公开(公告)号：US20140029199A1

公开(公告)日：2014-01-30

申请号：US13561117

申请日：2012-07-30

申请人： Ercan Mehmet Dede

发明人： Ercan Mehmet Dede

IPC分类号： F28F9/02 ,  H05K7/20

CPC分类号： F28F9/02 ,  F28D2021/0028 ,  F28F3/048 ,  F28F3/12 ,  F28F2210/02 ,  F28F2250/04 ,  F28F2260/02

摘要： Electronics modules and cooling apparatuses having branching microchannels for liquid cooling by jet impingement and fluid flow are disclosed. In one embodiment, a cooling apparatus includes a heat receiving surface and an array of branching microchannel cells. Each branching microchannel cell includes an inlet manifold fluidly coupled to the heat receiving surface and a branching microchannel manifold fluidly coupled to the inlet manifold. The branching microchannel manifold includes a plurality of fins that orthogonally extend from the heat receiving surface such that the plurality of fins define a plurality of branching microchannels that is normal with respect to the heat receiving surface. The cooling apparatus further includes an outlet manifold fluidly coupled to the plurality of branching microchannels. The coolant fluid flows through the plurality of branching microchannels in a direction normal to the heat receiving surface.

摘要翻译： 公开了具有用于通过喷射冲击和流体流动进行液体冷却的分支微通道的电子模块和冷却装置。 在一个实施例中，冷却装置包括热接收表面和分支微通道单元阵列。 每个分支微通道单元包括流体耦合到热接收表面的入口歧管和流体耦合到入口歧管的分支微通道歧管。 分支微通道歧管包括从热接收表面正交延伸的多个翅片，使得多个翅片限定相对于热接收表面是正常的多个分支微通道。 冷却装置还包括流体耦合到多个分支微通道的出口歧管。 冷却剂流体沿垂直于热接收表面的方向流过多个分支微通道。

公开(公告)号：US08482919B2

公开(公告)日：2013-07-09

申请号：US13083808

申请日：2011-04-11

申请人： Ercan Mehmet Dede

发明人： Ercan Mehmet Dede

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20927 ,  H01L23/473 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power electronics card assembly includes a printed circuit board assembly including a printed circuit board substrate, a power electronics device opening, a fluid inlet channel extending from a perimeter of the printed circuit board assembly to the power electronics device opening, a fluid outlet channel within the printed circuit board substrate extending from the perimeter of the printed circuit board assembly to the power electronics device opening, and electrically conductive power connections. A power electronics device is positioned within the power electronics device opening and includes a fluid inlet layer fluidly coupled to the fluid inlet channel, a fluid outlet layer fluidly coupled to the fluid outlet channel, a target heat transfer layer fluidly coupled to the fluid inlet layer, a second pass-heat transfer layer and a power device layer. The second-pass heat transfer layer is fluidly coupled to the target heat transfer layer and the fluid outlet layer.

摘要翻译： 电力电子卡组件包括印刷电路板组件，其包括印刷电路板基板，电力电子设备开口，从印刷电路板组件的周边延伸到电力电子设备开口的流体入口通道，流体出口通道内 印刷电路板基板从印刷电路板组件的周边延伸到电力电子设备开口，以及导电的电力连接。 电力电子设备定位在电力电子设备开口内，并且包括流体连接到流体入口通道的流体入口层，流体地联接到流体出口通道的流体出口层，流体耦合到流体入口层的目标传热层 第二传热层和功率器件层。 二次传热层流体耦合到目标传热层和流体出口层。

公开(公告)号：US20120243192A1

公开(公告)日：2012-09-27

申请号：US13070990

申请日：2011-03-24

申请人： Brian Joseph Robert ,  Ercan Mehmet Dede ,  Serdar Hakki Yonak

发明人： Brian Joseph Robert ,  Ercan Mehmet Dede ,  Serdar Hakki Yonak

IPC分类号： H05K7/04

CPC分类号： H01L23/3735 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49844 ,  H01L25/074 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： Three-dimensional power electronics packages are disclosed. In one embodiment, a three-dimensional power electronics package includes a metalized substrate assembly, a first power electronics device, and a second power electronics device. The metalized substrate assembly includes an insulating dielectric substrate having a power via fully-extending through the insulating dielectric substrate, a first conductive layer on a first surface of the insulating dielectric substrate, and a second conductive layer on a second surface of the insulating dielectric substrate. The first conductive layer is electrically coupled to the second conductive layer by the power via. The first power electronics device is electrically coupled to the first conductive layer such that the first power electronics device is positioned in a first plane. The second power electronics device is electrically coupled to the second conductive layer such that the second power electronics device is positioned in a second plane parallel to the first plane.

摘要翻译： 公开了三维电力电子封装。 在一个实施例中，三维电力电子封装包括金属化基板组件，第一电力电子设备和第二电力电子设备。 金属化衬底组件包括绝缘电介质衬底，其具有通过绝缘电介质衬底完全延伸的功率，绝缘电介质衬底的第一表面上的第一导电层和绝缘电介质衬底的第二表面上的第二导电层 。 第一导电层通过电源通孔电耦合到第二导电层。 第一电力电子设备电耦合到第一导电层，使得第一电力电子设备位于第一平面中。 第二电力电子设备电耦合到第二导电层，使得第二电力电子设备被定位在平行于第一平面的第二平面中。

公开(公告)号：US08199505B2

公开(公告)日：2012-06-12

申请号：US12880386

申请日：2010-09-13

申请人： Ercan Mehmet Dede

发明人： Ercan Mehmet Dede

IPC分类号： H05K7/20

CPC分类号： F28F3/048 ,  H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

摘要： A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device.

摘要翻译： 喷射冲击热交换器包括入射射流，目标层，第二层，过渡通道和流体出口。 目标层包括从冲击区域径向延伸的冲击区域和多个靶层微通道。 冷却剂流体的射流冲击目标层在冲击区域并流过径向延伸的目标层微通道朝向目标层的周边。 第二层包括多个径向延伸的第二层微通道。 过渡通道位于目标层和第二层之间，以将第二层流体耦合到目标层。 冷却剂流体流过过渡通道和多个径向延伸的第二层微通道。 流体出口流体地连接到第二层。 喷射冲击交换器可以并入具有电力电子设备的功率电子模块中。

公开(公告)号：US20110222239A1

公开(公告)日：2011-09-15

申请号：US12721174

申请日：2010-03-10

申请人： Ercan Mehmet Dede

发明人： Ercan Mehmet Dede

IPC分类号： H05K7/20 ,  F28F9/02 ,  F28F13/18

CPC分类号： F28F7/02 ,  F28D2021/0029 ,  F28F9/02 ,  F28F21/06 ,  F28F2255/14 ,  H05K7/2089

摘要： A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology.

摘要翻译： 冷却装置可以包括由模制的聚合物复合材料形成的流体入口歧管，壳体和流体出口歧管。 流体入口歧管可以包括流体入口通道和流体入口容器。 壳体可以包括从壳体的第一表面延伸到壳体的第二表面的多个冷却通道。 冷却通道可以将壳体的第一表面流体地联接到流体入口容器。 流体出口歧管还可包括流体出口通道和流体出口储存器。 冷却通道可以将壳体的第二表面流体地联接到流体出口储存器。 流体入口通道，冷却通道和流体出口通道可以包括横截面拓扑。