摘要:
A depletion mode MOSFET and resistor are fabricated as a silicon carbide (SiC) integrated circuit (IC). The SiC IC includes a first SiC layer doped to a first conductivity type and a second SiC layer overlaid on the first SiC layer and doped to a second conductivity type. The second SiC layer includes at least four more heavily doped regions of the second conductivity type, with two of such regions comprising MOSFET source and drain electrodes and two other of such regions comprising resistor electrodes. The second SiC layer includes an isolation trench between the MOSFET electrodes and the resistor electrodes. At least two electrically conductive contacts are provided as MOSFET electrode contacts, each being positioned over at least a portion of a respective MOSFET electrode and two other electrically conductive contacts are provided as resistor electrode contacts, each being positioned over at least a portion of a respective resistor electrode. An oxide layer extends over the second SiC layer with at least a portion of the oxide layer positioned between the MOSFET electrode contacts. A MOSFET gate electrode is positioned over the oxide layer, and coupling means are provided for electrically couping one of the source, drain, and gate electrodes to one of the resistor electrodes.
摘要翻译:耗尽型MOSFET和电阻器被制造为碳化硅(SiC)集成电路(IC)。 SiC IC包括掺杂到第一导电类型的第一SiC层和覆盖在第一SiC层上并掺杂到第二导电类型的第二SiC层。 第二SiC层包括第二导电类型的至少四个更重掺杂区域,其中两个这样的区域包括MOSFET源极和漏极电极以及包括电阻器电极的另外两个这样的区域。 第二SiC层包括在MOSFET电极和电阻器电极之间的隔离沟槽。 提供至少两个导电触点作为MOSFET电极触点,每个至少两个导电触点位于相应MOSFET电极的至少一部分上方,并且另外两个导电触点设置为电阻器电极触点,每个触点都位于相应的至少一部分上 电阻电极。 氧化物层在第二SiC层上延伸,其中氧化物层的至少一部分位于MOSFET电极触点之间。 MOSFET栅电极位于氧化物层上方,并且提供耦合装置用于将源极,漏极和栅电极之一电耦合到电阻器电极之一。
摘要:
A silicon carbide (SiC) junction field effect transistor (JFET) device is fabricated upon a substrate layer, such as a p type conductivity SiC substrate, using ion implantation for the source and drain areas. A SiC p type conductivity layer is epitaxially grown on the substrate. A SiC n type conductivity layer is formed by ion implantation or epitaxial deposition upon the p type layer. The contacting surfaces of the p and n type layers form a junction. A p+ type gate area supported by the n type layer is formed either by the process of ion implantation or the process of depositing and patterning a second p type layer. The source and drain areas are heavily doped to n+ type conductivity by implanting donor ions in the n type layer.
摘要:
Combustion in a gas turbine is controlled through use of flame spectroscopy in order to achieve low NO.sub.x emissions in the exhaust. By monitoring the combustion flame in the turbine to determine intensity of non-infrared spectral lines, and dynamically adjusting the fuel/air ratio of the fuel mixture such that this intensity remains below a predetermined level associated with a desired low level of NO.sub.x emissions, the engine produces significantly reduced NO.sub.x emissions in its exhaust but at a sufficiently high combustion flame temperature to avoid any undue risk of flame-out, thereby assuring stable, safe and reliable operation.
摘要:
The linearity and dynamic range of a photodetector system is enhanced by providing real time cancellation of condition-dependent quiescent output signals from the photosensitive devices by provision of a condition-dependent output signal monitoring device which drives the input section of a current mirror having output sections connected to the active photosensitive devices to zero out the condition-dependent quiescent output signals of those photosensitive devices during system operation. Multiple output sections may be run from a single input section of the current mirror.
摘要:
A conductive member consisting of a first conductor of an alloy of titanium and tungsten and a second conductor of a refractory metal such as molybdenum is sintered to a conductive member of silicon of low resistivity to form a low resistance contact therewith.
摘要:
A method of making a composite conductive structure is described. The structure includes an insulating substrate on which is provided a conductor of a refractory metal substantially nonreactive with silicon dioxide covered by a layer of a silicide of the refractory metal and a layer of silicon dioxide. The method includes depositing a layer of polycrystalline silicon over the conductor and the insulating substrate, reacting the layer of polycrystalline silicon with the conductor to form a refractory metal silicide, removing the unreacted portion of the layer of polycrystalline silicon, and then oxidizing the exposed surface of the refractory metal silicide into a layer of silicon dioxide.