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198 条记录 (耗时 0.036 秒)

    Methods and apparatus for processing a substrate
    1.
    发明申请
    Methods and apparatus for processing a substrate 有权
    用于处理衬底的方法和设备

    公开(公告)号：US20070131654A1

    公开(公告)日：2007-06-14

    申请号：US11299295

    申请日：2005-12-09

    申请人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    发明人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    IPC分类号： C03C15/00 ,  H01L21/306

    CPC分类号： C03C19/00 ,  B24B1/04 ,  B24B9/065 ,  B24B21/004 ,  H01L21/02021

    摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

    摘要翻译： 适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转 衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和 第一斜面作为基底旋转。 提供了许多其他方面。

    Methods and apparatus for cleaning an edge of a substrate
    2.
    发明申请
    Methods and apparatus for cleaning an edge of a substrate 审中-公开
    用于清洁衬底边缘的方法和设备

    公开(公告)号：US20060243304A1

    公开(公告)日：2006-11-02

    申请号：US11411012

    申请日：2006-04-24

    申请人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

    发明人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

    IPC分类号： B08B7/00 ,  B08B5/04

    CPC分类号： H01L21/67046 ,  B08B1/04 ,  H01L21/67028

    摘要： In one aspect, a method for cleaning an edge of a substrate is provided. The method includes the steps of (a) supporting a substrate on a rotatable substrate support; (b) contacting an edge of the substrate with one or more rollers; (c) rotating the substrate support so as to rotate the substrate; and (d) rotating the one or more rollers so as to clean the edge of the substrate Numerous other aspects are provided.

    摘要翻译： 一方面，提供一种清洗基板的边缘的方法。 该方法包括以下步骤：（a）将基板支撑在可旋转的基板支撑件上; （b）使所述基板的边缘与一个或多个辊接触; （c）旋转衬底支撑件以旋转衬底; 和（d）旋转所述一个或多个辊以便清洁所述基底的边缘。提供许多其它方面。

    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
    5.
    发明申请
    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
    用于处理基板的方法和装置

    公开(公告)号：US20090017731A1

    公开(公告)日：2009-01-15

    申请号：US12239730

    申请日：2008-09-26

    申请人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    发明人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    IPC分类号： B24B1/00

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/002 ,  H01L21/02021

    摘要： Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

    摘要翻译： 提供了用于清洁基板边缘的方法和设备。 本发明包括具有抛光侧和第二面的抛光膜; 邻近抛光膜的第二侧设置的可充气垫; 适于支撑抛光膜和可充气垫的框架; 以及衬底旋转驱动器，其适于将衬底旋转抵靠所述抛光膜的抛光侧，其中所述抛光膜设置在所述衬底的边缘和所述可充气垫之间，使得所述可充气衬垫和抛光膜轮廓到所述衬底的边缘 抛光膜与基板的边缘接触。 提供了许多其他方面。

    GAS DISTRIBUTION SHOWERHEAD WITH HIGH EMISSIVITY SURFACE
    7.
    发明申请
    GAS DISTRIBUTION SHOWERHEAD WITH HIGH EMISSIVITY SURFACE 审中-公开
    具有高功率表面的气体分配淋浴

    公开(公告)号：US20120052216A1

    公开(公告)日：2012-03-01

    申请号：US13154060

    申请日：2011-06-06

    申请人： Hiroji Hanawa ,  Kyawwin Jason Maung ,  Hua Chung ,  Jie Cui ,  David Bour ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    发明人： Hiroji Hanawa ,  Kyawwin Jason Maung ,  Hua Chung ,  Jie Cui ,  David Bour ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    IPC分类号： C23C16/48

    CPC分类号： C23C16/45565 ,  C23C16/45574 ,  C23C16/481 ,  C23C16/52

    摘要： Embodiments of the present invention provide methods and apparatus for surface coatings applied to process chamber components utilized in chemical vapor deposition processes. In one embodiment, the apparatus provides a showerhead apparatus comprising a body, a plurality of conduits extending through the body, each of the plurality of conduits having an opening extending to a processing surface of the body, and a coating disposed on the processing surface, the coating being about 50 microns to about 200 microns thick and comprising a coefficient of emissivity of about 0.8, an average surface roughness of about 180 micro-inches to about 220 micro-inches, and a porosity of about 15% or less.

    摘要翻译： 本发明的实施例提供了应用于化学气相沉积工艺中使用的处理腔室部件的表面涂层的方法和装置。 在一个实施例中，该装置提供一种喷头装置，其包括主体，延伸穿过主体的多个导管，多个导管中的每一个具有延伸到主体的处理表面的开口，以及设置在处理表面上的涂层， 该涂层为约50微米至约200微米厚，并且包括约0.8的发射率系数，约180微英寸至约220微英寸的平均表面粗糙度，以及约15％或更小的孔隙率。

    EXTENDED PAD LIFE FOR ECMP AND BARRIER REMOVAL
    8.
    发明申请
    EXTENDED PAD LIFE FOR ECMP AND BARRIER REMOVAL 失效
    用于ECMP和BARRIER移除的扩展垫生活

    公开(公告)号：US20080242202A1

    公开(公告)日：2008-10-02

    申请号：US11695484

    申请日：2007-04-02

    申请人： Yuchun Wang ,  Robert A. Ewald ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    发明人： Yuchun Wang ,  Robert A. Ewald ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    IPC分类号： B24B7/22

    CPC分类号： B23H5/08

    摘要： A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by removing conductive and dielectric material from a substrate while minimizing downtime of the polishing tool. In some embodiments, the polishing article may be a dielectric material or a conductive material and is configured to include a longer usable lifetime to minimize replacement and downtime of the tool.

    摘要翻译： 描述了一种用于在具有多个压板的抛光工具上延伸抛光制品寿命的方法和装置。 该设备包括具有可在其上使用的抛光制品的多个实施例的可推进的辊对辊压盘。 抛光制品适于通过从衬底移除导电和电介质材料，同时最小化抛光工具的停机时间来执行抛光工艺。 在一些实施例中，抛光制品可以是介电材料或导电材料，并且被配置为包括更长的可用寿命以最小化工具的更换和停机时间。

    Integrated multi-step gap fill and all feature planarization for conductive materials
    9.
    发明授权
    Integrated multi-step gap fill and all feature planarization for conductive materials 失效
    集成的多步间隙填充和导电材料的所有特征平面化

    公开(公告)号：US07323095B2

    公开(公告)日：2008-01-29

    申请号：US10792069

    申请日：2004-03-03

    申请人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel A. Carl ,  Sasson Somekh

    发明人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel A. Carl ,  Sasson Somekh

    IPC分类号： C25D21/00 ,  C25D7/12

    CPC分类号： C25D7/123 ,  C25D5/06 ,  C25D5/22 ,  C25D17/001 ,  C25D17/008 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76877

    摘要： A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is positionable above the partial enclosure and is adapted to move a substrate into and out of contact or close proximity with the permeable disc. The partial enclosure and the substrate carrier are rotatable to provide relative motion between a substrate and the permeable disc. In another aspect, a method is provided in which a substrate is positioned in a partial enclosure having an electrolyte therein at a first distance from a permeable disc. A current is optionally applied to the surface of the substrate and a first thickness is deposited on the substrate. Next, the substrate is positioned closer to the permeable disc. During the deposition, the partial enclosure and the substrate are rotated relative one another.

    摘要翻译： 提供了一种用于沉积和平坦化衬底上的材料层的方法和装置。 在一个实施例中，提供了一种装置，其包括部分外壳，可渗透盘，漫射板和任选的阳极。 衬底载体可定位在部分外壳上方，并且适于将衬底移动到与可渗透盘接触或接近的位置。 部分外壳和基板载体可旋转以提供基板和可渗透盘之间的相对运动。 在另一方面，提供了一种方法，其中将基底定位在其中具有电解质的部分封闭体中，其中离开可渗透盘的第一距离处。 任选地将电流施加到衬底的表面，并且在衬底上沉积第一厚度。 接下来，将基板定位成更靠近可渗透盘。 在沉积期间，部分封闭物和基底相对彼此旋转。

    Method for dishing reduction and feature passivation in polishing processes
    10.
    发明申请
    Method for dishing reduction and feature passivation in polishing processes 审中-公开
    抛光过程中凹陷减少和特征钝化的方法

    公开(公告)号：US20050202677A1

    公开(公告)日：2005-09-15

    申请号：US11114936

    申请日：2005-04-25

    申请人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel Carl

    发明人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel Carl

    IPC分类号： H01L21/288 ,  H01L21/321 ,  C25C3/00

    CPC分类号： H01L21/7684 ,  H01L21/3212

    摘要： Methods and apparatus for planarizing a substrate surface are provided. In one aspect, a method is provided for planarizing a substrate surface including polishing a first conductive material to a barrier layer material, depositing a second conductive material on the first conductive material by an electrochemical deposition technique, and polishing the second conductive material and the barrier layer material to a dielectric layer. In another aspect, a processing system is provided for forming a planarized layer on a substrate, the processing system including a computer based controller configured to cause the system to polish a first conductive material to a barrier layer material, deposit a second conductive material on the first conductive material by an electrochemical deposition technique, and polish the second conductive material and the barrier layer material to a dielectric layer.

    摘要翻译： 提供了用于平坦化基板表面的方法和装置。 在一个方面，提供了一种用于平坦化衬底表面的方法，包括将第一导电材料抛光到阻挡层材料，通过电化学沉积技术在第一导电材料上沉积第二导电材料，以及抛光第二导电材料和屏障 层材料到介电层。 在另一方面，提供一种用于在衬底上形成平坦化层的处理系统，所述处理系统包括基于计算机的控制器，所述计算机控制器被配置为使所述系统将第一导电材料抛光至阻挡层材料，将第二导电材料沉积在所述第二导电材料上 通过电化学沉积技术的第一导电材料，并将第二导电材料和阻挡层材料抛光到介电层。