公开(公告)号：US4850105A

公开(公告)日：1989-07-25

申请号：US196139

申请日：1988-05-19

申请人： Kazuo Nakajima ,  Katsuhiko Tomita

发明人： Kazuo Nakajima ,  Katsuhiko Tomita

IPC分类号： H01L23/28 ,  G01N27/403 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/057 ,  H01L23/14 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L21/568 ,  H01L23/057 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/13091 ,  H01L2924/3011

摘要： A method of removing a lead from a semiconductor tip part is provided by inserting the tip part in a through hole of a substrate. The tip part is equalized in height with substrate by adhering an adhesive tape across the through hole. A gap is left between the tip part and through hole which is filled with an insulative resin. If the substrate already has electrically conductive portions on it, a conductive paste is printed on the substrate between conductive portions and the tip part. If the substrate does not already have them, the conductive portions are formed by the addition of conductive paste on the substrate and which extends to the tip part.

摘要翻译： 通过将前端部插入到基板的通孔中，来提供从半导体尖端部移除引线的方法。 通过将粘合带粘在通孔上，使顶端部与基板高度相等。 在顶端部分和填充有绝缘树脂的通孔之间留有间隙。 如果基板上已经具有导电部分，则在导电部分和尖端部分之间的基板上印刷导电浆料。 如果基板还没有它们，则通过在基板上添加导电浆料并且延伸到尖端部分而形成导电部分。