公开(公告)号：US20190039884A1

公开(公告)日：2019-02-07

申请号：US16050795

申请日：2018-07-31

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Marc Fueldner ,  Andreas Wiesbauer

IPC: B81B7/02 ,  B81B3/00 ,  H04R19/04 ,  H04R19/00

Abstract: In accordance with an embodiment, a MEMS sensor includes a MEMS arrangement having a movable electrode and a stator electrode arranged opposite the movable electrode. The MEMS sensor includes a first bias voltage source, which is connected to the stator electrode and which is configured to apply a first bias voltage to the stator electrode. The MEMS sensor further includes a common-mode read-out circuit connected to the stator electrode by a capacitive coupling and comprising a second bias voltage source, which is configured to apply a second bias voltage to a side of the capacitive coupling that faces away from the stator electrode.

公开(公告)号：US10034100B2

公开(公告)日：2018-07-24

申请号：US15290877

申请日：2016-10-11

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

IPC: H04R25/00 ,  H04R19/04 ,  H04R19/00 ,  H04R31/00 ,  H04R7/00

Abstract: A sound transducer structure includes a membrane and a counter electrode. The membrane includes a first main surface in a sound transducing region made of a membrane material, and an edge region. The counter electrode includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. A plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume. The membrane and the counter electrode are arranged to provide a capacity therebetween. The membrane comprises a corrugation groove extending in the sound transducing region from the first main surface of the membrane into the free volume.

公开(公告)号：US09967677B2

公开(公告)日：2018-05-08

申请号：US14959560

申请日：2015-12-04

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Marc Fueldner ,  Elmar Bach

IPC: H04R3/00 ,  H04R19/04 ,  H04R1/04 ,  H04R3/04 ,  H04R29/00

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R3/04 ,  H04R29/004 ,  H04R2201/003 ,  H04R2430/01

Abstract: A system and method for a sensor-supported microphone includes an amplifier having an input configured to be coupled to a transducer, and an output coupled to an analog interface to output a transduced electrical signal from the transducer, a data bus configured to be coupled to an environmental sensor, a calibration parameter storage circuit coupled to the data bus, the calibration parameter storage circuit comprising calibration data relating sensitivity of the transducer with environmental measurements provided by the environmental sensor, and a digital interface coupled to the data bus and configured to output the calibration data and the environmental measurements.

公开(公告)号：US12133060B2

公开(公告)日：2024-10-29

申请号：US18532607

申请日：2023-12-07

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Andreas Wiesbauer ,  Athanasios Kollias

IPC: H04R7/08 ,  B81B3/00 ,  H04R7/16 ,  H04R19/04

CPC classification number: H04R7/08 ,  B81B3/0021 ,  H04R7/16 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0353 ,  B81B2203/04 ,  H04R2201/003

Abstract: A system includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, and the second membrane comprises a plurality of openings, a sealed low pressure chamber between the first membrane and the third membrane, and a plurality of electrodes in the sealed low pressure chamber.

公开(公告)号：US12063469B2

公开(公告)日：2024-08-13

申请号：US17647653

申请日：2022-01-11

Applicant: Infineon Technologies AG

Inventor： Abidin Güçlü Onaran ,  Marc Fueldner ,  Dietmar Straeussnigg

IPC: H04R7/06 ,  B81B3/00 ,  H04R1/28 ,  H04R7/16 ,  H04R19/04

CPC classification number: H04R1/2807 ,  B81B3/0078 ,  H04R7/06 ,  H04R7/16 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  H04R2201/003

Abstract: A MicroElectroMechanical (MEMS) device includes a suspended electrode structure anchored to a substrate, the MEMS device having a MEMS resonance mode, and a Tuned Mass Damping (TMD) structure, wherein a portion of the suspended electrode structure forms a TMD structure having a TMD spring element and a TMD mass element, for providing a TMD resonance mode counteracting the MEMS resonance mode.

公开(公告)号：US20240174514A1

公开(公告)日：2024-05-30

申请号：US18435500

申请日：2024-02-07

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Andreas Wiesbauer ,  Athanasios Kollias

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81C1/0023 ,  B81B7/02 ,  B81C1/00158 ,  B81C1/00182 ,  B81C1/00293 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/03 ,  B81C2201/0174 ,  B81C2203/0792

Abstract: A triple-membrane MEMS device includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, a sealed low pressure chamber between the first membrane and the third membrane, a first stator and a second stator in the sealed low pressure chamber, and a signal processing circuit configured to read-out output signals of the triple-membrane MEMS device.

公开(公告)号：US11889283B2

公开(公告)日：2024-01-30

申请号：US17128587

申请日：2020-12-21

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Andreas Wiesbauer ,  Athanasios Kollias

IPC: H04R7/08 ,  B81B3/00 ,  H04R7/16 ,  H04R19/04

CPC classification number: H04R7/08 ,  B81B3/0021 ,  H04R7/16 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0353 ,  B81B2203/04 ,  H04R2201/003

Abstract: A system includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, and the second membrane comprises a plurality of openings, a sealed low pressure chamber between the first membrane and the third membrane, and a plurality of electrodes in the sealed low pressure chamber.

公开(公告)号：US11053117B2

公开(公告)日：2021-07-06

申请号：US16821145

申请日：2020-03-17

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Stefan Barzen ,  Alfons Dehe ,  Gunar Lorenz

IPC: B81C1/00 ,  B81B3/00 ,  H04R19/00 ,  H04R31/00 ,  H04R19/04

Abstract: In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the counterelectrode structure.

公开(公告)号：US20210053821A1

公开(公告)日：2021-02-25

申请号：US16543970

申请日：2019-08-19

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R31/00 ,  H04R7/08

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US20200290864A1

公开(公告)日：2020-09-17

申请号：US16783587

申请日：2020-02-06

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Arnaud Walther

IPC: B81B3/00 ,  H04R19/04 ,  H04R19/00 ,  H04R1/04 ,  H04R31/00

Abstract: A MEMS device includes a first electrode structure and a second electrode structure forming a capacitive sensing arrangement. The MEMS device includes a plurality of anti-stiction bumps arranged between the first electrode structure and the second electrode structure at a corresponding plurality of locations. The plurality of locations being projected into a main surface of the second electrode structure is distributed so as to comprise a first distribution density in a first main surface region of the main surface and so as to comprise second, different distribution density in a second main surface region of the main surface, the second main surface region being delimited from the first main surface region.