摘要:
The present invention provides a bipolar transistor, a method for forming the bipolar transistor, a method for turning on the bipolar transistor, and a band-gap reference circuit, virtual ground reference circuit and double band-gap reference circuit with the bipolar transistor. The bipolar transistor includes: a Silicon-On-Insulator wafer; a base area, an emitter area and a collector area; a base area gate dielectric layer on a top silicon layer and atop the base area; a base area control-gate on the base area gate dielectric layer; an emitter electrode connected to the emitter area via a first contact; a collector electrode connected to the collector area via a second contact; and a base area control-gate electrode connected to the base area control-gate via a third contact. Processes of forming the bipolar transistor are fully compatible with traditional standard CMOS processes; and the base current to turn on the bipolar transistor is based on the GIDL current and formed by applying a voltage to the base area control-gate electrode without any need of contact.
摘要:
A transistor structure fabricated on thin SOI is disclosed. The transistor on thin SOI has gated n+ and p+ junctions, which serve as switches turning on and off GIDL current on the surface of the junction. GIDL current will flow into the floating body and clamp its potential and can thus serve as an output node. The transistor can function as an inverter. The body (either n-well or p-well) is isolated from the n+ or P+ “GIDL switches” by a region of opposite doping type, i.e., p-base and n-base. The basic building blocks of logic circuits, e.g., NAND and NOR gates, are easily implemented with such transistors on thin SOI wafers. These new transistors on thin SOI only need contacts and metal line connections on the VCC and VSS. The connection of fan-outs (between the output and input) can be implemented by capacitor coupling. The transistor structure and operation is useful for high-performance, low-voltage, and low-power VLSI circuits on SOI wafers.
摘要:
A charge pump formed in a silicon-on-insulator (SOI) substrate is disclosed. The charge pump comprises a SOI layer formed on a substrate. Formed in the silicon of the SOI is a first p-body and a second p-body. Also formed in the silicon is a n+ region that extends down to the insulator so that the n+ region separates the first p-body and second p-body. Finally, a gate structure is formed atop of a portion of the first p-body and a portion of the n+ region. The gate structure is separated from the 1st p-body and n+ region by gate oxide, and it serves as charge pump capacitor. Both the diode turn-on (when gate is pulsing high and forward biasing the p-body to n+ junction), and GIDL current (when the gate is pulsing low, and generates GIDL hole currents from n+ surface to p-body) will result in a “short” of the p-body and n+ region; this ensures the proper operation of charge pump.
摘要:
A method of reading a 2-bit memory cell having a drain, a source, a control gate, and a floating gate is disclosed. First, a voltage is applied to the source and drain to generate a gate induced drain leakage (GIDL) current. Next, a measurement is taken of a drain GIDL current at said drain and a source GIDL current at said source to determine the data stored in said memory cell.
摘要:
A method for manufacturing a semiconductor capacitor atop a conductive plug that is formed in a dielectric layer. A first oxide layer is formed on the dielectric layer and the conductive plug. Next, a crown opening in formed in the first oxide layer such that the conductive plug is exposed. Silicon sidewall spacers are formed on the sidewalls of the crown opening and then HSG silicon is formed on the silicon sidewall spacers. The HSG silicon and silicon sidewall spacers are oxidized and then a doped polysilicon layer is formed into the aid crown opening and over the oxidized HSG silicon. A thin dielectric layer is formed over the aid doped polysilicon layer and finally a top conductive layer is formed over the thin dielectric layer.
摘要:
A new one-transistor EEPROM cell structure using a spacer of ferro-electric material (e.g. PZT or BST). The spacer's polarization can be alterable and is used as the storage element of digital information. This new cell offers small cell size, low voltage operation, high endurance, fast write operation, and full function EEPROM compared to conventional EEPROM or F-RAMS.
摘要:
A digitally tunable voltage reference circuit based on floating gate neuron MOSFETs and a V.sub.t referenced voltage source configuration is disclosed. The voltage reference can provide a wide range of voltage levels by biasing digital signals to the multiple inputs of the neuron MOSFET in the voltage source.
摘要:
A flash memory cell formed on a semiconductor substrate is disclosed. The cell comprises: a p-well formed in the substrate; a gate structure formed atop the p-well, the gate structure including a control gate and a floating gate, the floating gate electrically isolated from the control gate and the semiconductor substrate by a thin dielectric layer; an n- base formed adjacent to a first edge of the gate structure and extending underneath the gate structure; a p+ structure formed within the n- base and adjacent to the first edge of the gate structure; and a n+ structure adjacent a second edge of the gate structure. With such a structure, it is possible to program the cell by band-to-band tunneling enhanced hot electrons generated at the p+ surface. The erase is performed by Fowler-Nordheim tunneling through the n- base region.
摘要:
A SRAM cell is disclosed. The SRAM cell comprises: a first inverter having an input and an output; a second inverter having an input and an output, the output of the second inverter capacitively coupled to the input of the first inverter, the input of the second inverter capacitively coupled to the output of the first inverter; a first access transistor controlled by a wordline and connected between the output of the first inverter and a bitline; and a second access transistor controlled by the wordline and connected between the output of the second inverter and a complement to the bitline.
摘要:
A single polysilicon DRAM cell is disclosed. The DRAM cell comprises: a deep n-well in a silicon substrate; a p-well within the deep n-well; a gate structure over and straddling the deep n-well and the p-well, the gate structure being a stack of a thin gate oxide layer and a conductive layer; and a n+ well within the p-well and adjacent to a sidewall of the gate structure. The p-well potential can be reset to -V.sub.cc /2 representing "0", and written to V.sub.cc /2 representing "1". The parasitic n-channel MOS with the p-well as the "body" will have a threshold voltage modulated by the p-well potential at V.sub.cc /2 and -V.sub.cc /2 for representing "1" and "0" states, respectively.