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31 条记录 (耗时 0.028 秒)

    Elevation and index apparatus of water hydraulic driven type
    1.
    发明授权
    Elevation and index apparatus of water hydraulic driven type 失效
    水力驱动型升降机

    公开(公告)号：US06453773B1

    公开(公告)日：2002-09-24

    申请号：US09584078

    申请日：2000-06-01

    申请人： Yoshihiro Mochizuki ,  Chishiro Yamashina ,  Tamami Takahashi ,  Shimpei Miyakawa ,  JPX Mammoto ,  Ryuji Kodama

    发明人： Yoshihiro Mochizuki ,  Chishiro Yamashina ,  Tamami Takahashi ,  Shimpei Miyakawa ,  JPX Mammoto ,  Ryuji Kodama

    IPC分类号： B23B2924

    CPC分类号： B23Q16/025 ,  B23Q39/044 ,  Y10T74/1476 ,  Y10T74/1488

    摘要： An elevation and index apparatus of a water hydraulic driven type has a rotary table (5) supported pivotally by a cross roller bearing (15), a water hydraulic motor (9) and a water hydraulic cylinder (8), each fixed to a table base (14) supporting a power transmission mechanism and the cross roller bearing (15), a main elevation shaft (7) connected to an output shaft of the water hydraulic cylinder (8), an elevation and index table (1) connected to the main elevation shaft (7) through a bearing (7a) and connected to the rotary table (5) so as to restrict pivotal movement, and a casing (18) disposed outside the table base (14) and enclosing the power transmission mechanism.

    摘要翻译： 水压驱动式的升降装置具有由交叉滚子轴承（15），水力电动机（9）和水压缸（8）枢转支撑的旋转台（5），每个固定在工作台 支撑动力传递机构的基座（14）和交叉滚子轴承（15），与水压缸（8）的输出轴连接的主仰角轴（7），与 通过轴承（7a）连接到旋转台（5）上以限制枢转运动的主高程轴（7）和设置在工作台基座（14）外部并包围动力传递机构的壳体（18）。

    Fluid control valve and plate with filter
    3.
    发明授权
    Fluid control valve and plate with filter 失效
    流体控制阀和带过滤器的板

    公开(公告)号：US06648014B1

    公开(公告)日：2003-11-18

    申请号：US10069789

    申请日：2002-02-28

    申请人： Tamami Takahashi ,  Yoshihiro Mochizuki

    发明人： Tamami Takahashi ,  Yoshihiro Mochizuki

    IPC分类号： F15B13043

    CPC分类号： F15B13/0438 ,  F15B21/041 ,  Y10T137/7976 ,  Y10T137/8085 ,  Y10T137/8122 ,  Y10T137/86598 ,  Y10T137/87885

    摘要： A hydraulic control valve has a valve block provided with a plurality of ports, a valve body formed with ports corresponding to the ports of the valve block, and a plate disposed between the valve block and the valve body. The plate has a flow passage for providing communication between the ports of the valve block and the ports of the valve body. A filter is disposed in the flow passage.

    摘要翻译： 液压控制阀具有设置有多个端口的阀块，形成有与阀块的端口对应的端口的阀体以及设置在阀块和阀体之间的板。 板具有用于在阀块的端口和阀体的端口之间提供连通的流动通道。 过滤器设置在流动通道中。

    Polishing Apparatus and Polishing Method
    5.
    发明申请
    Polishing Apparatus and Polishing Method 有权
    抛光装置和抛光方法

    公开(公告)号：US20090239446A1

    公开(公告)日：2009-09-24

    申请号：US11884746

    申请日：2005-08-30

    申请人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Kazuto Hirokawa

    发明人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Kazuto Hirokawa

    IPC分类号： B24B49/00 ,  B24B1/00 ,  B24B49/08 ,  B24B49/16 ,  B24D11/00 ,  B24B37/04

    CPC分类号： B24B37/005

    摘要： A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer W by applying a pressure between a polishing member (polishing pad) 201 and the wafer W held by a holding member (top ring) 52 and relatively moving the polishing member 201 to the wafer W. The polishing apparatus comprises a top ring 52 for holding the wafer W, a pressure adjusting mechanism 206 for adjusting a supporting pressure with which the wafer W is supported on a supporting surface by a retainer ring 203, and a control unit 208 for controlling the pressure adjusting mechanism 206 to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer W. The top ring 52 comprises an air bag 202 for pressing the wafer W against the polishing pad 201, a retainer ring 203 which surrounds the wafer W, and an air bag 204 for pressing the retainer ring 203.

    摘要翻译： 提供抛光装置用于以高屈服率抛光晶片，即使存在滚降。 抛光装置通过在抛光构件（抛光垫）201和由保持构件（顶环））52保持的晶片W之间施加压力并将抛光构件201相对移动到晶片W来对晶片W进行抛光。抛光装置包括 用于保持晶片W的顶环52，用于调节通过保持环203将晶片W支撑在支撑表面上的支撑压力的压力调节机构206以及用于将压力调节机构206控制到 基于晶片W的滚降量将支撑压力提高到期望的压力。顶环52包括用于将晶片W压靠在抛光垫201上的气囊202，围绕晶片W的保持环203和 用于按压保持环203的气囊204。

    Ink jet recording method
    6.
    发明授权
    Ink jet recording method 失效
    喷墨记录方法

    公开(公告)号：US06217166B1

    公开(公告)日：2001-04-17

    申请号：US09104706

    申请日：1998-06-25

    申请人： Yoichi Saito ,  Masaru Tsuchiya ,  Yoshihiro Mochizuki

    发明人： Yoichi Saito ,  Masaru Tsuchiya ,  Yoshihiro Mochizuki

    IPC分类号： G01D1100

    CPC分类号： B41M5/52 ,  B41M5/506 ,  B41M5/508 ,  B41M5/5218 ,  B41M5/5254

    摘要： An ink-jet recording method is disclosed, including recording on an ink-jet recording sheet containing a non-water-absorbing support and provided thereon an ink absorbing layer containing polyvinyl alcohol, fine inorganic particles and boric acid or its salt, using an ink-jet recording apparatus and a water-based recording liquid containing a high boiling solvent compound having a hydroxy group, wherein the amount of boric acid or its salt contained in the ink absorbing layer of the recording sheet (X), the amount of a hydroxy group contained in polyvinyl alcohol contained in the ink absorbing layer of the recording sheet (Y) and the maximum amount of the the hydroxy group contained in the high boiling solvent contained in a unit area when recorded on the recording sheet at a maximum ejecting amount of the water-based recording liquid (Z) satisfy the following requirements: 0.05≦X/Y≦0.5  (1) Z/Y≦4.  (2)

    摘要翻译： 公开了一种喷墨记录方法，包括在含有非吸水性载体的喷墨记录纸上记录，并在其上设置含有聚乙烯醇，无机微粒和硼酸或其盐的油墨吸收层，使用油墨 喷墨记录装置和含有具有羟基的高沸点溶剂化合物的水性记录液，其中记录片材（X）的油墨吸收层中所含的硼酸或其盐的含量，羟基 包含在记录片材（Y）的油墨吸收层中的聚乙烯醇中所含的羟基的最大量和记录在记录纸上的单位面积中包含的高沸点溶剂中的羟基的最大量， 水性记录液（Z）满足以下要求：

    Silver halide photographic light-sensitive material
    7.
    发明授权
    Silver halide photographic light-sensitive material 失效
    卤化银照相感光材料

    公开(公告)号：US5376516A

    公开(公告)日：1994-12-27

    申请号：US263011

    申请日：1994-06-20

    申请人： Yoshihiro Mochizuki ,  Eiichi Ueda

    发明人： Yoshihiro Mochizuki ,  Eiichi Ueda

    IPC分类号： G03C1/06 ,  G03C1/38 ,  G03C1/76

    CPC分类号： G03C1/385 ,  G03C1/7614 ,  Y10S430/162

    摘要： A silver halide photographic light-sensitive material is disclosed, which comprises a support and a silver halide photographic emulsion layer and a protective layer provided in that order on a first side of the support, and a backing layer and a protective backing layer provided in that order on a second side of the support opposite to the silver halide photographic emulsion layer, an outermost layer of the material containing a fluorine-containing anionic surfactant and a fluorine-containing cationic surfactant and an outermost layer on the second side of the support containing a compound represented by the Following formula (A) or (B):Formula (A) RCOOMFormula (B) R.sub.1 --CO--O--X--O--CO--R.sub.2.

    摘要翻译： 公开了一种卤化银摄影感光材料，其包括支撑体和卤化银照相乳剂层和在该支撑体的第一侧上依次提供的保护层，以及背衬层和保护背衬层， 在与卤化银照相乳剂层相对的支撑体的第二面上，包含含氟阴离子表面活性剂和含氟阳离子表面活性剂的材料的最外层和在载体的第二面上的最外层， 由下式（A）或（B）表示的化合物：式（A）RCOOM式（B）R1-CO-OXO-CO-R2。

    Polishing Apparatus and Polishing Method
    8.
    发明申请
    Polishing Apparatus and Polishing Method 审中-公开
    抛光装置和抛光方法

    公开(公告)号：US20070254558A1

    公开(公告)日：2007-11-01

    申请号：US11661141

    申请日：2005-08-26

    申请人： Masako Kodera ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Akira Kodera ,  Hirokuni Hiyama ,  Manabu Tsujimura ,  Kazuto Hirokawa ,  Akira Fukunaga

    发明人： Masako Kodera ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Akira Kodera ,  Hirokuni Hiyama ,  Manabu Tsujimura ,  Kazuto Hirokawa ,  Akira Fukunaga

    IPC分类号： B24B37/04 ,  H01L21/00

    CPC分类号： H01L21/6708 ,  B24B37/005 ,  B24B37/042 ,  B24B37/046 ,  B24B49/006 ,  B24B57/02

    摘要： A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).

    摘要翻译： 抛光装置（30）具有抛光面（32），用于保持晶片（W）的顶环（36），使抛光面（32）和晶片（W）相对于运动的电机（46,56）相对于 以及垂直移动机构（54），其在压制压力下将晶片（W）压靠在抛光表面（32）上。 抛光装置（30）还具有控制器（44），用于在抛光速率与按压压力与相对速度的乘积不成比例的非普雷斯顿范围内调节抛光状态。 抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液体，并且在晶片表面（W）内均匀的研磨速率。