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公开(公告)号：US20170266450A1
公开(公告)日：2017-09-21
申请号：US15613263
申请日：2017-06-05
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Jeffrey J. Clayton , Charles E. Peters
IPC: A61N1/375 , B23K26/32 , B23K26/24 , B23K101/36 , A61N1/37 , B23K103/14
CPC classification number: A61N1/3752 , A61N1/3718 , B23K26/24 , B23K26/32 , B23K2101/36 , B23K2103/14 , Y10T29/49117
Abstract: Medical devices provide metallic connector enclosures. The metallic connector enclosures may be constructed with relatively thin walls in comparison to polymer connector enclosures to aid in miniaturizing the medical device. The metallic connector enclosures may be constructed with interior surfaces that deviate less from an ideal inner surface shape in comparison to polymer connector enclosures to allow for better concentricity of electrical connectors. The metallic connector enclosures may include a panel that allows access to the cavity of the connector enclosure where set screw blocks, lead connectors, spacers, seals, and the like may be located. Furthermore, the lead connectors within the metallic connector enclosures may be separated from the metallic connector enclosure by being positioned within non-conductive seals that reside within features included in cavity walls of the connector enclosure. Similarly, set screw blocks may be separated from the metallic connector enclosure by non-conductive spacers present within the cavity.
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42.发明申请公开(公告)号：US20170157405A1
公开(公告)日：2017-06-08
申请号：US15437429
申请日：2017-02-20
Applicant: Medtronic, Inc.
Inventor： Steven T. Deininger , Michael J. Baade , Rajesh V. Iyer
CPC classification number: A61N1/3754 , A61N1/375 , H01G4/35 , H01R4/029 , H01R13/516 , H01R13/5224 , H01R24/58 , H01R43/26 , H01R2107/00 , H01R2201/12 , H05K7/02 , H05K7/1427 , Y10T29/4913 , Y10T29/49208
Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
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公开(公告)号：US20160008606A1
公开(公告)日：2016-01-14
申请号：US14865458
申请日：2015-09-25
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Jeffrey J. Clayton , Charles E. Peters
IPC: A61N1/375
CPC classification number: A61N1/3752 , A61N1/3718 , B23K26/24 , B23K26/32 , B23K2101/36 , B23K2103/14 , Y10T29/49117
Abstract: Medical devices provide metallic connector enclosures. The metallic connector enclosures may be constructed with relatively thin walls in comparison to polymer connector enclosures to aid in miniaturizing the medical device. The metallic connector enclosures may be constructed with interior surfaces that deviate less from an ideal inner surface shape in comparison to polymer connector enclosures to allow for better concentricity of electrical connectors. The metallic connector enclosures may include a panel that allows access to the cavity of the connector enclosure where set screw blocks, lead connectors, spacers, seals, and the like may be located. Furthermore, the lead connectors within the metallic connector enclosures may be separated from the metallic connector enclosure by being positioned within non-conductive seals that reside within features included in cavity walls of the connector enclosure. Similarly, set screw blocks may be separated from the metallic connector enclosure by non-conductive spacers present within the cavity.
Abstract translation: 医疗设备提供金属连接器外壳。 与聚合物连接器外壳相比，金属连接器外壳可以被构造成具有相对较薄的壁，以有助于使医疗装置小型化。 与聚合物连接器外壳相比，金属连接器外壳可以构造为具有偏离理想内表面形状的内表面，以允许电连接器更好的同心度。 金属连接器外壳可以包括允许进入连接器外壳的空腔的面板，其中固定螺丝块，引线连接器，间隔件，密封件等可以位于其中。 此外，金属连接器外壳内的引线连接器可以通过位于连接器外壳的空腔壁内的特征内的非导电密封件内而与金属连接器外壳分离。 类似地，固定螺钉块可以通过在腔内存在的非导电间隔件与金属连接器外壳分离。
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公开(公告)号：US12214210B2
公开(公告)日：2025-02-04
申请号：US17485303
申请日：2021-09-24
Applicant: Medtronic, Inc.
Inventor： Steven T. Deininger , Jerel K. Mueller , Todd V. Smith , Jeffrey Clayton , Thomas M. Hillebrand , Phillip C. Falkner , Jenna N. George , Sarah J. Offutt
Abstract: A leadless neurostimulation device having a header unit including at least one primary electrode having a contact surface that defines an external surface of the leadless neurostimulation device, a housing including a secondary electrode positioned on the same side of the leadless neurostimulation device as the at least one primary electrode, and a anchor device including at least one suture point for securing the leadless neurostimulation device to patient tissue or at least one protrusion nub configured to create mechanical resistance that impedes relative movement between wherein the leadless neurostimulation device and the patient tissue when implanted, where the at least one primary electrode and the secondary electrode are configured to transmit an electrical stimulation signal therebetween to provide electrical stimulation therapy to a target nerve of a patient.
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公开(公告)号：US11890484B2
公开(公告)日：2024-02-06
申请号：US18086224
申请日：2022-12-21
Applicant: MEDTRONIC, INC.
Inventor： Darren A. Janzig , Andrew Thom , Brad Tischendorf , Randy S. Roles , Steven T. Deininger , Nicholas R. Whitehead
IPC: A61N1/375
CPC classification number: A61N1/3754 , A61N1/37514
Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
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Patent Agency Ranking
公开(公告)号：US11806519B2
公开(公告)日：2023-11-07
申请号：US17092504
申请日：2020-11-09
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Michael J. Baade , Charles E. Peters
CPC classification number: A61N1/375 , A61N1/086 , A61N1/18 , A61N1/3752 , A61N1/3758 , H01R43/005 , H01R43/18 , H01R43/205 , H05K5/06 , A61B90/50 , A61N1/3754
Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.
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公开(公告)号：US20230127724A1
公开(公告)日：2023-04-27
申请号：US18086224
申请日：2022-12-21
Applicant: MEDTRONIC, INC.
Inventor： Darren A. Janzig , Andrew Thom , Brad Tischendorf , Randy S. Roles , Steven T. Deininger , Nicholas R. Whitehead
IPC: A61N1/375
Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
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公开(公告)号：US20220362559A1
公开(公告)日：2022-11-17
申请号：US17738966
申请日：2022-05-06
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Jeffrey J. Clayton
Abstract: Seals used within lead passageways of implantable medical devices for creating a seal to implantable medical leads inserted into the lead passageways include a body defining a lead passageway with an axial dimension. The body further defines a first circumferential protrusion extending radially a first distance into the lead passageway, and the body further defines a second circumferential protrusion separated from the first circumferential protrusion along the axial dimension. The second circumferential protrusion extends radially a second distance into the lead passageway, the second distance being less than the first distance. The body further defines a first circumferential depression immediately adjacent the first circumferential protrusion and between the first circumferential protrusion and the second circumferential protrusion.
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公开(公告)号：US20220176131A1
公开(公告)日：2022-06-09
申请号：US17674195
申请日：2022-02-17
Applicant: MEDTRONIC, INC.
Inventor： Michael J. Baade , Steven T. Deininger , Katherine J. Bach
IPC: A61N1/375
Abstract: Implantable medical devices include an enclosure that is constructed by machining of a material rather than by forming or stamping. The machining produces one or more internal features within the enclosure. These internal features may include shelves that may act as a stiffener and create separate compartments within the enclosure. These internal features may include contoured edges along the shelves to accommodate conductors and other structures that extend from one compartment to another. These features may include slots that are present in one or more locations, such as on a surface of one of the shelves. These internal features may also include standoffs that establish a gap between an internal component and the external wall of the enclosure. These internal features may also include different thicknesses in different areas of the enclosure, such as one wall thickness in one compartment and a different wall thickness in another compartment.
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公开(公告)号：US11224753B1
公开(公告)日：2022-01-18
申请号：US17487291
申请日：2021-09-28
Applicant: MEDTRONIC, INC.
Inventor： Steven T. Deininger , Jeffrey J. Clayton , Charles E. Peters
IPC: A61N1/375 , A61N1/37 , B23K26/24 , B23K26/32 , B23K101/36 , B23K103/14
Abstract: Medical devices provide metallic connector enclosures. The metallic connector enclosures may be constructed with relatively thin walls in comparison to polymer connector enclosures to aid in miniaturizing the medical device. The metallic connector enclosures may be constructed with interior surfaces that deviate less from an ideal inner surface shape in comparison to polymer connector enclosures to allow for better concentricity of electrical connectors. The metallic connector enclosures may include a panel that allows access to the cavity of the connector enclosure where set screw blocks, lead connectors, spacers, seals, and the like may be located. Furthermore, the lead connectors within the metallic connector enclosures may be separated from the metallic connector enclosure by being positioned within non-conductive seals that reside within features included in cavity walls of the connector enclosure. Similarly, set screw blocks may be separated from the metallic connector enclosure by non-conductive spacers present within the cavity.
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