Fluid droplet ejection systems having recirculation passages
    2.
    发明授权
    Fluid droplet ejection systems having recirculation passages 有权
    具有再循环通道的液滴喷射系统

    公开(公告)号:US08534807B2

    公开(公告)日:2013-09-17

    申请号:US12991591

    申请日:2009-05-21

    IPC分类号: B41J2/17

    摘要: A system for ejecting droplets of a fluid is described. The system includes a substrate having a flow path body that includes a fluid pumping chamber, a descender fluidically connected to the fluid pumping chamber, and a nozzle fluidically connected to the descender. The nozzle is arranged to eject droplets of fluid through an outlet formed in an outer substrate surface. The flow path body also includes a recirculation passage fluidically connected to the descender. The system for ejecting droplets of a fluid also includes a fluid supply tank fluidically connected to the fluid pumping chamber, a fluid return tank fluidically connected to the recirculation passage, and a pump fluidically connecting the fluid return tank and the fluid supply tank. In some implementations, a flow of fluid through the flow path body is at a flow rate sufficient to force air bubbles or contaminants through the flow path body.

    摘要翻译: 描述了用于喷射液体的液滴的系统。 该系统包括具有流路主体的基板,该流路主体包括流体泵送室,与流体泵送室流体连接的下降器以及与下降器流体连接的喷嘴。 喷嘴被布置成通过形成在外部基板表面中的出口喷射流体液滴。 流路主体还包括与下降器流体连接的再循环通道。 用于喷射流体液滴的系统还包括流体连接到流体泵送室的流体供应罐,流体连接到再循环通道的流体回流罐和流体连接流体回流罐和流体供应罐的泵。 在一些实施方式中,通过流路主体的流体流是足以迫使气泡或污染物通过流路主体的流速。

    Physical vapor deposition with multi-point clamp
    3.
    发明授权
    Physical vapor deposition with multi-point clamp 有权
    物理气相沉积与多点夹

    公开(公告)号:US08133362B2

    公开(公告)日:2012-03-13

    申请号:US12714409

    申请日:2010-02-26

    IPC分类号: C23C14/34

    摘要: A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.

    摘要翻译: 物理气相沉积装置包括具有侧壁的真空室,真空室内部的阴极,其中阴极被配置为包括溅射靶,配置为向阴极施加电力的射频电源,内部并电连接的阳极 到真空室的侧壁,卡盘位于真空室的侧壁内并与真空室的侧壁电隔离,卡盘被配置为支撑基板,夹具被配置为将基板保持在卡盘上,其中夹具是导电的, 以及附接到所述夹具的多个导电电极,每个电极构造成当与所述基板接触时被压缩。

    Determining Whether A Flow Path Is Ready For Ejecting A Drop
    5.
    发明申请
    Determining Whether A Flow Path Is Ready For Ejecting A Drop 有权
    确定流路是否准备好弹出一滴

    公开(公告)号:US20120001966A1

    公开(公告)日:2012-01-05

    申请号:US12829288

    申请日:2010-07-01

    IPC分类号: B41J29/38

    摘要: A method of determining whether a flow path is ready for ejection includes supplying liquid to the flow path, which includes a pumping chamber and a nozzle, after supplying fluid to the flow path, applying energy to an actuator adjacent to the pumping chamber, measuring an electrical characteristic of the actuator to obtain a measured value, and comparing the measured value to a threshold value to determine if the flow path is ready for ejection.

    摘要翻译: 确定流动路径是否准备好用于喷射的方法包括在向流路供应流体之后向包括泵送室和喷嘴的流路供应液体,向靠近泵送室的致动器施加能量,测量 执行器的电特性以获得测量值,并将测量值与阈值进行比较,以确定流动路径是否准备好用于喷射。

    Physical Vapor Deposition With Multi-Point Clamp
    6.
    发明申请
    Physical Vapor Deposition With Multi-Point Clamp 有权
    物理气相沉积与多点夹

    公开(公告)号:US20110209984A1

    公开(公告)日:2011-09-01

    申请号:US12714409

    申请日:2010-02-26

    IPC分类号: C23C14/34

    摘要: A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.

    摘要翻译: 物理气相沉积装置包括具有侧壁的真空室,真空室内部的阴极,其中阴极被配置为包括溅射靶,配置为向阴极施加电力的射频电源,内部并电连接的阳极 到真空室的侧壁,卡盘位于真空室的侧壁内并与真空室的侧壁电隔离,卡盘被配置为支撑基板,夹具被配置为将基板保持在卡盘上,其中夹具是导电的, 以及附接到所述夹具的多个导电电极,每个电极构造成当与所述基板接触时被压缩。

    Determining whether a flow path is ready for ejecting a drop
    9.
    发明授权
    Determining whether a flow path is ready for ejecting a drop 有权
    确定流路是否准备好弹出液滴

    公开(公告)号:US08556364B2

    公开(公告)日:2013-10-15

    申请号:US12829288

    申请日:2010-07-01

    IPC分类号: B41J29/38

    摘要: A method of determining whether a flow path is ready for ejection includes supplying liquid to the flow path, which includes a pumping chamber and a nozzle, after supplying fluid to the flow path, applying energy to an actuator adjacent to the pumping chamber, measuring an electrical characteristic of the actuator to obtain a measured value, and comparing the measured value to a threshold value to determine if the flow path is ready for ejection.

    摘要翻译: 确定流动路径是否准备好用于喷射的方法包括在向流路供应流体之后向包括泵送室和喷嘴的流路供应液体,向靠近泵送室的致动器施加能量,测量 执行器的电特性以获得测量值,并将测量值与阈值进行比较,以确定流动路径是否准备好用于喷射。