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公开(公告)号：US08287093B2
公开(公告)日：2012-10-16
申请号：US12510513
申请日：2009-07-28
IPC分类号： B41J2/14
CPC分类号： B41J2/1433 , B41J2002/14475
摘要： A drop ejection device including a flow path in which fluid is pressurized to eject drops from a nozzle opening on a surface, a piezoelectric actuator for pressurizing said fluid, and one or more waste fluid control apertures on the surface proximate the nozzle opening, the one or more apertures being isolated from the flow path.
摘要翻译： 液滴喷射装置，其包括流体被加压以从表面上的喷嘴开口喷出液滴的流动路径，用于对所述流体加压的压电致动器以及在喷嘴开口附近的表面上的一个或多个废液控制孔， 或更多的孔与流动路径隔离。
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公开(公告)号：US08240796B2
公开(公告)日：2012-08-14
申请号：US12500557
申请日：2009-07-09
IPC分类号： B41J29/38
CPC分类号： B41J25/34
摘要： A fluid ejector includes a fluid ejection assembly, a housing, and an insert. The fluid ejection assembly includes one or more silicon bodies and a plurality of actuators. The one or more silicon bodies includes a silicon body having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the plurality of fluid passages. The plurality of actuators cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles. The housing assembly includes one or more plastic bodies, at least one plastic body attached to at least one silicon body to form a sealed volume on a side of the fluid ejection assembly opposite the nozzles. The insert is embedded in the at least one plastic body in proximity to the at least one silicon body, the insert having a coefficient of thermal expansion of less than 9 ppm/° C.
摘要翻译： 流体喷射器包括流体喷射组件，壳体和插入件。 流体喷射组件包括一个或多个硅体和多个致动器。 一个或多个硅体包括具有多个用于流体流动的流体通道的硅体和与多个流体通道流体连接的多个喷嘴。 多个致动器使多个流体通道中的流体从多个喷嘴喷出。 壳体组件包括一个或多个塑料体，至少一个塑料体附接到至少一个硅体，以在流体喷射组件的与喷嘴相对的一侧上形成密封体积。 插入件嵌入在至少一个硅体附近的至少一个塑料体中，插入件的热膨胀系数小于9ppm /℃。
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公开(公告)号：US08053956B2
公开(公告)日：2011-11-08
申请号：US12435099
申请日：2009-05-04
申请人： Andreas Bibl , John A. Higginson
发明人： Andreas Bibl , John A. Higginson
IPC分类号： H01L41/047
CPC分类号： B41J2/1626 , B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/1637 , B41J2/1645 , B41J2/1646 , H01L27/20 , H01L41/0973 , H01L41/313 , H01L41/337 , Y10T29/42 , Y10T29/43 , Y10T29/435
摘要： Microelectromechanical systems with structures having piezoelectric actuators are described. The structures each have a body that supports piezoelectric islands. The piezoelectric islands have a first surface and a second opposite surface. The piezoelectric islands can be formed, in part, by forming cuts into a thick layer of piezoelectric material, attaching the cut piezoelectric layer to a body having etched features and grinding the piezoelectric layer to a thickness that is less than the depths of the cuts. Conductive material can be formed on the piezoelectric layer to form electrodes.
摘要翻译： 描述了具有压电致动器结构的微机电系统。 每个结构都具有支撑压电岛的主体。 压电岛具有第一表面和第二相对表面。 压电岛可以部分地通过形成切割成厚的压电材料层而形成，将切割的压电层附接到具有蚀刻特征的主体并且将压电层研磨到小于切口深度的厚度。 可以在压电层上形成导电材料以形成电极。
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公开(公告)号：US20110242168A1
公开(公告)日：2011-10-06
申请号：US13120593
申请日：2009-08-17
申请人： Andreas Bibl , Christoph Menzel
发明人： Andreas Bibl , Christoph Menzel
IPC分类号： B41J29/38
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1629 , B41J2/1634
摘要： A voltage is applied to an electrode positioned in contact with a piezoelectric layer, the electrode having a surface area. A deflection of the piezoelectric layer is measured in response to the applied voltage. The surface area of the electrode is reduced based at least in part on the measured deflection. Reducing the surface area of the electrode reduces the actuated area of the piezoelectric layer.
摘要翻译： 电压施加到与压电层接触的电极，电极具有表面积。 响应于施加的电压来测量压电层的偏转。 至少部分地基于测量的偏转减小电极的表面积。 减小电极的表面积减小了压电层的致动面积。
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公开(公告)号：US07997684B2
公开(公告)日：2011-08-16
申请号：US12271707
申请日：2008-11-14
申请人： Kevin von Essen , Antai Xu , Andreas Bibl , John A. Higginson
发明人： Kevin von Essen , Antai Xu , Andreas Bibl , John A. Higginson
CPC分类号： B41J2/14072 , B41J2002/14491 , H05K1/118 , H05K1/189 , H05K2201/053 , H05K2201/10689
摘要： A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.
摘要翻译： 用于打印头组件内并将打印头主体连接到外部电路的柔性电路包括具有一层或多层导电材料并且具有基本上平行于打印头主体顶表面的顶表面的基本上平面的部分。 一个或多个集成电路可以安装在平面部分上。 多个引线从每个集成电路延伸，引线电连接到打印头主体。 一个或多个臂附接到并且基本上垂直于平面部分，每个臂包括被配置为连接到外部电路的一个或多个外部连接器。
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公开(公告)号：US20110007117A1
公开(公告)日：2011-01-13
申请号：US12833828
申请日：2010-07-09
IPC分类号： B41J2/045
CPC分类号： B41J2/1433 , B05B12/04 , B41J2/1404 , B41J2/14056 , B41J2/14233 , B41J2002/14241 , B41J2002/14491 , B41J2202/12
摘要： A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.
摘要翻译： 流体喷射器包括具有衬底和与衬底分离的层的流体喷射模块。 衬底包括布置成矩阵的多个流体喷射元件，每个流体喷射元件构造成使得流体从喷嘴喷出。 与衬底分离的层包括多个电连接，每个电连接与相应的流体喷射元件相邻。
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公开(公告)号：US20100141713A1
公开(公告)日：2010-06-10
申请号：US12607778
申请日：2009-10-28
CPC分类号： B41J2/14233 , B41J2002/14241 , B41J2002/14403 , B41J2002/14491 , B41J2202/12 , H01H85/046 , H01H85/10
摘要： Systems and apparatus for ejecting fluid. A fluid injection apparatus includes a fluid ejector unit for ejecting a droplet of fluid, an integrated circuit, and a conductive trace electrically coupling the fluid ejector unit and the integrated circuit. A portion of the conductive trace includes a fuse.
摘要翻译： 用于喷射流体的系统和装置。 流体注射装置包括用于喷射液滴的流体喷射器单元，集成电路和电耦合流体喷射器单元和集成电路的导电迹线。 导电迹线的一部分包括保险丝。
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公开(公告)号：US20100110144A1
公开(公告)日：2010-05-06
申请号：US12606712
申请日：2009-10-27
申请人： Andreas Bibl , Jeffrey Birkmeyer
发明人： Andreas Bibl , Jeffrey Birkmeyer
CPC分类号： B41J2/1606 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1646
摘要： A nozzle layer is described that has a semiconductor body having a first surface, a second surface opposing the first surface, and a nozzle formed through the body connecting the first and second surfaces, wherein the nozzle being configured to eject fluid through a nozzle outlet on the second surface, and a metal layer around the outlet on the second surface and at least partially inside the nozzle, the metal layer inside the nozzle being completely exposed.
摘要翻译： 描述了具有半导体本体的喷嘴层，其具有第一表面，与第一表面相对的第二表面，以及通过连接第一和第二表面的主体形成的喷嘴，其中喷嘴构造成通过喷嘴出口喷射流体 第二表面和在第二表面上的出口周围并且至少部分地在喷嘴内部的金属层，喷嘴内部的金属层被完全暴露。
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公开(公告)号：US07686424B2
公开(公告)日：2010-03-30
申请号：US11962776
申请日：2007-12-21
IPC分类号： B41J2/04
CPC分类号： B41J2/1628 , B41J2/14 , B41J2/16 , B41J2/1629 , B41J2/1631 , B41J2/1632
摘要： Devices used to degas and eject fluid drops are disclosed. Devices include a flow path that includes a pumping chamber in which fluid is pressurized for ejection of a fluid drop, and a semi-permeable membrane including an inorganic material having an outer surface positioned in fluid contact with the flow path. The membrane allows gases to pass therethrough, while preventing liquids from passing therethrough.
摘要翻译： 公开了用于对液滴进行脱气和喷射的装置。 设备包括流路，其包括泵送室，其中流体被加压以喷射液滴;以及半透膜，其包括具有与流动路径流体接触的外表面的无机材料。 该膜允许气体通过，同时防止液体通过。
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公开(公告)号：US07681307B2
公开(公告)日：2010-03-23
申请号：US11775817
申请日：2007-07-10
申请人： Jeffrey Birkmeyer , Andreas Bibl
发明人： Jeffrey Birkmeyer , Andreas Bibl
CPC分类号： B41J2/1623 , B41J2/14233 , B41J2/161 , B41J2/1628 , B41J2/1631 , B41J2/1642 , B41J2/1646 , B41J2002/14491 , H05K3/3452 , H05K3/363 , H05K2201/2081 , H05K2203/0315 , Y10T29/42 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： Techniques are provided for controlling solder flow in applications where a flexible circuit is soldered to a microelectromechanical structure. A metal layer is formed on a substrate. A solder mask is formed on the metal layer such that portions of the metal layer are covered by the mask and portions are left exposed. A flexible circuit is soldered to the metal layer in at least some of the areas where the metal layer is exposed.
摘要翻译： 提供了用于在将柔性电路焊接到微机电结构的应用中控制焊料流动的技术。 在基板上形成金属层。 在金属层上形成焊锡掩模，使得金属层的一部分被掩模覆盖，部分露出。 在暴露金属层的至少一些区域中，将柔性电路焊接到金属层。
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