公开(公告)号：US08393935B2

公开(公告)日：2013-03-12

申请号：US12673294

申请日：2008-07-23

申请人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

发明人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

IPC分类号： B24B9/00 ,  B24B21/00

CPC分类号： B24B9/065

摘要： A polishing apparatus polishes a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate by bringing a polishing tool into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder configured to hold the substrate, and a polishing head configured to polish the periphery of the substrate held by the substrate holder using the polishing tool. The polishing head includes a press pad for pressing the polishing tool against the periphery of the substrate, and a linear motor configured to reciprocate the press pad.

摘要翻译： 抛光装置通过使抛光工具与基板的周边滑动接触来抛光基板的周边（斜面部分，切口部分，边缘切割部分）。 抛光装置包括：被配置为保持基板的基板保持器，以及抛光头，其被构造成使用抛光工具抛光由基板保持器保持的基板的周边。 抛光头包括用于将抛光工具压靠在基板的周边上的压垫，以及配置成使压垫往复运动的线性电动机。

公开(公告)号：US08187055B2

公开(公告)日：2012-05-29

申请号：US12292662

申请日：2008-11-24

申请人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenji Yamaguchi ,  Masayuki Nakanishi

发明人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenji Yamaguchi ,  Masayuki Nakanishi

IPC分类号： B24B1/00 ,  B24B49/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/008 ,  B24B21/20 ,  B24B27/0076 ,  B24B37/042 ,  B24B37/30 ,  B24B41/068 ,  B24B49/00 ,  Y10T428/24777

摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

摘要翻译： 抛光装置抛光基板的周边。 该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

公开(公告)号：USD616389S1

公开(公告)日：2010-05-25

申请号：US29335608

申请日：2009-04-17

申请人： Tamami Takahashi

设计人： Tamami Takahashi

公开(公告)号：US20090227189A1

公开(公告)日：2009-09-10

申请号：US12379983

申请日：2009-03-05

申请人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

发明人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B9/02 ,  B24B21/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/06 ,  B24B21/08 ,  B24B37/04 ,  B24B41/06

摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

摘要翻译： 抛光装置通过使抛光工具与基板滑动接触来抛光基板的周边。 抛光装置包括：基板保持机构，其构造成保持基板并使基板旋转;抛光机构，其构造成将抛光工具抵靠基板的周边按压以周边抛光;以及周边支撑机构，其构造成支撑 通过流体的衬底的周边。 周边支撑机构构造成从基板的周边的相对侧或同一侧支撑基板的表面。

公开(公告)号：US20080274670A1

公开(公告)日：2008-11-06

申请号：US11596714

申请日：2005-05-23

申请人： Mitsuo Tada ,  Yasunari Suto ,  Hirofumi Ichihara ,  Kenya Ito ,  Tamami Takahashi

发明人： Mitsuo Tada ,  Yasunari Suto ,  Hirofumi Ichihara ,  Kenya Ito ,  Tamami Takahashi

IPC分类号： B24B49/12

CPC分类号： H01L21/67242 ,  B24B9/065 ,  B24B49/12 ,  G01N21/9501 ,  G01N29/44 ,  H01L21/67023 ,  H01L21/67075

摘要： A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.

摘要翻译： 投射/接收单元（52）将激光投射到周边部分（30）并且在液体被供给到基板（14）的同时接收反射光并在周边部分（30）上流动。 信号处理控制器（54）处理反射光的电信号以决定周边部分（30）的状态。 监视被抛光的周边部分的状态。 此外，检测到抛光终点。 也可以使用激光以外的透射波。 周边部分（30）也可以由通道形成部件包围，从而适当地形成通道。 即使在液体在基板周边部分上流动的情况下，也可以适当地测量周边部分。

公开(公告)号：US06648014B1

公开(公告)日：2003-11-18

申请号：US10069789

申请日：2002-02-28

申请人： Tamami Takahashi ,  Yoshihiro Mochizuki

发明人： Tamami Takahashi ,  Yoshihiro Mochizuki

IPC分类号： F15B13043

CPC分类号： F15B13/0438 ,  F15B21/041 ,  Y10T137/7976 ,  Y10T137/8085 ,  Y10T137/8122 ,  Y10T137/86598 ,  Y10T137/87885

摘要： A hydraulic control valve has a valve block provided with a plurality of ports, a valve body formed with ports corresponding to the ports of the valve block, and a plate disposed between the valve block and the valve body. The plate has a flow passage for providing communication between the ports of the valve block and the ports of the valve body. A filter is disposed in the flow passage.

摘要翻译： 液压控制阀具有设置有多个端口的阀块，形成有与阀块的端口对应的端口的阀体以及设置在阀块和阀体之间的板。 板具有用于在阀块的端口和阀体的端口之间提供连通的流动通道。 过滤器设置在流动通道中。

公开(公告)号：US5944042A

公开(公告)日：1999-08-31

申请号：US996825

申请日：1997-12-23

申请人： Tamami Takahashi ,  Yuichi Usami

发明人： Tamami Takahashi ,  Yuichi Usami

IPC分类号： F16K25/00 ,  F16K3/26 ,  F16K11/07 ,  F16K35/00 ,  F16K39/04 ,  F15B13/04

CPC分类号： F16K11/07 ,  F16K39/04 ,  Y10T137/0318 ,  Y10T137/8671

摘要： A flow force compensating method for a flow control valve and a flow control valve using the same method, in which a spool is supported by hydrostatic bearings within a sleeve and fluid flow from the hydrostatic bearing flows into a valve space defined between a spool land and a circumferential groove of the sleeve, wherein a circumferential groove is formed in the spool land, bearing fluid flow flowing out of the bearing into the valve space defined between the circumferential groove and the sleeve groove is directed toward a central axis of the spool, and control flow is swirled by the bearing fluid flow, thereby compensating a flow force, acting on the spool.

摘要翻译： 一种用于流量控制阀和流量控制阀的流量补偿方法，其使用相同的方法，其中阀芯由套筒内的静压轴承支撑，并且来自静压轴承的流体流动流入限定在阀芯接头和 套筒的周向槽，其中在所述卷轴台面中形成有周向槽，将从所述轴承流出的轴承流体流动限定在所述周向槽和所述套筒槽之间的阀空间中，朝向所述阀芯的中心轴线，并且 控制流由轴承流体流动旋转，从而补偿作用在阀芯上的流动力。

公开(公告)号：US5830041A

公开(公告)日：1998-11-03

申请号：US743361

申请日：1996-11-04

申请人： Tamami Takahashi ,  Fumihiko Sakata ,  Norio Kimura ,  Masako Kodera ,  Atsushi Shigeta

发明人： Tamami Takahashi ,  Fumihiko Sakata ,  Norio Kimura ,  Masako Kodera ,  Atsushi Shigeta

IPC分类号： B24B37/013 ,  B24B37/04 ,  B24B49/16 ,  B24B7/22

CPC分类号： B24B37/013 ,  B24B49/16

摘要： A method and apparatus for determining a planar end point on a workpiece such as a semiconductor wafer in a polishing process for polishing the workpiece to a flat mirror finish. The workpiece having an uneven surface is held by a top ring and pressed against a polishing platen. The workpiece is moved relative to the polishing platen to polish the workpiece, and a change in a frictional force between the workpiece and the polishing platen is detected. A reference time when the workpiece having an uneven surface is polished to a flat surface is determined based on the change of the frictional force between the workpiece and the polishing platen. The time when a certain period of polishing time from the reference time elapses is determined as an endpoint on the workpiece.

摘要翻译： 一种用于在用于将工件抛光到平面镜面抛光的抛光工艺中确定诸如半导体晶片的工件上的平面终点的方法和装置。 具有不平坦表面的工件由顶环保持并压靠在研磨台板上。 工件相对于研磨台板移动以抛光工件，并且检测到工件和抛光台板之间的摩擦力的变化。 基于工件和研磨台板之间的摩擦力的变化，确定具有不平坦表面的工件被抛光到平坦表面的参考时间。 从参考时间经过一定时间的抛光时间经过的时间被确定为工件上的端点。

公开(公告)号：US5679064A

公开(公告)日：1997-10-21

申请号：US561024

申请日：1995-11-21

申请人： Toyomi Nishi ,  Tamami Takahashi ,  Tetsuji Togawa

发明人： Toyomi Nishi ,  Tamami Takahashi ,  Tetsuji Togawa

IPC分类号： B24B37/20 ,  B24B37/22 ,  B24B7/04 ,  B24B29/02

CPC分类号： B24B37/14 ,  B24B37/015

摘要： A polishing apparatus includes a light weight and easily interchangeable cloth cartridge of high deformation resistance. The cloth cartridge is made by bonding a polishing cloth to a cartridge base member which includes a honeycomb structure member which can be sandwiched between top and bottom aluminum thin plates. Honeycomb structure member of various cell sizes and materials available in the marketplace can be used for this purpose quite effectively. The honeycomb structure members made of an aluminum material provides a stiff and thermally resistant cartridge base member. Cell spaces in the honeycomb structure member can be cooled or heated, depending on a nature of the polishing slurry used, by passing an appropriate fluid through the base member. This is made possible by providing flow holes in the cell walls separating the honeycomb cells. This approach is effective in producing optimum polishing performance by the cloth cartridge. Thermal control can be exercised generally or locally, depending on where heat is needed or should be removed.

摘要翻译： 抛光装置包括具有高变形阻力的重量轻且易于互换的布料盒。 布料筒通过将抛光布粘结到包括蜂窝状结构件的盒基部件上而制成，所述蜂窝结构件可夹在顶部和底部铝薄板之间。 市场上可用的各种电池尺寸和材料的蜂窝结构件可以非常有效地用于此目的。 由铝材料制成的蜂窝结构构件提供了坚硬和耐热的筒基座构件。 根据所使用的研磨浆料的性质，通过使适当的流体通过基底部件，蜂窝结构体中的细胞空间可被冷却或加热。 这可以通过在分离蜂窝单元的单元壁中提供流动孔来实现。 这种方法在通过布料盒产生最佳抛光性能方面是有效的。 通常或局部地可以进行热控制，这取决于需要或应该去除热量的地方。

公开(公告)号：US5651725A

公开(公告)日：1997-07-29

申请号：US628990

申请日：1996-04-10

申请人： Ritsuo Kikuta ,  You Ishii ,  Tamami Takahashi

发明人： Ritsuo Kikuta ,  You Ishii ,  Tamami Takahashi

IPC分类号： B24B37/20 ,  B24B37/24 ,  B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/304 ,  B24B1/00 ,  B24B7/19 ,  B24B7/30

CPC分类号： B24B53/017 ,  B24B53/00

摘要： An apparatus and method for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The workpiece is held by a top ring, and a surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, a surface of the abrasive cloth is dressed while applying a dressing liquid onto the abrasive cloth. A polishing operation and a dressing operation are performed in such a state that the abrasive solution and the dressing liquid do not interfere with each other.

摘要翻译： 用于将诸如半导体晶片的工件抛光到平面镜面的装置和方法。 工件由顶环保持，并且通过将安装在转盘上的研磨布压在研磨布上而将工件压在研磨布上的同时将工件的表面抛光。 在抛光工件的同时，将研磨布的表面修整，同时将修整液施加到研磨布上。 在研磨液和敷料液不会相互干扰的状态下进行研磨操作和修整操作。