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    Electronic devices with moisture resistant openings
    42.
    发明授权
    Electronic devices with moisture resistant openings 有权
    具有防潮开口的电子设备

    公开(公告)号：US08830662B2

    公开(公告)日：2014-09-09

    申请号：US13037887

    申请日：2011-03-01

    Applicant: Scott A. Myers ,  Douglas Weber ,  Tang Yew Tan ,  Richard Hung Minh Dinh ,  David A. Pakula ,  Jason Sloey

    Inventor： Scott A. Myers ,  Douglas Weber ,  Tang Yew Tan ,  Richard Hung Minh Dinh ,  David A. Pakula ,  Jason Sloey

    IPC: G06F1/16 ,  H05K5/02 ,  H05K5/00

    CPC classification number: H05K5/0086 ,  H05K5/0213

    Abstract: Electronic devices may have openings that serve as potential pathways for moisture intrusion into interior portions of the devices. An electronic device may be provided with moisture repelling coatings in the vicinity of these openings to help prevent moisture from reaching the interior of the device. The openings may be associated with gaps between adjacent housing structures, openings for buttons, openings for audio and connector ports or other openings in device structures. The moisture repelling coatings may be applied to housing surfaces, button members, structures associated with audio and connector ports, and other device structures.

    Abstract translation: 电子设备可以具有用作水分侵入设备内部部分的潜在途径的开口。 电子设备可以在这些开口附近设置防潮涂层，以帮助防止水分到达设备内部。 这些开口可以与相邻的壳体结构之间的间隙，用于按钮的开口，用于音频和连接器端口的开口或装置结构中的其它开口相关联。 防潮涂层可以施加到壳体表面，按钮构件，与音频和连接器端口相关联的结构以及其它装置结构。

    COUPLING REDUCTION FOR ELECTROMECHANICAL ACTUATOR
    43.
    发明申请
    COUPLING REDUCTION FOR ELECTROMECHANICAL ACTUATOR 有权
    电动执行器联轴器减速

    公开(公告)号：US20140066122A1

    公开(公告)日：2014-03-06

    申请号：US13602009

    申请日：2012-08-31

    Applicant: Ashutosh Y. Shukla ,  David A. Pakula ,  Sawyer I. Cohen

    Inventor： Ashutosh Y. Shukla ,  David A. Pakula ,  Sawyer I. Cohen

    IPC: H02K41/02 ,  H04W88/02 ,  H04N5/232

    CPC classification number: H02K41/0356 ,  Y10T83/606

    Abstract: A portable electronic device comprises an electromechanical module having an actuator for positioning a mechanical element between first and second positions, and a controller coupled to the electromechanical module. The controller is configured to detect a mechanical event coupling to the electromechanical module, select an actuation signal to position the mechanical element in a safe position between the first and second positions, and transmit the selected signal, such that the mechanical element is positioned in the safe position during the event.

    Abstract translation: 便携式电子设备包括具有用于在第一和第二位置之间定位机械元件的致动器的机电模块以及耦合到机电模块的控制器。 控制器被配置为检测耦合到机电模块的机械事件，选择致动信号以将机械元件定位在第一和第二位置之间的安全位置，并且传送所选择的信号，使得机械元件位于 活动期间的安全位置。

    Methods For Assembling Electronic Devices Using Embedded Light Guide Structures
    45.
    发明申请
    Methods For Assembling Electronic Devices Using Embedded Light Guide Structures 有权
    使用嵌入式光导体结构组装电子设备的方法

    公开(公告)号：US20130215638A1

    公开(公告)日：2013-08-22

    申请号：US13401692

    申请日：2012-02-21

    Applicant: Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    Inventor： Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    IPC: F21V8/00 ,  B32B38/10 ,  B32B37/12

    CPC classification number: G02B6/0081 ,  C09J5/00 ,  C09J2203/318 ,  C09J2205/31 ,  G02B6/001 ,  G02B6/0086 ,  G02B6/102

    Abstract: Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.

    Abstract translation: 电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。 导光结构可以安装在组件中。 在制造电子装置时，可以将紫外光注入导光结构中以固化光固化液体粘合剂。 光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。 导光结构可以包括掩模部分，刚性支撑构件和一个或多个开口。 在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。 可以使用粘合剂施加器将粘合剂施加到组件的部分。 外部光源可以用于将固化粘合剂的光注入光导结构中。

    Electronic Devices With Moisture Resistant Openings
    47.
    发明申请
    Electronic Devices With Moisture Resistant Openings 有权
    具有防潮开口的电子设备

    公开(公告)号：US20120224299A1

    公开(公告)日：2012-09-06

    申请号：US13037887

    申请日：2011-03-01

    Applicant: Scott A. Myers ,  Douglas Weber ,  Tang Yew Tan ,  Richard Hung Minh Dinh ,  David A. Pakula ,  Jason Sloey

    Inventor： Scott A. Myers ,  Douglas Weber ,  Tang Yew Tan ,  Richard Hung Minh Dinh ,  David A. Pakula ,  Jason Sloey

    IPC: H05K7/00

    CPC classification number: H05K5/0086 ,  H05K5/0213

    Abstract: Electronic devices may have openings that serve as potential pathways for moisture intrusion into interior portions of the devices. An electronic device may be provided with moisture repelling coatings in the vicinity of these openings to help prevent moisture from reaching the interior of the device. The openings may be associated with gaps between adjacent housing structures, openings for buttons, openings for audio and connector ports or other openings in device structures. The moisture repelling coatings may be applied to housing surfaces, button members, structures associated with audio and connector ports, and other device structures.

    Abstract translation: 电子设备可以具有用作水分侵入设备内部部分的潜在途径的开口。 电子设备可以在这些开口附近设置防潮涂层，以帮助防止水分到达设备内部。 这些开口可以与相邻的壳体结构之间的间隙，用于按钮的开口，用于音频和连接器端口的开口或装置结构中的其它开口相关联。 防潮涂层可以施加到壳体表面，按钮构件，与音频和连接器端口相关联的结构以及其它装置结构。

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