公开(公告)号：US20050022372A1

公开(公告)日：2005-02-03

申请号：US10929512

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20 ,  B23P19/00

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US06823581B2

公开(公告)日：2004-11-30

申请号：US09989633

申请日：2001-11-20

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： B23P1902

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US5821494A

公开(公告)日：1998-10-13

申请号：US722536

申请日：1996-09-27

申请人： David W. Albrecht ,  Akihiko Aoyagi ,  Surya Pattanaik ,  Yoshio Uematsu

发明人： David W. Albrecht ,  Akihiko Aoyagi ,  Surya Pattanaik ,  Yoshio Uematsu

IPC分类号： G11B5/48 ,  H05K3/34 ,  B23K26/00

CPC分类号： G11B5/4853 ,  H05K3/3442 ,  H05K2203/0415 ,  H05K2203/107 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T29/4903

摘要： A method of making a solder connection between a slider pad and a suspension pad is provided by forming a solder bump on the solder pad at the slider level, affixing the slider to the suspension so that solder can be reflowed between the slider pad and the suspension pad and then employing a laser beam to reflow at least the solder bump to form a solder connection between the slider pad and the suspension pad. Various embodiments of the method are employed for forming the solder connection. Geometric features are also optionally incorporated in the suspension pad region of the integrated suspension that can be employed to bias the suspension pads against the solder bumps in the pre-reflow state.

摘要翻译： 通过在滑块级上在焊盘上形成焊料凸块来提供滑块和悬挂垫之间的焊接连接的方法，将滑块固定在悬架上，使得焊料可以在滑块和悬架之间回流 然后使用激光束至少回流焊料凸点以在滑块和悬挂垫之间形成焊接连接​​。 采用该方法的各种实施例来形成焊接连接​​。 几何特征也可选地结合在集成悬架的悬挂垫区域中，可用于将悬挂垫抵靠预回流状态的焊料凸块偏置。