公开(公告)号：US5985763A

公开(公告)日：1999-11-16

申请号：US970961

申请日：1997-11-14

申请人： Qi-Zhong Hong ,  Wei-Yung Hsu ,  Shin-puu Jeng

发明人： Qi-Zhong Hong ,  Wei-Yung Hsu ,  Shin-puu Jeng

IPC分类号： H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L21/441

CPC分类号： H01L21/76843 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53219 ,  H01L23/53223 ,  H01L2924/0002 ,  Y10S257/915

摘要： Methods are provided for the construction of metal-to-metal connections between non-adjacent layers in a structure, such as a semiconductor device. A first metal conductor layer is provided along a substrate. An anti-reflection cap is provided in overlying relation with said first conductor layer. At least a portion of the dielectric layer and the anti-reflection cap is removed to define a passage which extends from an upper surface of the dielectric layer to the first metal conductor. The passage is substantially filled with a fill metal, and a second metal conductor layer is applied over at least a portion of the dielectric layer and the substantially filled passage to electrically connect the first and second metal conductors. A diffusion liner can optionally be applied to the passage prior to application of the fill metal. The passage fill metal and second conductor layer can be integrally formed, and the fill metal and at least one of the conductor layers are formed from the same matrix metal.

摘要翻译： 提供了用于在诸如半导体器件的结构中的非相邻层之间的金属 - 金属连接的构造的方法。 沿着基板设置第一金属导体层。 防反射盖以与所述第一导体层重叠的关系提供。 去除介电层和防反射盖的至少一部分以限定从电介质层的上表面延伸到第一金属导体的通道。 通道基本上填充有填充金属，并且第二金属导体层被施加在电介质层和基本上填充的通道的至少一部分上以电连接第一和第二金属导体。 在施加填充金属之前，扩散衬垫可以可选地施加到通道。 通道填充金属和第二导体层可以一体地形成，并且填充金属和至少一个导体层由相同的基体金属形成。

公开(公告)号：US08043870B2

公开(公告)日：2011-10-25

申请号：US12437897

申请日：2009-05-08

申请人： Antoine P. Manens ,  Wei-Yung Hsu ,  Hichem M'Saad

发明人： Antoine P. Manens ,  Wei-Yung Hsu ,  Hichem M'Saad

IPC分类号： H01L21/00

CPC分类号： B24B53/017 ,  B24B37/042 ,  B24B53/12

摘要： In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.

摘要翻译： 在一个实施例中，提供了一种用于维持基板处理表面的方法。 该方法通常包括在衬底处理表面上执行一组测量，其中使用耦合到处理表面调节臂的位移传感器获取测量集合，基于该组测量确定处理表面轮廓，将处理表面 简档到最小配置文件阈值，并传达配置文件比较的结果。

公开(公告)号：US20090280580A1

公开(公告)日：2009-11-12

申请号：US12437897

申请日：2009-05-08

申请人： Antoine P. Manens ,  Wei-Yung Hsu ,  Hichem M'Saad

发明人： Antoine P. Manens ,  Wei-Yung Hsu ,  Hichem M'Saad

IPC分类号： H01L21/66 ,  B24B49/02 ,  B24B49/10

CPC分类号： B24B53/017 ,  B24B37/042 ,  B24B53/12

摘要： In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.

摘要翻译： 在一个实施例中，提供了一种用于维持基板处理表面的方法。 该方法通常包括在衬底处理表面上执行一组测量，其中使用耦合到处理表面调节臂的位移传感器获取测量集合，基于该组测量确定处理表面轮廓，将处理表面 简档到最小配置文件阈值，并传达配置文件比较的结果。

公开(公告)号：US20090255911A1

公开(公告)日：2009-10-15

申请号：US12422189

申请日：2009-04-10

申请人： Sriram Krishnaswami ,  Shinichi Kurita ,  Bassam Shamoun ,  Benjamin M. Johnston ,  John M. White ,  Jiafa Fan ,  Inchen Huang ,  Antoine P. Manens ,  Wei-Sheng Lei ,  Wei-Yung Hsu

发明人： Sriram Krishnaswami ,  Shinichi Kurita ,  Bassam Shamoun ,  Benjamin M. Johnston ,  John M. White ,  Jiafa Fan ,  Inchen Huang ,  Antoine P. Manens ,  Wei-Sheng Lei ,  Wei-Yung Hsu

IPC分类号： B23K26/38 ,  B23K26/02 ,  B23K26/067 ,  B23K26/08

CPC分类号： B23K26/067 ,  B23K26/0676 ,  B23K26/082 ,  B23K26/083 ,  B23K26/16 ,  B23K26/361 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/34 ,  B23K2101/36 ,  B23K2103/16 ,  B23K2103/172

摘要： Laser scribing can be performed on a workpiece (104) such as substrates with layers formed thereon for use in a solar panel without need to rotate the workpiece (104) during the scribing process. A series of lasers (602, 622) can be used to concurrently remove material from multiple positions on the workpiece (104). Each laser (602, 622) can have at least one scanning device (614, 630, 632) positioned along a beam path thereof in order to adjust a position of the laser output relative to the workpiece (104). By adjusting the beam or pulse positions using the scanning devices (614, 630, 632) while translating the workpiece (104), substantially any pattern can be scribed into at least one layer of the workpiece (104) without the need for any rotation of the workpiece (104).

摘要翻译： 可以对工件（104）进行激光划线，例如在其上形成有层的基板，用于太阳能电池板，而不需要在划线过程中旋转工件（104）。 可以使用一系列激光器（602,622）来同时从工件（104）上的多个位置去除材料。 每个激光器（602,622）可以具有沿其光束路径定位的至少一个扫描装置（614,630,632），以便调节激光输出相对于工件（104）的位置。 通过在平移工件（104）的同时通过使用扫描装置（614,630,632）调节光束或脉冲位置，基本上任何图案都可以划分成工件（104）的至少一层，而不需要任何旋转 工件（104）。

公开(公告)号：US20090017731A1

公开(公告)日：2009-01-15

申请号：US12239730

申请日：2008-09-26

申请人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

发明人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

IPC分类号： B24B1/00

CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/002 ,  H01L21/02021

摘要： Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

摘要翻译： 提供了用于清洁基板边缘的方法和设备。 本发明包括具有抛光侧和第二面的抛光膜; 邻近抛光膜的第二侧设置的可充气垫; 适于支撑抛光膜和可充气垫的框架; 以及衬底旋转驱动器，其适于将衬底旋转抵靠所述抛光膜的抛光侧，其中所述抛光膜设置在所述衬底的边缘和所述可充气垫之间，使得所述可充气衬垫和抛光膜轮廓到所述衬底的边缘 抛光膜与基板的边缘接触。 提供了许多其他方面。

公开(公告)号：US07390429B2

公开(公告)日：2008-06-24

申请号：US11312823

申请日：2005-12-19

申请人： Feng Q. Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu

发明人： Feng Q. Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu

IPC分类号： C09K13/00 ,  C09K13/04 ,  C09K13/06

CPC分类号： H01L21/32125 ,  B23H5/08 ,  C25F3/02 ,  H01L21/7684

摘要： A method of processing a substrate having a conductive material layer disposed thereon is provided which includes positioning the substrate in a process apparatus and supplying a first polishing composition between to the substrate. The polishing composition comprises a first chelating agent, a second chelating agent, a first corrosion inhibitor, a second corrosion inhibitor, a suppressor, a solvent, and an inorganic acid based electrolyte to provide a pH between about 3 and about 10.

摘要翻译： 提供一种处理其上设置有导电材料层的基板的方法，其包括将基板定位在处理装置中并将第一抛光组合物提供到基板之间。 抛光组合物包括第一螯合剂，第二螯合剂，第一腐蚀抑制剂，第二腐蚀抑制剂，抑制剂，溶剂和无机酸基电解质，以提供约3至约10的pH。

公开(公告)号：US07323416B2

公开(公告)日：2008-01-29

申请号：US11196876

申请日：2005-08-04

申请人： Feng Q. Liu ,  Tianbao Du ,  Alain Duboust ,  Yan Wang ,  Yongqi Hu ,  Stan D. Tsai ,  Liang-Yuh Chen ,  Wen-Chiang Tu ,  Wei-Yung Hsu

发明人： Feng Q. Liu ,  Tianbao Du ,  Alain Duboust ,  Yan Wang ,  Yongqi Hu ,  Stan D. Tsai ,  Liang-Yuh Chen ,  Wen-Chiang Tu ,  Wei-Yung Hsu

IPC分类号： H01L21/302

CPC分类号： B23H5/08 ,  B24B37/042 ,  C25F3/02 ,  H01L21/32125 ,  H01L21/6875 ,  H01L21/7684

摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.

摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率除去，以及 然后用至少一种化学机械抛光技术研磨衬底。

公开(公告)号：US20070227902A1

公开(公告)日：2007-10-04

申请号：US11392193

申请日：2006-03-29

申请人： Tianbao Du ,  Feng Liu ,  May Yu ,  Alain Duboust ,  Wei-Yung Hsu

发明人： Tianbao Du ,  Feng Liu ,  May Yu ,  Alain Duboust ,  Wei-Yung Hsu

IPC分类号： B23H5/08

CPC分类号： B23H5/08 ,  B24B49/00 ,  B24B53/017

摘要： A method for controlling the removal rate of material from a substrate during a polishing process is described. In one embodiment, the pre-polish profile of the substrate is determined and polishing pad conditioning parameters are adjusted based on that profile. Parameters such as conditioning head sweep range and frequency, and conditioning element downforce and RPM may be adjusted to selectively condition portions of the pad to maintain optimum polishing qualities of the pad.

摘要翻译： 描述了一种用于在抛光过程中控制来自基底的材料的去除速率的方法。 在一个实施例中，确定基板的预抛光轮廓并且基于该轮廓来调整抛光垫调节参数。 可以调节诸如调节头扫描范围和频率以及调节元件下压力和RPM的参数以选择性地调节焊盘的部分以保持焊盘的最佳抛光质量。

公开(公告)号：US20060243304A1

公开(公告)日：2006-11-02

申请号：US11411012

申请日：2006-04-24

申请人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

发明人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

IPC分类号： B08B7/00 ,  B08B5/04

CPC分类号： H01L21/67046 ,  B08B1/04 ,  H01L21/67028

摘要： In one aspect, a method for cleaning an edge of a substrate is provided. The method includes the steps of (a) supporting a substrate on a rotatable substrate support; (b) contacting an edge of the substrate with one or more rollers; (c) rotating the substrate support so as to rotate the substrate; and (d) rotating the one or more rollers so as to clean the edge of the substrate Numerous other aspects are provided.

摘要翻译： 一方面，提供一种清洗基板的边缘的方法。 该方法包括以下步骤：（a）将基板支撑在可旋转的基板支撑件上; （b）使所述基板的边缘与一个或多个辊接触; （c）旋转衬底支撑件以旋转衬底; 和（d）旋转所述一个或多个辊以便清洁所述基底的边缘。提供许多其它方面。

公开(公告)号：US20060169597A1

公开(公告)日：2006-08-03

申请号：US11356352

申请日：2006-02-15

申请人： Feng Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu ,  Robert Ewald ,  Yuan Tian ,  You Wang ,  Stan Tsai

发明人： Feng Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu ,  Robert Ewald ,  Yuan Tian ,  You Wang ,  Stan Tsai

IPC分类号： B23H9/00 ,  B23H7/00

CPC分类号： C25F3/02 ,  B23H5/08

摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, a corrosion inhibitor having an azole group, an organic acid salt, a pH adjusting agent to provide a pH between about 2 and about 10, and a solvent, and a solvent. The composition may be used in a conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.

摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，组合物包括酸基电解质体系，具有唑基的腐蚀抑制剂，有机酸盐，pH调节剂以提供约2至约10的pH以及溶剂和溶剂。 该组合物可以用于导电材料去除工艺中，包括在包括电极的工艺设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及 从导电材料层去除导电材料。 本文所述的抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。