公开(公告)号：US20100060997A1

公开(公告)日：2010-03-11

申请号：US12458202

申请日：2009-07-02

申请人： Osamu Kuroda

发明人： Osamu Kuroda

IPC分类号： G02B3/02

CPC分类号： G02B3/04 ,  G02B23/2469

摘要： An endoscope illuminating optical system includes an illumination lens having a positive power. Illumination light rays parallel to each other emitted from an optical fiber bundle enter an incident surface of the illumination lens. The incident surface of the illumination lens is aspherical, and has a reference position vertical to the optical axis. The reference position is the most projecting portion on the incident surface. A shape of the incident surface is expressed by an equation of D=F(H). “H” is a height from the optical axis (0≦H≦Hmax), and “D” is a depth from a reference plane. The reference plane is vertical to the optical axis. The reference position is on the reference plane. A first-order differential value of the function F(H) is more than 0, and a second-order differential value of the function F(H) is 0 at a particular height Hi (0

摘要翻译： 内窥镜照明光学系统包括具有正光焦度的照明透镜。 从光纤束发射的彼此平行的照明光线进入照明透镜的入射表面。 照明透镜的入射面是非球面的，具有与光轴垂直的基准位置。 参考位置是入射表面上最突出的部分。 入射面的形状由D = F（H）的方程式表示。 “H”是距离光轴的高度（0＆nlE; H＆nlE; Hmax），“D”是距基准面的深度。 参考平面垂直于光轴。 参考位置在参考平面上。 函数F（H）的一阶微分值大于0，函数F（H）的二阶微分值在特定高度Hi（0

公开(公告)号：US07543593B2

公开(公告)日：2009-06-09

申请号：US11356364

申请日：2006-02-17

申请人： Takehiko Orii ,  Tatsuya Nishida ,  Osamu Kuroda

发明人： Takehiko Orii ,  Tatsuya Nishida ,  Osamu Kuroda

IPC分类号： C25F1/00 ,  C25F3/30 ,  C25F5/00

CPC分类号： H01L21/6708 ,  B08B3/02

摘要： A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.

摘要翻译： 提供了一种基板处理装置。 该装置包括用于供应不同加工流体的多个流体供应器61,61,63。 在处理晶片W时，基板处理装置沿着晶片W的周边部分相对移动流体供给部61,62,63。 流体供应部61,62,63沿着从晶片W的圆周向内延伸的方向配置。 通过这种布置，尽管晶片W以低速旋转，该装置能够稳定地处理晶片W. 此外，可以提高抗蚀剂处理中的装置的生产量。

公开(公告)号：US07404407B2

公开(公告)日：2008-07-29

申请号：US11616075

申请日：2006-12-26

申请人： Takehiko Orii ,  Osamu Kuroda

发明人： Takehiko Orii ,  Osamu Kuroda

IPC分类号： B08B3/02

CPC分类号： H01L21/67051 ,  C03C23/0075 ,  H01L21/67028 ,  H01L21/67178 ,  Y10S134/901 ,  Y10S134/902

摘要： The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.

摘要翻译： 衬底处理设备具有包围衬底支撑构件以限定处理空间的封闭结构。 外壳结构具有由快门关闭的开口。 供给处理流体（如化学液体）的处理流体供应单元容纳在壳体中。 容纳在壳体中的处理流体供应单元通过外壳结构的打开而进入处理空间，以将处理流体供给到由基板支撑构件支撑的基板上。

公开(公告)号：US07387131B2

公开(公告)日：2008-06-17

申请号：US10353015

申请日：2003-01-29

申请人： Osamu Kuroda ,  Hiroki Taniyama ,  Takayuki Toshima

发明人： Osamu Kuroda ,  Hiroki Taniyama ,  Takayuki Toshima

IPC分类号： B08B3/00 ,  B08B3/12 ,  B08B6/00 ,  B05C11/00 ,  B05C11/02 ,  B05C13/00 ,  B05C13/02 ,  B05C7/06 ,  B05C5/00

CPC分类号： H01L21/6719 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/68792

摘要： A substrate processing apparatus for processing a substrate With a processing fluid is provided. The apparatus includes holding members 60 for holding the substrate W, a chuck member 61 for supporting the holding members 60 and a top-face member 62 approaching the substrate W to cover its surface. In arrangement, since the top-face member 62 is supported by the chuck member 61, the holding members 60 can rotate together with the top-face member 62 in one body. With this structure, it is possible to reduce the influence of particles on the substrate W and also possible to provided a low-cost substrate processing apparatus occupied as little installation space as possible.

摘要翻译： 提供了一种用于处理基板的基板处理装置。 该装置包括用于保持基板W的保持构件60，用于支撑保持构件60的卡盘构件61和接近基板W以覆盖其表面的顶面构件62。 在这样的结构中，由于顶面构件62被卡盘构件61支撑，所以保持构件60能够与顶面构件62一体旋转。 利用这种结构，可以减小颗粒对基板W的影响，并且也可以提供尽可能少的安装空间的低成本的基板处理装置。

公开(公告)号：US20080003967A1

公开(公告)日：2008-01-03

申请号：US11528365

申请日：2006-09-28

申请人： Osamu Kuroda

发明人： Osamu Kuroda

IPC分类号： H04B1/06 ,  H04B7/00

CPC分类号： H03G3/3068

摘要： A receiver device 1 comprises a gain control portion 40 which regulates a received signal by controlling the opening and closing of a switch 52 which bypasses a first amplifier 12 and providing variable control over the gain of a second amplifier 16, and which also switches the gain of the second amplifier 16 to compensate for gain fluctuations due to the opening and closing of the switch 12. This gain control portion 40 also comprises a digital logic circuit which can program a time offset between the open/closing period of the switch 52 and the switching period of the gain of the second amplifier 16.

摘要翻译： 接收机设备1包括增益控制部分40，其通过控制旁路第一放大器12的开关52的打开和关闭来调节接收信号，并且提供对第二放大器16的增益的可变控制，并且还切换增益 以补偿由于开关12的打开和关闭引起的增益波动。 该增益控制部分40还包括数字逻辑电路，该数字逻辑电路可编程开关52的打开/关闭周期与第二放大器16的增益的切换周期之间的时间偏移。

公开(公告)号：US07108752B2

公开(公告)日：2006-09-19

申请号：US09873478

申请日：2001-06-04

申请人： Osamu Kuroda

发明人： Osamu Kuroda

IPC分类号： B05C11/10 ,  H01L21/31

CPC分类号： H01L21/67173 ,  H01L21/6704 ,  H01L21/67253 ,  H01L21/67276 ,  H01L21/68707

摘要： A liquid processing apparatus comprises a liquid processing section for applying a liquid processing to wafers W, a carrier delivery section for delivering the carrier housing the wafers W, a carrier stock section capable of storing a plurality of carriers, an interface section for transferring the wafers W between the carrier stock section and the liquid processing section, a carrier transfer device for transferring the carrier, a wafer inspecting device for inspecting the wafers W within the carrier, and a carrier transfer device control section for controlling the carrier transfer device. The carrier transfer device control section controls the carrier transfer device such that the carrier, which has been judged to be capable of a liquid processing on the basis of the result of the inspection of the wafers W, is stored in the carrier stock section, and the liquid processing is started after completion of the inspection of a predetermined number of carriers.

公开(公告)号：US07102149B2

公开(公告)日：2006-09-05

申请号：US09801773

申请日：2001-03-09

申请人： Osamu Kuroda ,  Hiroyuki Karasawa

发明人： Osamu Kuroda ,  Hiroyuki Karasawa

IPC分类号： G03B42/08

CPC分类号： G03B42/02

摘要： The inspection method comprises: preparing a storage fluorescent inspection sheet that has stored and recorded a radiation inspection image which has a density pattern in which one or more low-density and high-density regions having a contrast difference of at least 1:20 are arrayed in a horizontal scanning direction; obtaining an image inspection signal representing the radiation inspection image, by photoelectrically reading the radiation inspection image from the storable fluorescent inspection sheet; and inspecting the influence of stray light, based on an image reproduced from the image inspection signal. An inspection image plate has contrast differences of high-density and low-density regions of at least 1:20.

摘要翻译： 检查方法包括：准备存储和记录具有密度图案的放射线检查图像的存储荧光检查片，其中排列具有至少1:20的对比差的一个或多个低密度和高密度区域 在水平扫描方向; 通过从可存储的荧光检查片中光电读取放射线检查图像，获得表示放射线检查图像的图像检查信号; 并基于从图像检查信号再现的图像来检查杂散光的影响。 检查图像板具有至少1:20的高密度和低密度区域的对比差异。

公开(公告)号：US20060130968A1

公开(公告)日：2006-06-22

申请号：US11356364

申请日：2006-02-17

申请人： Takehiko Orii ,  Tatsuya Nishida ,  Osamu Kuroda

发明人： Takehiko Orii ,  Tatsuya Nishida ,  Osamu Kuroda

IPC分类号： H01L21/306

CPC分类号： H01L21/6708 ,  B08B3/02

摘要： A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.

公开(公告)号：US06857838B2

公开(公告)日：2005-02-22

申请号：US10395129

申请日：2003-03-25

申请人： Osamu Kuroda

发明人： Osamu Kuroda

IPC分类号： G02F1/13 ,  B08B3/02 ,  B65G49/07 ,  G02F1/1333 ,  H01L21/68 ,  H01L21/683 ,  B65G1/00

CPC分类号： H01L21/681 ,  Y10S414/135

摘要： A substrate processing system includes a notch aligner. The notch aligner includes a rotating support device, a servomotor for rotating the rotating support device, a sensor for detecting a notch formed in a wafer, a wafer lifting device, a cylinder actuator for vertically moving the wafer lifting device, and a CPU. The rotating support device holds a wafer in a horizontal position. The sensor detects the notch to determine the orientation of the wafer. The wafer lifting device receives the wafer from the rotating support device and lifts up the wafer from the rotating support device. A notch detection signal provided by the sensor is given to the CPU. The CPU gives control signals to the servomotor and the pneumatic cylinder actuator to operate the servomotor and the cylinder actuator so that the wafer is aligned.

摘要翻译： 基板处理系统包括凹口对准器。 切口对准器包括旋转支撑装置，用于旋转旋转支撑装置的伺服电动机，用于检测晶片中形成的切口的传感器，晶片提升装置，用于垂直移动晶片提升装置的气缸致动器和CPU。 旋转支撑装置将晶片保持在水平位置。 传感器检测凹口以确定晶片的取向。 晶片提升装置从旋转支撑装置接收晶片并且从旋转支撑装置提升晶片。 由CPU提供由传感器提供的切口检测信号。 CPU向伺服电动机和气缸致动器提供控制信号以操作伺服电动机和气缸致动器，使得晶片对准。

公开(公告)号：US08978670B2

公开(公告)日：2015-03-17

申请号：US12897384

申请日：2010-10-04

申请人： Junya Minamida ,  Issei Ueda ,  Yasuhiro Chouno ,  Osamu Kuroda ,  Kazuyoshi Eshima ,  Masahiro Yoshida ,  Satoshi Morita

发明人： Junya Minamida ,  Issei Ueda ,  Yasuhiro Chouno ,  Osamu Kuroda ,  Kazuyoshi Eshima ,  Masahiro Yoshida ,  Satoshi Morita

IPC分类号： B08B3/00 ,  H01L21/67

CPC分类号： H01L21/67051 ,  H01L21/6708 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67196 ,  Y10S414/135

摘要： Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

摘要翻译： 提供了一种基板处理装置，其中即使发生故障，也必须在不停止基板处理装置的情况下继续进行基板的处理。 根据本公开的基板处理装置包括被配置为输送晶片的第一和第二基板输送装置，以及设置在基板输送装置的左侧和左侧的第一和第二处理块，并且具有各自被配置为执行相同的处理单元阵列 处理。 一侧的处理单元阵列和另一侧的处理单元阵列分别连接到通常设置有它们的处理液体供应系统。 并且，当基板输送装置中的任一个处理液供给系统存在问题时，可以在基板输送装置和处理液供给系统正常运转所属的处理单元阵列中进行晶片的处理。