射的光转换成信号电荷并积累信号电荷的光电转换元件，形成在与第一表面相反的第二表面侧的晶体管 读取由光电转换元件积累的信号电荷，粘贴到基板的第二表面的支撑基板和形成在基板的第一表面上的抗反射涂层，其中基板的第一表面包括弯曲表面 或与第二表面形成规定角度的倾斜表面。

公开(公告)号：US08466529B2

公开(公告)日：2013-06-18

申请号：US13051413

申请日：2011-03-18

Applicant: Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Koichi Ishii ,  Hideyuki Funaki

Inventor： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Koichi Ishii ,  Hideyuki Funaki

IPC: H01L31/0232

CPC classification number: H01L27/14618 ,  H01L27/14649 ,  H01L2224/13

Abstract: According to one embodiment, an imaging device includes a substrate, a photodetecting portion, a circuit portion and a through interconnect. The substrate has a first major surface, a second major surface on a side opposite to the first major surface, a recess portion provided on the first major surface and retreated in a first direction going from the first major surface to the second major surface, and a through hole communicating with the first major surface and the second major surface and extending in the first direction. The photodetecting portion is provided above the recess portion and away from the substrate. The circuit portion is electrically connected to the photodetecting portion and provided on the first major surface. The through interconnect is electrically connected to the circuit portion and provided inside the through hole. The recess portion has a first inclined surface. The through hole has a second inclined surface.

Abstract translation: 根据一个实施例，成像装置包括基板，光电检测部分，电路部分和通孔互连。 基板具有第一主表面，与第一主表面相对的一侧的第二主表面，设置在第一主表面上并沿着从第一主表面到第二主表面的第一方向退回的凹部，以及 与所述第一主表面和所述第二主表面连通并且沿所述第一方向延伸的通孔。 光电检测部分设置在凹部的上方并远离基板。 电路部分电连接到光电检测部分并设置在第一主表面上。 通孔互连电连接到电路部分并设置在通孔的内部。 凹部具有第一倾斜面。 通孔具有第二倾斜面。

公开(公告)号：US08445950B2

公开(公告)日：2013-05-21

申请号：US12875546

申请日：2010-09-03

Applicant: Yoshinori Iida ,  Risako Ueno ,  Kazuhiro Suzuki ,  Hideyuki Funaki

Inventor： Yoshinori Iida ,  Risako Ueno ,  Kazuhiro Suzuki ,  Hideyuki Funaki

IPC: H01L31/062

CPC classification number: H01L27/1463 ,  H01L27/1464

Abstract: Certain embodiments provide a solid-state imaging device including: a plurality of pixels provided on a semiconductor substrate, each of the pixels having a semiconductor region that converts incident light from a side of a first face of the semiconductor substrate into signal charges and stores the signal charges; a readout circuit provided on a side of a second face that is the opposite side from the first face, and reading out the signal charges stored in the pixels; and a pixel separation structure provided between adjacent ones of the pixels in the semiconductor substrate, the pixel separation structure including a stack film buried in a trench extending from the first face, the stack film including a first insulating film provided along side faces and a bottom face of the trench, and a fixed charge film provided in the trench to cover the first insulating film and retaining fixed charges that are non-signal charges.

Abstract translation: 某些实施例提供了一种固态成像装置，包括：设置在半导体衬底上的多个像素，每个像素具有半导体区域，该半导体区域将来自半导体衬底的第一面侧的入射光转换成信号电荷并将其存储 信号充电 读出电路，设置在与第一面相反一侧的第二面的一侧，并读出存储在像素中的信号电荷; 以及设置在所述半导体衬底中的相邻像素之间的像素分离结构，所述像素分离结构包括埋置在从所述第一面延伸的沟槽中的叠层膜，所述堆叠膜包括沿侧面设置的第一绝缘膜和底部 并且设置在沟槽中的固定电荷膜以覆盖第一绝缘膜并且保持作为非信号电荷的固定电荷。

公开(公告)号：US20130075849A1

公开(公告)日：2013-03-28

申请号：US13416290

申请日：2012-03-09

Applicant: Kazuhiro SUZUKI ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

Inventor： Kazuhiro SUZUKI ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14605 ,  H01L24/32 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: According to one embodiment, a solid state imaging device includes a sensor substrate curved such that an upper face having a plurality of pixels formed is recessed and an imaging lens provided on the upper face side.

Abstract translation: 根据一个实施例，固态成像装置包括弯曲的传感器基板，使得形成有多个像素的上表面凹陷，并且设置在上表面侧的成像透镜。

公开(公告)号：US20130075586A1

公开(公告)日：2013-03-28

申请号：US13361321

申请日：2012-01-30

Applicant: Risako UENO ,  Hideyuki Funaki ,  Kazuhiro Suzuki ,  Mitsuyoshi Kobayashi ,  Honam Kwon

Inventor： Risako UENO ,  Hideyuki Funaki ,  Kazuhiro Suzuki ,  Mitsuyoshi Kobayashi ,  Honam Kwon

IPC: H01L27/148 ,  H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14632 ,  H01L27/14634

Abstract: According to one embodiment, a solid imaging device includes an imaging substrate, a light-shielding member and a AD conversion circuits. The imaging substrate is two-dimensionally arranged with a plurality of pixels. The plurality of pixels have a top face formed with an optoelectronic conversion element for converting incident light into an electric charge and storing it and a back face opposite to the top faces. The imaging substrate is formed with a top face by the top face of the plurality of pixels and formed with a back face by the back face of the plurality of pixels. The light-shielding member is provided on the top face side of the imaging substrate. The AD conversion circuits is formed on the back face of the pixels shielded from the light.

Abstract translation: 根据一个实施例，固体成像装置包括成像基板，遮光部件和AD转换电路。 成像基板二维排列有多个像素。 多个像素具有形成有光电转换元件的顶面，用于将入射光转换成电荷并将其存储，并且与顶面相反的背面。 成像基板由多个像素的顶面形成有顶面，并且由多个像素的背面形成有背面。 遮光构件设置在成像基板的顶面侧。 AD转换电路形成在屏蔽光的像素的背面上。

公开(公告)号：US20130075585A1

公开(公告)日：2013-03-28

申请号：US13361293

申请日：2012-01-30

Applicant: Mitsuyoshi Kobayashi ,  Hideyuki Funaki ,  Risako Ueno ,  Kazuhiro Suzuki

Inventor： Mitsuyoshi Kobayashi ,  Hideyuki Funaki ,  Risako Ueno ,  Kazuhiro Suzuki

IPC: H01L27/146

CPC classification number: G01J1/0411 ,  G01J1/0242 ,  G01J1/0429 ,  G01J1/4228 ,  G01J4/04 ,  G01N21/21 ,  G02B5/3025 ,  G02B27/0075 ,  H01L27/14627 ,  H01L27/14629

Abstract: According to one embodiment, a solid imaging device includes an imaging substrate, an imaging lens, a microlens array substrate and a polarizing plate array substrate. The imaging substrate has a plurality of pixels formed on an upper side thereof. The imaging lens is provided above the imaging substrate. The optical axis in the imaging lens intersects with the upper side of the imaging substrate. The microlens array substrate is provided between the imaging substrate and the imaging lens. A surface in the microlens array substrate has a plurality of microlenses arranged two-dimensionally. The surface of the microlens array intersects with the optical axis. The polarizing plate array substrate is provided between the imaging substrate and the imaging lens. The plurality of kinds of polarizing plates in the polarizing plate array substrate having polarization axes in mutually different directions are arranged two dimensionally.

Abstract translation: 根据一个实施例，固体成像装置包括成像基板，成像透镜，微透镜阵列基板和偏振板阵列基板。 成像基板在其上侧形成有多个像素。 成像透镜设置在成像基板的上方。 成像透镜中的光轴与成像基板的上侧相交。 微透镜阵列基板设置在成像基板和成像透镜之间。 微透镜阵列基板中的表面具有二维布置的多个微透镜。 微透镜阵列的表面与光轴相交。 偏振板阵列基板设置在成像基板和成像透镜之间。 偏振板阵列基板中的偏振板在相互不同的方向上具有偏振轴的多种偏振片被二维排列。

公开(公告)号：US08304848B2

公开(公告)日：2012-11-06

申请号：US12883732

申请日：2010-09-16

Applicant: Kazuhiro Suzuki ,  Ikuo Fujiwara ,  Keita Sasaki ,  Honam Kwon ,  Hitoshi Yagi ,  Hiroto Honda ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno ,  Hideyuki Funaki

Inventor： Kazuhiro Suzuki ,  Ikuo Fujiwara ,  Keita Sasaki ,  Honam Kwon ,  Hitoshi Yagi ,  Hiroto Honda ,  Koichi Ishii ,  Masako Ogata ,  Risako Ueno ,  Hideyuki Funaki

IPC: H01L31/00 ,  H01L31/04

CPC classification number: G01J5/02 ,  G01J5/023 ,  G01J5/024 ,  H04N5/33

Abstract: Certain embodiments provide an infrared imaging device including: an SOI structure that is placed at a distance from a substrate, and includes: heat-sensitive diodes that detect infrared rays and convert the infrared rays into heat; and STI regions that separate the heat-sensitive diodes from one another; an interlayer insulating film that is stacked on the SOI structure; and supporting legs that are connected to the heat-sensitive diodes and vertical signal lines provided in outer peripheral regions of the heat-sensitive diodes. Each of the supporting legs includes: an interconnect unit that transmit signals to the vertical signal lines; and interlayer insulating layers that sandwich the interconnect unit, each bottom side of the interlayer insulating layers being located in a higher position than the SOI structure.

Abstract translation: 某些实施例提供了一种红外成像装置，包括：SOI结构，其被放置在离基板一定距离处，并且包括：热敏二极管，其检测红外线并将红外线转换成热; 以及将热敏二极管彼此分离的STI区域; 堆叠在SOI结构上的层间绝缘膜; 以及连接到热敏二极管的支撑腿和设置在热敏二极管的外周区域中的垂直信号线。 每个支撑腿包括：将信号传输到垂直信号线的互连单元; 以及层叠绝缘层，夹着所述互连单元，所述层间绝缘层的每个底侧位于比所述SOI结构更高的位置。